CN-122018731-A - Integrated single-point touch cover plate and preparation method thereof

Abstract

The invention discloses an integrated single-point touch cover plate and a preparation method thereof, the integrated single-point touch cover plate comprises a glass substrate, a silver paste wiring layer formed by direct printing is arranged on the back surface of the glass substrate, the silver paste wiring layer comprises at least one group of independent touch sensing units, signal wiring electrically connected with the touch sensing units and binding pad areas formed by gathering tail ends of the signal wiring, the touch sensing units comprise at least one touch pad, an ink shielding layer is further arranged on the back surface of the glass substrate, the ink shielding layer fully covers the surface of the silver paste wiring layer, and hollowed-out windows are arranged at corresponding positions of the binding pad areas only. According to the invention, single-point touch control can be realized by printing silver paste on the back surface of the glass substrate, an ITO sensor layer and an FPC touch key are omitted, the structure and the procedure are simplified, and the problems of visible circuit and poor air tightness are solved.

Inventors

• FENG WEIBIN
• LIU BAOCAI
• WU LIFENG
• TU YUJUAN

Assignees

• 东莞明崴电子科技有限公司

Dates

Publication Date

20260512

Application Date

20260319

Claims (10)

1. 1. The integrated single-point touch cover plate comprises a glass substrate and is characterized in that a silver paste wiring layer formed by direct printing is arranged on the back surface of the glass substrate, the silver paste wiring layer comprises at least one group of independent touch sensing units, signal wiring electrically connected with the touch sensing units and binding pad areas formed by gathering tail ends of the signal wiring, the touch sensing units comprise at least one touch pad, an ink shielding layer is further arranged on the back surface of the glass substrate, the ink shielding layer fully covers the surface of the silver paste wiring layer, and hollowed-out windows are formed in corresponding positions of the binding pad areas.
2. 2. The integrated single-touch cover plate of claim 1, wherein the touch pad is of a circular, triangular or shaped configuration.
3. 3. The integrated single-point touch cover plate according to claim 2, wherein a plurality of touch pads are provided, each touch pad is correspondingly connected with an independent signal wire, and the signal wires are insulated from each other and are not conducted with each other.
4. 4. The integrated single-point touch cover plate according to claim 1, wherein the PITCH, the line width and the line distance of the silver paste wiring layer are all larger than or equal to respective corresponding preset limit control values, and the back surface dyne value of the glass substrate is larger than 36mN/m.
5. 5. The integrated single-touch cover plate according to claim 1, wherein the binding pad area corresponds to a hollowed-out window of the ink shielding layer and is used for being in press-fit electrical connection with a flexible circuit board carrying a touch control chip.
6. 6. The integrated single-touch cover plate according to claim 5, wherein the ink shielding layer completely covers the touch pads and the signal traces of all the touch sensing units, and the binding pad area is exposed only through the hollowed-out window.
7. 7. A method for preparing an integrated single-point touch cover plate, which is used for preparing the integrated single-point touch cover plate according to any one of claims 1-6, and comprises the following steps: S1, cleaning and surface activating treatment are carried out on the back surface of a glass substrate; s2, printing conductive silver paste on the back surface of the glass substrate, and forming a silver paste wiring layer after curing treatment, wherein the silver paste wiring layer comprises at least one group of independent touch sensing units, signal wiring electrically connected with the touch sensing units and a binding pad area formed by gathering tail ends of the signal wiring; S3, printing shielding ink on the back surface of the glass substrate, and forming an ink shielding layer after curing treatment, wherein the ink shielding layer fully covers the surface of the silver paste wiring layer, and hollow windows are reserved only at the corresponding positions of the binding pad areas, so that the integrated single-point touch cover plate is manufactured.
8. 8. The method according to claim 7, wherein in the step S1, the surface-activated glass substrate has a back surface dyne value of more than 36mN/m, and the interval period from the completion of cleaning the glass substrate to printing of the conductive silver paste is controlled to be within 30 min.
9. 9. The method according to claim 7, wherein in the step S2, the PITCH, the line width and the line spacing of the silver paste routing layer are all controlled to be equal to or greater than respective corresponding preset limit control values, and the touch pads of the touch sensing units are arranged in a circular, triangular or special-shaped structure.
10. 10. The preparation method of the conductive silver paste according to claim 7, wherein in the step S2, a hot air curing process is adopted for curing the conductive silver paste, the curing temperature is 130-150 ℃, the curing time is 20-40 min, and in the step S3, a hot air curing process is adopted for curing the shielding ink, the curing temperature is 120-140 ℃, and the curing time is 15-30 min.

Description

Integrated single-point touch cover plate and preparation method thereof Technical Field The invention relates to the technical field of capacitive touch, in particular to an integrated single-point touch cover plate and a preparation method thereof. Background Capacitive touch screens are widely applied to various electronic devices with touch interaction functions such as consumer electronics, industrial control display and intelligent home by virtue of excellent interaction performance. Currently, a mainstream capacitive touch scheme generally adopts a three-layer stacked structure of a cover plate, an independent touch sensor and a flexible circuit board (FPC), wherein the touch sensor mainly adopts an Indium Tin Oxide (ITO) etching process to form a touch circuit, and transmission and processing of touch signals are realized through the FPC. CN201310241019a discloses a capacitive touch screen using copper-plated conductive base material, the scheme comprises sputtering copper foil on an independent conductive base material by a film plating process, forming copper film signal line patterns and transparent conductive film patterns on the conductive base material by dry film photoresist exposure, development and etching processes to obtain an independent touch sensor, and bonding the sensor with a cover plate by an optical double-sided adhesive tape to realize a touch function in cooperation with a flexible circuit board. According to the scheme, the copper plating film is used for replacing the traditional ITO material, so that the cost of raw materials is reduced to a certain extent, fine line width line spacing smaller than 50 mu m can be realized, and the design requirement of narrow-frame products is met. The scheme is still not separated from the traditional layered stacking structure, an independent sensor substrate layer is required to be arranged, the overall thickness and the structural complexity of the touch module are increased, the laminating process of the sensor and the cover plate is additionally required, the yield loss such as laminating bubbles and alignment deviation is easy to introduce, meanwhile, the scheme is still required to bind an independent Flexible Printed Circuit (FPC), the problems of light tightness of the module and poor air tightness after assembly caused by the FPC cannot be solved, in addition, the core process depends on vacuum sputtering and wet etching, the equipment investment is large, the process flow is long, the environmental protection cost is high, and the single-point touch scene requirements of low cost and simple flow cannot be adapted. CN201810910826a discloses a process for sputtering a bottom film of a touch screen, which constructs an orthogonal electromagnetic field in a vacuum plating chamber, and makes argon ions impact a target material through bright discharge ionization under a high vacuum environment, so that target material atoms deposit on the surface of the bottom film of the independent touch screen to form a uniform coating film, and the target material can be made of materials such as ITO, copper, aluminum and the like. The scheme mainly optimizes the coating uniformity, coating adhesion and substrate suitability of the touch base film, and overcomes part of defects of the traditional electroplating and vacuum evaporation process. The scheme is only optimized for a film coating link of the bottom film of the touch sensor, a traditional structural framework of an independent sensor bottom film and a cover plate is not separated, an independent sensor layer and a matched FPC are still required to be arranged, integrated integration of a touch function and the cover plate cannot be realized, the core problems of high cost, poor air tightness and complicated manufacturing procedure caused by a layered structure cannot be solved, meanwhile, the core process is vacuum sputtering, a high-vacuum environment and high-voltage starting equipment are required, the manufacturing process condition is severe, the production efficiency is low, and the requirement of large-scale low-cost production is difficult to meet. In summary, the existing touch technical scheme cannot solve the technical problems of high cost, poor air tightness and complicated manufacturing process caused by the fact that the conventional ITO etching circuit is visible, the layered stacking structure is complex, the independent sensor and the FPC are complex, and for a single-point touch scene with a simple structure and controllable cost, obvious performance and cost redundancy exist in the existing scheme, so that a technical scheme capable of realizing integration of a cover plate and a touch function, simplifying the structure and manufacturing process, reducing the production cost and optimizing the touch reliability is needed. Disclosure of Invention Aiming at the defects of the prior art, the invention has the core improvement thought that the layered stacking framework of