CN-122021405-A - Method and system for optimizing airflow field of film coater, electronic equipment and computer readable storage medium

CN122021405ACN 122021405 ACN122021405 ACN 122021405ACN-122021405-A

Abstract

The application relates to the technical field of vapor deposition coating, in particular to a method, a system, electronic equipment and a computer readable storage medium for optimizing an airflow field of a coating device; the simulation parameters and the simulation boundary conditions of the first film plating device simulation model are configured according to the preset process conditions of the entity film plating device to obtain a second film plating device simulation model, the air flow field simulation is carried out based on the second film plating device simulation model to obtain a simulation result, whether the simulation result meets the preset conditions is judged, when the simulation result meets the preset conditions, the entity film plating device is set according to the corresponding values of the parameters to be adjusted in the second film plating device simulation model, and finally the consistency of film thickness of the film plating films of the film plating devices is improved.

Inventors

ZHANG JIANDONG
GAO YANGYANG
FANG YANG
ZHANG JUNPING

Assignees

湖南旗滨光能科技有限公司

Dates

Publication Date: 20260512
Application Date: 20251230

Claims (10)

1. The method for optimizing the airflow field of the film plating device is characterized by comprising the following steps of: Establishing a first film plating device simulation model based on original structure parameters of the entity film plating device, wherein the original structure parameters comprise parameters to be adjusted; Configuring simulation parameters and simulation boundary conditions of the first film plating device simulation model according to preset process conditions of the entity film plating device to obtain a second film plating device simulation model; Performing airflow field simulation based on the second film plating device simulation model to obtain a simulation result; judging whether the simulation result meets a preset condition or not; and when the simulation result meets the preset condition, setting the entity film plating device according to the corresponding value of the parameter to be adjusted in the second film plating device simulation model.
2. The method according to claim 1, wherein after the step of determining whether the simulation result satisfies a preset condition, further comprising: when the simulation result is determined to not meet the preset condition, adjusting the corresponding value of the parameter to be adjusted in the second film plating device simulation model based on a preset optimization algorithm to obtain an updated second film plating device simulation model; And executing airflow field simulation and subsequent steps based on the updated second film plating device simulation model, and configuring simulation parameters and simulation boundary conditions input into the first film plating device simulation model according to preset process conditions of the entity film plating device until a simulation result is determined to meet the preset conditions.
3. The method of optimizing an airflow field of a coating apparatus according to claim 2, wherein the predetermined optimization algorithm comprises at least one of a gradient descent method and a genetic algorithm.
4. The method of optimizing an airflow field of a coating apparatus according to claim 3, wherein the simulation result includes flow field data and concentration field data, and the step of determining whether the simulation result satisfies a predetermined condition includes: Performing quantization operation on the flow field data and the concentration field data to obtain a flow field uniformity quantization index and a flow field stability quantization index; Comparing the flow field uniformity quantization index with a preset uniformity threshold value, and comparing the flow field stability quantization index with a preset stability threshold value; If the flow field uniformity quantization index is smaller than the preset uniformity threshold and the flow field stability quantization index is smaller than the preset stability threshold, determining that the simulation result meets the preset condition; And if the flow field uniformity quantization index is greater than or equal to the preset uniformity threshold and/or the flow field stability quantization index is greater than or equal to the preset stability threshold, determining that the simulation result meets the preset condition.
5. The method of optimizing an airflow field of a coating apparatus according to claim 4, wherein said parameter to be adjusted comprises a spacing of the nozzle from the substrate.
6. The method of optimizing an airflow field of a coating apparatus according to claim 5, wherein the step of performing quantization operation on the flow field data and the concentration field data to obtain a flow field uniformity quantization index and a flow field stability quantization index comprises: extracting gas flow velocity or flux data of an outlet face of the nozzle from the flow field data, and analyzing the discrete degree of the gas flow velocity or flux data to obtain a flow field uniformity quantization index; And determining a target detection plane above the substrate based on the distance, extracting flow field state data of the target detection plane, and analyzing flow field stability related parameters in the flow field state data to obtain a flow field stability quantization index.
7. The method of optimizing an airflow field of a coating apparatus according to claim 1, wherein the step of configuring simulation parameters and simulation boundary conditions input to the simulation model of the first coating apparatus according to preset process conditions of the physical coating apparatus comprises: Based on the structural characteristics of the first film plating device simulation model, matching and inputting medium characteristic parameters, cavity boundary parameters and reaction environment parameters which are matched with the process of the entity film plating device; Acquiring a preset parameter verification rule, carrying out suitability and value rationality verification on the medium characteristic parameter, the cavity boundary parameter and the reaction environment parameter, and removing invalid parameters with unsuitable suitability and invalid value to obtain a compliance parameter set; Binding and associating the compliance parameter set with the parameters to be adjusted to generate simulation running conditions corresponding to the parameters to be adjusted one by one; And importing the simulation running conditions into the first film plating device simulation model to complete the configuration of the simulation parameters and the simulation boundary conditions.
8. A coater airflow field optimization system for performing an airflow field optimization process on a coater, the coater airflow field optimization system comprising: the model building module is used for building a first film plating device simulation model based on original structure parameters of the entity film plating device, wherein the original structure parameters comprise parameters to be adjusted; The parameter configuration module is used for configuring simulation parameters and simulation boundary conditions of the first film plating device simulation model according to the preset process conditions of the entity film plating device to obtain a second film plating device simulation model; the model simulation module is used for carrying out air flow field simulation based on the second film plating device simulation model to obtain a simulation result; the condition judging module is used for judging whether the simulation result meets a preset condition; And the parameter setting module is used for setting the entity film plating device according to the corresponding value of the parameter to be adjusted in the second film plating device simulation model when the simulation result meets the preset condition.
9. An electronic device comprising a processor, a memory, and a coater airflow field optimization program stored on the memory and executable by the processor, wherein the coater airflow field optimization program, when executed by the processor, implements the steps of the coater airflow field optimization method of any of claims 1-7.
10. A computer readable storage medium, characterized in that the computer readable storage medium has stored thereon a coater airflow field optimization program, wherein the coater airflow field optimization program, when executed by a processor, implements the steps of the coater airflow field optimization method according to any one of claims 1 to 7.

Description

Method and system for optimizing airflow field of film coater, electronic equipment and computer readable storage medium Technical Field The present application relates to the field of vapor deposition coating technologies, and in particular, to a method and a system for optimizing an airflow field of a coating device, an electronic device, and a computer readable storage medium. Background In the technical field of vapor deposition coating, the coating device is widely applied to the film preparation of high-end products such as semiconductors, photovoltaic glass and the like. The uniformity and stability of the airflow field are core factors for determining the quality of the coating film, directly influence the distribution, deposition rate and film thickness consistency of a reaction medium, and once the problems of vortex, local flow speed mutation and the like occur, the defects of uneven film thickness, component segregation and the like are extremely easy to be caused, and the product yield is seriously lowered. Taking an APCVD (atmospheric pressure chemical vapor deposition ) film plating device as a typical example, the nozzle and cavity structure design of the APCVD film plating device at present adopts an empirical layout or a simple parameter adjustment processing mode. The mode is difficult to accurately match the flow characteristics of the reaction gas, the problems of uneven outflow of the nozzle, vortex generation in a deposition area and the like are easily caused, the consistency of the thickness of the deposited film is directly caused, and the difference of the film thickness under partial scenes exceeds 10%. The problem has obvious influence on the field of high-precision manufacturing, namely unbalanced electrical performance of a device can be caused by uneven coating of a dielectric layer of a semiconductor chip, light transmission and imaging quality can be influenced by thickness deviation of an optical element, high-end product yield and industrial technology upgrading are severely restricted, and the problem of uniformity of film thickness caused by insufficient air flow adaptation of a film coater needs to be solved. Disclosure of Invention The application mainly aims to provide a method, a system, electronic equipment and a computer readable storage medium for optimizing an airflow field of a film plating device, and aims to improve film thickness consistency of film plating of the film plating device. In order to achieve the above object, the present application provides a method for optimizing an airflow field of a film plating apparatus, the method comprising: establishing a first film plating device simulation model based on original structure parameters of the entity film plating device, wherein the original structure parameters comprise parameters to be adjusted; configuring simulation parameters and simulation boundary conditions of a first film plating device simulation model according to preset process conditions of the entity film plating device to obtain a second film plating device simulation model; Performing airflow field simulation based on the second film plating device simulation model to obtain a simulation result; Judging whether the simulation result meets a preset condition; And when the simulation result meets the preset condition, setting the entity film coater according to the corresponding value of the parameter to be adjusted in the second film coater simulation model. In addition, in order to achieve the above object, the present application also provides a coater airflow field optimization system for performing an airflow field optimization process on a coater, the coater airflow field optimization system comprising: The model building module is used for building a first film plating device simulation model based on original structure parameters of the entity film plating device, wherein the original structure parameters comprise parameters to be adjusted; The parameter configuration module is used for configuring simulation parameters and simulation boundary conditions of the first film plating device simulation model according to preset process conditions of the solid film plating device to obtain a second film plating device simulation model; the model simulation module is used for carrying out air flow field simulation based on the second film plating device simulation model to obtain a simulation result; The condition judging module is used for judging whether the simulation result meets the preset condition; And the parameter setting module is used for setting the entity film coater according to the corresponding value of the parameter to be adjusted in the second film coater simulation model when the simulation result is determined to meet the preset condition. In addition, in order to achieve the above object, the present application also provides an electronic device, which includes a memory, a processor, and a coater airflow field optimiz