CN-122021087-A - Method and related device for estimating two-dimensional plane value of semiconductor device

CN122021087ACN 122021087 ACN122021087 ACN 122021087ACN-122021087-A

Abstract

The application discloses a method for estimating the two-dimensional plane value of a semiconductor device and a related device, wherein the method for estimating the two-dimensional plane value of the semiconductor device comprises the steps of constructing a cutting straight line segment penetrating through a two-dimensional grid; the method comprises the steps of calculating position information of intersection points of a cutting straight line segment and a two-dimensional grid, estimating physical information of the intersection points, constructing a function model of the cutting straight line segment based on the position information and the physical information of the intersection points, wherein the function model is used for describing the relation between the physical information and the position information of any point on the cutting straight line segment, and estimating the physical information of any point on the cutting straight line segment based on the function model. The method can more rapidly estimate the numerical value of the specific point on the data grid of the semiconductor device under the same grid density, and is helpful for helping a user to rapidly obtain the specific numerical value of the data point in the performance analysis and defect detection of the semiconductor device.

Inventors

JIANG YUANCHENG
GONG DING
MEI JIAOJIAO

Assignees

上海培风图南半导体有限公司

Dates

Publication Date: 20260512
Application Date: 20241030

Claims (9)

1. A method for estimating a two-dimensional planar value of a semiconductor device, comprising: constructing a cutting straight line segment penetrating through a two-dimensional grid, wherein the two-dimensional grid is obtained by solving a two-dimensional surface model finite element of a target semiconductor device, and the position information and physical information of nodes of the two-dimensional grid are known; calculating the position information of the intersection point of the cutting straight line segment and the two-dimensional grid; estimating the physical information of the intersection points based on the position information and the physical information of the nodes of the two-dimensional grid and the position information of the intersection points; based on the position information and the physical information of the intersection point, constructing a function model of the cutting straight line segment, wherein the function model is used for describing the relationship between the physical information and the position information of any point on the cutting straight line segment; and estimating physical information of any point on the cutting straight line segment based on the function model.
2. The estimation method according to claim 1, wherein the physical information of the nodes of the two-dimensional network includes at least one of electric potential, electron concentration, hole concentration.
3. The estimation method according to claim 1, wherein the step of estimating the physical information of the intersection point based on the positional information and the physical information of the nodes of the two-dimensional grid and the positional information of the intersection point includes: acquiring position information and physical information of nodes at two ends of the grid line where the intersection point is located; constructing an interpolation function based on the position information and the physical information of the nodes at the two ends of the grid line; Substituting the position information of the intersection point into the interpolation function to obtain the physical information of the intersection point.
4. The estimation method of claim 3 wherein the interpolation function is a linear function or a nonlinear function.
5. The estimation method according to claim 1, wherein the step of constructing a function model of the cutting straight line segment based on the position information and the physical information of the intersection point includes: Respectively calculating reference distances of the intersection points, wherein the reference distances are the distances of the intersection points relative to reference endpoints of the cutting straight line segments; Respectively constructing data points according to the reference distance of the intersection point and the corresponding physical information; and fitting a function model of the cutting straight line segment based on the data points, wherein the function model is used for describing the relation of physical information of any point on the cutting straight line segment along with the change of the distance relative to the reference endpoint.
6. The estimation method according to claim 1, wherein the step of constructing a function model of the cutting straight line segment based on the position information and the physical information of the intersection point includes: Respectively constructing data points according to the physical information of the intersection point and coordinate values of reference coordinate axes, wherein the reference coordinate axes are X axes or Y axes of a designated coordinate system; And fitting a function model of the cutting straight line segment based on the data points, wherein the function model is used for describing the relation of physical information of any point on the cutting straight line segment along with the change of coordinate values on a reference coordinate axis.
7. An estimation device for a two-dimensional plane value of a semiconductor device, comprising: the cutting line construction module is used for constructing a cutting straight line segment penetrating through a two-dimensional grid, wherein the two-dimensional grid is obtained by solving a two-dimensional surface model finite element of a target semiconductor device, and the position information and the physical information of nodes of the two-dimensional grid are known; the intersection point calculating module is used for calculating the position information of the intersection point of the cutting straight line segment and the two-dimensional grid; the estimation module is used for estimating the physical information of the intersection points based on the position information and the physical information of the nodes of the two-dimensional grid and the position information of the intersection points; the function construction module is used for constructing a function model of the cutting straight line segment based on the position information and the physical information of the intersection point, and the function model is used for describing the relationship between the physical information and the position information of any point on the cutting straight line segment; and the information calculation module is used for estimating the physical information of any point on the cutting straight line segment based on the function model.
8. An electronic device, comprising: at least one processor, and A memory storing instructions that, when executed by the at least one processor, cause the at least one processor to perform the method of estimating a two-dimensional plane value of a semiconductor device as claimed in any one of claims 1 to 6.
9. A machine readable storage medium storing executable instructions which, when executed, cause the machine to perform a method of estimating a two-dimensional planar value of a semiconductor device as claimed in any one of claims 1 to 6.

Description

Method and related device for estimating two-dimensional plane value of semiconductor device Technical Field The application relates to the technical field of semiconductor device simulation, in particular to a method and a related device for estimating two-dimensional plane values of a semiconductor device. Background The acquisition of physical information of specific data points of a semiconductor device is very important for application scenarios requiring deep knowledge of the data, such as semiconductor device performance analysis and fault diagnosis. In the field of grid data processing of semiconductor devices, contour maps are commonly used to present an approximate distribution of data. However, contour maps suffer from a significant disadvantage in that they do not provide an accurate, high-speed estimate of the value of a particular data point. Specifically, for semiconductor grid data, the prior art can quickly estimate physical information of any point on a connecting line of two adjacent grid nodes based on the physical information of the two adjacent grid nodes, and then a contour map can be drawn based on the physical information of each point on a grid edge line, but for the physical information of any point inside the grid, although the physical information can be estimated by two adjacent three grid nodes, more calculation power and time are needed. Thus, there is a need for a method that can achieve a quick estimation of physical information at a point inside a grid. The information disclosed in this background section is only for enhancement of understanding of the general background of the application and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person of ordinary skill in the art. Disclosure of Invention The application aims to provide a method and a related device for estimating the two-dimensional plane value of a semiconductor device, which are used for solving the technical problem that the physical information of any point inside a grid of the semiconductor device cannot be rapidly estimated in the prior art. In order to achieve the above purpose, the application adopts a technical scheme that: the method for estimating the two-dimensional plane value of the semiconductor device comprises the following steps: Constructing a cutting straight line segment penetrating through the two-dimensional grid, wherein the two-dimensional grid is obtained by solving a two-dimensional surface model finite element of a target semiconductor device, and the position information and the physical information of nodes of the two-dimensional grid are known; calculating the position information of the intersection point of the cutting straight line segment and the two-dimensional grid; estimating the physical information of the intersection points based on the position information and the physical information of the nodes of the two-dimensional grid and the position information of the intersection points; based on the position information and the physical information of the intersection point, constructing a function model of the cutting straight line segment, wherein the function model is used for describing the relationship between the physical information and the position information of any point on the cutting straight line segment; and estimating physical information of any point on the cutting straight line segment based on the function model. In one or more embodiments, the physical information of the nodes of the two-dimensional network includes at least one of an electric potential, an electron concentration, and a hole concentration. In one or more embodiments, the estimating the physical information of the intersection point based on the position information and the physical information of the nodes of the two-dimensional grid and the position information of the intersection point includes: acquiring position information and physical information of nodes at two ends of the grid line where the intersection point is located; constructing an interpolation function based on the position information and the physical information of the nodes at the two ends of the grid line; Substituting the position information of the intersection point into the interpolation function to obtain the physical information of the intersection point. In one or more embodiments, the interpolation function is a linear function or a nonlinear function. In one or more embodiments, the step of constructing a function model of the cutting straight line segment based on the position information and the physical information of the intersection point includes: Respectively calculating reference distances of the intersection points, wherein the reference distances are the distances of the intersection points relative to reference endpoints of the cutting straight line segments; Respectively constructing data points according to the referen