CN-122021076-A - Heat dissipation simulation method and device of charge-discharge equipment and electronic equipment

CN122021076ACN 122021076 ACN122021076 ACN 122021076ACN-122021076-A

Abstract

The embodiment of the application provides a heat dissipation simulation method and device of charge and discharge equipment and electronic equipment, wherein the charge and discharge equipment comprises an air duct, a power supply single board and a plurality of charge and discharge storage positions; and determining target heat dissipation design parameters of the charge and discharge equipment according to the target air channel structure parameters, the target power supply single board heat dissipation parameters, the target single-bin heat dissipation parameters and the multi-bin integrated model. By the technical scheme, simulation accuracy and design efficiency can be improved, and reliable heat dissipation and stable operation of the charging and discharging equipment are ensured.

Inventors

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Assignees

珠海泰坦新动力电子有限公司

Dates

Publication Date: 20260512
Application Date: 20260413

Claims (10)

1. The heat dissipation simulation method of the charge and discharge equipment is characterized in that the charge and discharge equipment comprises an air duct, a power supply single board and a plurality of charge and discharge storage positions, the air duct comprises an air duct body, a guide plate and a heat preservation layer, the power supply single board comprises a plurality of power devices and a Printed Circuit Board (PCB), the charge and discharge storage positions comprise a battery pack, a storage position frame and a heat dissipation channel, and the battery pack is arranged on the storage position frame, and the method comprises the following steps: Acquiring an air duct model, a power supply single board model, a single-bin model and a multi-bin integrated model, wherein the air duct model is used for simulating the air duct, the power supply single board model is used for simulating the power supply single board, the single-bin model is used for simulating one charge-discharge bin of the plurality of charge-discharge bins, and the multi-bin integrated model is used for simulating the charge-discharge equipment and is formed by assembling a plurality of single-bin models, the power supply single board models and the air duct models; Respectively simulating the air duct model, the power supply single board model and the single-bin model to obtain target air duct structural parameters of the air duct, target power supply single board heat dissipation parameters of the power supply single board and target single-bin heat dissipation parameters of the charge and discharge bins; And determining target heat dissipation design parameters of the charge and discharge equipment according to the target air duct structure parameters, the target power supply single board heat dissipation parameters, the target single-bin heat dissipation parameters and the multi-bin integrated model.
2. The method of claim 1, wherein determining the target heat dissipation design parameters of the charge and discharge device based on the target air duct structural parameters, the target power supply board heat dissipation parameters, the target single-bank heat dissipation parameters, and the multi-bank integrated model comprises: Simulating the multi-bin integrated model based on the target air duct structure parameter, the target power supply single board heat dissipation parameter and the target single-bin heat dissipation parameter to obtain a target multi-bin coordination parameter of the charging and discharging equipment, wherein the multi-bin coordination parameter is a parameter for representing the coupling relation of each component in the air duct, the power supply single board and the plurality of charging and discharging bins; Inputting a plurality of parameters including the target air duct structure parameter, the target power supply single board heat dissipation parameter, the target single-bank heat dissipation parameter and the target multi-bank coordination parameter into the multi-bank integrated model, and performing verification simulation on the multi-bank integrated model to obtain the target heat dissipation design parameter.
3. The method of claim 2, wherein inputting the plurality of parameters including the target duct structure parameter, the target power board heat dissipation parameter, the target single-bin heat dissipation parameter, and the target multi-bin coordination parameter into the multi-bin integrated model, performing verification simulation on the multi-bin integrated model to obtain the target heat dissipation design parameter, comprises: performing verification simulation on the multi-library integrated model under each working condition, and outputting simulation results of each working condition, wherein the simulation results comprise sub-simulation results corresponding to various parameters in the various parameters; and if the simulation result of each working condition meets the design requirement corresponding to each working condition, determining the multiple parameters as the target heat dissipation design parameters.
4. A method according to claim 3, characterized in that the method further comprises: If at least one sub-simulation result of the simulation result in any working condition does not meet the corresponding design requirement, adjusting parameters of at least one model corresponding to the at least one sub-simulation result to obtain adjusted parameters of each model, wherein the at least one model comprises at least one of a multi-bin integrated model, the air duct model, the power supply single board model and the single-bin model; Inputting the adjusted parameters of the at least one model and the parameters of the models except the at least one model into the multi-library integrated model, and performing verification simulation on the multi-library integrated model to obtain the target heat dissipation design parameters, or, And inputting the adjusted parameters of the at least one model into the multi-bin integrated model, and performing verification simulation on the multi-bin integrated model to obtain the target heat dissipation design parameters, wherein the at least one model comprises the multi-bin integrated model, the air duct model, the power supply single board model and the single-bin model.
5. The method of claim 2, wherein simulating the multi-bin integrated model based on the target duct structure parameter, the target power supply board heat dissipation parameter, and the target single-bin heat dissipation parameter to obtain the target multi-bin coordination parameter of the charge and discharge device comprises: Acquiring a first heat dissipation boundary condition of the multi-bin integrated model; and under the first heat dissipation boundary condition, simulating the multi-bin integrated model based on the target air channel structural parameter, the target power supply single board heat dissipation parameter and the target single-bin heat dissipation parameter to obtain the target multi-bin coordination parameter of the charge and discharge equipment.
6. The method of claim 5, wherein the simulating the multi-bin integrated model based on the target duct structure parameter, the target power supply board heat dissipation parameter, and the target single-bin heat dissipation parameter under the first heat dissipation boundary condition to obtain the target multi-bin coordination parameter of the charging and discharging device comprises: Under the first heat dissipation boundary condition, carrying out multi-group simulation on the multi-library integrated model based on the target air channel structural parameter, the target power supply single board heat dissipation parameter and the target single-library heat dissipation parameter to obtain multi-group parameter values corresponding to multi-group simulation processes; determining a group of parameter values from a plurality of groups of parameter values corresponding to a plurality of groups of simulation processes as the target multi-bin coordination parameters; Each set of simulation procedures includes: And taking a target value of any one parameter of the multi-bin coordination parameters as a quantification and other parameters as variables, and performing at least one simulation on the multi-bin integrated model until a simulation result of the multi-bin integrated model meets multi-bin design conditions, so as to obtain a group of parameter values of the multi-bin coordination parameters meeting the multi-bin design conditions.
7. The method of claim 1, wherein the determining of the target single bin heat dissipation parameter comprises: Acquiring a second heat dissipation boundary condition of the single-bin model; and under the second heat dissipation boundary condition, simulating the single-bin model based on the target power supply single-board heat dissipation parameters to obtain the target single-bin heat dissipation parameters of the charge and discharge bin.
8. The method according to any one of claims 2 to 7, wherein, The target duct structural parameters include at least one of a size of an air inlet of the duct, a size of an air outlet, an angle of the baffle, a diameter of a branched duct of the duct, and a length of the duct, and/or, The target power supply single board heat dissipation parameters comprise at least one of layout of the power devices, heat dissipation pad area, copper foil thickness of the PCB, heat conduction coefficient of heat conduction paste of the power devices and the PCB, and/or, The target single-bin heat dissipation parameters comprise at least one of the arrangement space of the batteries in the battery pack, the width of the heat dissipation channel, the connection mode of the charge-discharge bin and the air duct, the heat conductivity coefficient of the batteries in the battery pack and the bin frame, and/or, The target multi-bin coordination parameters of the charging and discharging equipment comprise at least one of connection angles of each charging and discharging bin and the air duct, relative positions of the power supply single board and the charging and discharging bin, air distribution proportion of the branch air duct, and matching relation between air speed of the air inlet and heating power of each charging and discharging bin.
9. The heat dissipation simulation device of the charge and discharge equipment is characterized in that the charge and discharge equipment comprises an air duct, a power supply single board and a plurality of charge and discharge storage positions, the air duct comprises an air duct body, a guide plate and a heat preservation layer, the power supply single board comprises a plurality of power devices and a Printed Circuit Board (PCB), the charge and discharge storage positions comprise a battery pack, a storage position frame and a heat dissipation channel, the battery pack is mounted on the storage position frame, and the device comprises: The system comprises an acquisition module, a control module and a control module, wherein the acquisition module is used for acquiring an air duct model, a power supply single board model, a single-bin model and a multi-bin integrated model, the air duct model is used for simulating the air duct, the power supply single board model is used for simulating the power supply single board, the single-bin model is used for simulating one charge and discharge bin of the plurality of charge and discharge bins, and the multi-bin integrated model is used for simulating the charge and discharge equipment and is formed by assembling a plurality of single-bin models, the power supply single board models and the air duct model; The simulation module is used for respectively simulating the air duct model, the power supply single board model and the single-bin model to obtain target air duct structural parameters of the air duct, target power supply single board heat dissipation parameters of the power supply single board and target single-bin heat dissipation parameters of the charge and discharge bins; And the determining module is used for determining the target heat dissipation design parameters of the charging and discharging equipment according to the target air duct structure parameters, the target power supply single board heat dissipation parameters, the target single-bin heat dissipation parameters and the multi-bin integrated model.
10. An electronic device comprising a processor and a memory, the memory storing a computer program, the processor implementing the steps of the method of any one of claims 1-8 when the computer program is executed.

Description

Heat dissipation simulation method and device of charge-discharge equipment and electronic equipment Technical Field The present application relates to the field of heat dissipation design and simulation technologies of charge and discharge devices, and in particular, to a heat dissipation simulation method and apparatus for a charge and discharge device, and an electronic device. Background The integrated charging and discharging equipment is internally provided with a plurality of charging and discharging storage positions, can realize simultaneous charging and discharging management of a plurality of groups of batteries, and is widely applied to scenes such as energy storage power stations, new energy batteries and capacity-dividing production equipment. In the charging and discharging process, a large amount of heat can be generated by the power device of the power supply single board and the battery in the storage position, if the heat dissipation design is unreasonable, the local temperature is too high, the temperature among the storage positions is uneven, and further the working stability, the service life and the charging and discharging efficiency of the charging and discharging equipment are affected. Therefore, how to improve the accuracy and the simulation efficiency of the heat dissipation simulation is a problem to be solved. Disclosure of Invention The embodiment of the application provides a heat dissipation simulation method and device of charge and discharge equipment and electronic equipment, which can improve heat dissipation simulation precision and simulation efficiency. The embodiment of the first aspect of the application provides a heat dissipation simulation method of charge-discharge equipment, which comprises an air duct, a power supply single board and a plurality of charge-discharge storage positions, wherein the air duct comprises an air duct body, a guide plate and a heat insulation layer, the power supply single board comprises a plurality of power devices and a Printed Circuit Board (PCB), the charge-discharge storage positions comprise a battery pack, a storage position frame and a heat dissipation channel, and the battery pack is arranged on the storage position frame, and the method comprises the following steps: Acquiring an air duct model, a power supply single board model, a single-bin model and a multi-bin integrated model, wherein the air duct model is used for simulating the air duct, the power supply single board model is used for simulating the power supply single board, the single-bin model is used for simulating one charge-discharge bin of the plurality of charge-discharge bins, and the multi-bin integrated model is used for simulating the charge-discharge equipment and is formed by assembling a plurality of single-bin models, the power supply single board models and the air duct models; Respectively simulating the air duct model, the power supply single board model and the single-bin model to obtain target air duct structural parameters of the air duct, target power supply single board heat dissipation parameters of the power supply single board and target single-bin heat dissipation parameters of the charge and discharge bins; And determining target heat dissipation design parameters of the charge and discharge equipment according to the target air duct structure parameters, the target power supply single board heat dissipation parameters, the target single-bin heat dissipation parameters and the multi-bin integrated model. In some possible embodiments, the determining the target heat dissipation design parameter of the charge and discharge device according to the target air duct structure parameter, the target power supply board heat dissipation parameter, the target single-bank heat dissipation parameter, and the multi-bank integrated model includes: Simulating the multi-bin integrated model based on the target air duct structure parameter, the target power supply single board heat dissipation parameter and the target single-bin heat dissipation parameter to obtain a target multi-bin coordination parameter of the charging and discharging equipment, wherein the multi-bin coordination parameter is a parameter for representing the coupling relation of each component in the air duct, the power supply single board and the plurality of charging and discharging bins; Inputting a plurality of parameters including the target air duct structure parameter, the target power supply single board heat dissipation parameter, the target single-bank heat dissipation parameter and the target multi-bank coordination parameter into the multi-bank integrated model, and performing verification simulation on the multi-bank integrated model to obtain the target heat dissipation design parameter. In some possible embodiments, the inputting the multiple parameters including the target air duct structure parameter, the target power supply board heat dissipation parameter, the target