CN-122019922-A - Power consumption determining method and device and electronic equipment

Abstract

The application discloses a power consumption determining method, a device and electronic equipment, the method comprises the steps of obtaining a thermal resistance model, wherein the thermal resistance model comprises thermal resistance parameters of heat sources on a heat dissipation path of the electronic equipment, representing thermal coupling relations among the heat sources, determining preset leakage power consumption of the heat sources under preset temperature values based on the corresponding relations between the leakage power consumption and the temperatures of the heat sources under a target working scene, calculating the leakage temperature corresponding to the heat sources based on the preset leakage power consumption and the thermal resistance model, responding to continuously adjusting the preset temperature values, calculating the leakage temperature corresponding to the current preset temperature value until the difference value between the leakage temperature and the preset temperature value meets a temperature difference condition, determining that the current leakage temperature is a steady-state temperature, and obtaining total power consumption of the heat sources under the target working scene based on the working parameters of the heat sources corresponding to the target working scene, wherein the total power consumption comprises the leakage power consumption and dynamic power consumption of the heat sources during working.

Inventors

• LIU QIAN

Assignees

• 鼎道智芯(上海)半导体有限公司

Dates

Publication Date

20260512

Application Date

20260130

Claims (10)

1. 1. A power consumption determination method, comprising: acquiring a thermal resistance model, wherein the thermal resistance model comprises thermal resistance parameters of each heat source on a heat dissipation path of the electronic equipment, and represents a thermal coupling relation between the heat sources; Determining preset leakage power consumption of each heat source at a preset temperature value based on a corresponding relation between the leakage power consumption and the temperature of each heat source in a target working scene; calculating the leakage temperature corresponding to each heat source based on the preset leakage power consumption and the thermal resistance model; Responding to the preset temperature value, and calculating the leakage temperature corresponding to the current preset temperature value until the difference value between the leakage temperature and the preset temperature value meets the temperature difference condition, and determining that the current leakage temperature is a steady-state temperature; And obtaining the total power consumption of each heat source under the target working scene at the steady-state temperature based on the working parameters of each heat source corresponding to the target working scene, wherein the total power consumption comprises the leakage power consumption and the dynamic power consumption when the heat source works.
2. 2. The method of claim 1, wherein calculating the leakage temperature corresponding to each heat source based on the preset leakage power consumption and the thermal resistance model comprises: Determining the dynamic power consumption of each heat source under the preset temperature value based on the working parameters of each heat source corresponding to the target working scene; determining the current total power consumption of each heat source according to the dynamic power consumption and the preset leakage power consumption; Determining temperature rise parameters of the heat sources based on the thermal resistance model and the current total power consumption; and determining the electric leakage temperature of each heat source based on the temperature rise parameter and the preset temperature value.
3. 3. The method of claim 1, wherein the responding to the continuously adjusting the preset temperature value and calculating the leakage temperature corresponding to the current preset temperature value until the difference between the leakage temperature and the preset temperature value meets the temperature difference condition comprises: In each iteration process of adjusting the preset temperature value, taking the leakage temperature obtained by the last calculation as the preset temperature value of the next iteration; Re-executing the steps of determining the preset leakage power consumption of each heat source under the preset temperature value and calculating the leakage temperature corresponding to each heat source; Calculating to obtain a difference value between the current leakage temperature and a current preset temperature value; And when the difference value meets the temperature difference condition, exiting the iterative processing.
4. 4. The method of claim 1, wherein the responding to the continuously adjusting the preset temperature value and calculating the leakage temperature corresponding to the current preset temperature value until the difference between the leakage temperature and the preset temperature value meets the temperature difference condition comprises: In each iteration process of adjusting the preset temperature value, calculating and obtaining the difference between the current leakage temperature and the preset temperature value; determining an adjustment direction and an adjustment amplitude for the preset temperature value based on the difference value; Updating the preset temperature value according to the adjustment direction and the adjustment amplitude; re-executing the steps of determining the preset leakage power consumption of each heat source under the preset temperature value and calculating the leakage temperature corresponding to each heat source based on the updated preset temperature value; Calculating to obtain a difference value between the current leakage temperature and a current preset temperature value; And when the difference value meets the temperature difference condition, exiting the iterative processing.
5. 5. The method of claim 1, wherein the obtaining, based on the operation parameters of the heat sources corresponding to the target operation scenario, the total power consumption of the heat sources in the target operation scenario at the steady-state temperature includes: Determining the working mode of each heat source based on the target working scene; Determining working parameters of the heat sources according to the working modes of the heat sources; determining the dynamic power consumption of each heat source when working at the steady-state temperature according to the working parameters of each heat source; and obtaining the total power consumption of each heat source in the target working scene at the steady-state temperature based on the leakage power consumption and the dynamic power consumption of each heat source at the steady-state temperature.
6. 6. The method of claim 1, further comprising: Generating a temperature and leakage power consumption record table based on the steady-state temperature and the leakage power consumption of each heat source at the steady-state temperature; And responding to a target query request, and querying in the temperature and leakage power consumption record table to obtain target leakage power consumption corresponding to the target query request, wherein the target query request represents a target steady-state temperature value to be queried.
7. 7. The method of claim 1, further comprising: determining the thermal design power consumption of the electronic equipment based on the total power consumption of each heat source in the target working scene at the steady-state temperature; and generating a heat dissipation scheme of the electronic equipment based on the thermal design power consumption.
8. 8. The method of claim 7, the generating a heat dissipation scheme for the electronic device based on the thermal design power consumption, comprising: determining heat dissipation requirements of each heat source based on the thermal design power consumption and the steady-state temperature; And determining a heat dissipation scheme of the electronic equipment based on the association relation of each heat source in the thermal resistance model and the heat dissipation requirement of each heat source.
9. 9. A power consumption determining apparatus comprising: The first acquisition unit is used for acquiring a thermal resistance model, wherein the thermal resistance model comprises thermal resistance parameters of each heat source on a heat dissipation path of the electronic equipment, and represents the thermal coupling relation among the heat sources; The first determining unit is used for determining preset leakage power consumption of each heat source under a preset temperature value based on the corresponding relation between the leakage power consumption and the temperature of each heat source under a target working scene; the calculation unit is used for calculating the leakage temperature corresponding to each heat source based on the preset leakage power consumption and the thermal resistance model; The second determining unit is used for responding to the preset temperature value, calculating the leakage temperature corresponding to the current preset temperature value until the difference value between the leakage temperature and the preset temperature value meets the temperature difference condition, and determining that the current leakage temperature is the steady-state temperature; The second obtaining unit is used for obtaining total power consumption of each heat source in the target working scene at the steady-state temperature based on the working parameters of each heat source corresponding to the target working scene, wherein the total power consumption comprises the leakage power consumption and the dynamic power consumption when the heat source works.
10. 10. An electronic device, comprising: A heat source module comprising at least one heat source; the memory is used for storing a computer program and a thermal resistance model, wherein the thermal resistance model comprises thermal resistance parameters of each heat source on a heat dissipation path of the electronic equipment and represents the thermal coupling relation among the heat sources; A processor for executing the computer program to implement: acquiring a thermal resistance model, wherein the thermal resistance model comprises thermal resistance parameters of each heat source on a heat dissipation path of electronic equipment; Determining preset leakage power consumption of each heat source at a preset temperature value based on a corresponding relation between the leakage power consumption and the temperature of each heat source in a target working scene; calculating the leakage temperature corresponding to each heat source based on the preset leakage power consumption and the thermal resistance model; Responding to the preset temperature value, and calculating the leakage temperature corresponding to the current preset temperature value until the difference value between the leakage temperature and the preset temperature value meets the temperature difference condition, and determining that the current leakage temperature is a steady-state temperature; And obtaining the total power consumption of each heat source under the target working scene at the steady-state temperature based on the working parameters of each heat source corresponding to the target working scene, wherein the total power consumption comprises the leakage power consumption and the dynamic power consumption when the heat source works.

Description

Power consumption determining method and device and electronic equipment Technical Field The present application relates to the field of data processing technologies, and in particular, to a method and an apparatus for determining power consumption, and an electronic device. Background With the development of integrated circuits, the proportion of the Leakage Power consumption (Leakage Power) of the chip in the total Power consumption is significantly increased, and especially under advanced process nodes, the Leakage Power consumption has become a key factor affecting the thermal design and Power consumption management of the chip. The leakage power consumption has strong temperature dependence, and increases exponentially with the rise of junction temperature, and the increase of power consumption can lead to the rise of temperature. The leakage power consumption refers to power consumption generated due to leakage characteristics of a transistor when the chip is in an inactive state (e.g., standby or off mode). The junction temperature (Junction Temperature) refers to the temperature of a PN junction (a basic structure in a semiconductor device, such as an emitter junction, a collector junction, etc. of a transistor) inside a semiconductor chip. In the heat dissipation design stage of electronic devices (such as mobile terminals, servers and the like), engineers need to accurately acquire power consumption data of chips under different working scenes, including dynamic power consumption and leakage power consumption, so as to design a reasonable heat dissipation scheme. However, due to the interdependence between the leakage power consumption and the junction temperature, the steady-state temperature under the actual working condition is difficult to accurately determine by the related method, so that the leakage power consumption is inaccurate, and finally, the heat dissipation design is deviated, and the reliability and the performance of the electronic equipment are affected. Disclosure of Invention In view of this, the present application provides the following technical solutions: a power consumption determination method, comprising: acquiring a thermal resistance model, wherein the thermal resistance model comprises thermal resistance parameters of each heat source on a heat dissipation path of the electronic equipment, and represents a thermal coupling relation between the heat sources; Determining preset leakage power consumption of each heat source at a preset temperature value based on a corresponding relation between the leakage power consumption and the temperature of each heat source in a target working scene; calculating the leakage temperature corresponding to each heat source based on the preset leakage power consumption and the thermal resistance model; Responding to the preset temperature value, and calculating the leakage temperature corresponding to the current preset temperature value until the difference value between the leakage temperature and the preset temperature value meets the temperature difference condition, and determining that the current leakage temperature is a steady-state temperature; And obtaining the total power consumption of each heat source under the target working scene at the steady-state temperature based on the working parameters of each heat source corresponding to the target working scene, wherein the total power consumption comprises the leakage power consumption and the dynamic power consumption when the heat source works. Optionally, the calculating, based on the preset leakage power consumption and the thermal resistance model, the leakage temperature corresponding to each heat source includes: Determining the dynamic power consumption of each heat source under the preset temperature value based on the working parameters of each heat source corresponding to the target working scene; determining the current total power consumption of each heat source according to the dynamic power consumption and the preset leakage power consumption; Determining temperature rise parameters of the heat sources based on the thermal resistance model and the current total power consumption; and determining the electric leakage temperature of each heat source based on the temperature rise parameter and the preset temperature value. Optionally, the responding to continuously adjusting the preset temperature value and calculating the leakage temperature corresponding to the current preset temperature value until the difference between the leakage temperature and the preset temperature value meets the temperature difference condition includes: In each iteration process of adjusting the preset temperature value, taking the leakage temperature obtained by the last calculation as the preset temperature value of the next iteration; Re-executing the steps of determining the preset leakage power consumption of each heat source under the preset temperature value and calculating the lea