CN-122021525-A - Wide temperature range distributed photovoltaic direct current carrier SoC chip

CN122021525ACN 122021525 ACN122021525 ACN 122021525ACN-122021525-A

Abstract

The invention discloses a wide temperature range distributed photovoltaic direct current carrier SoC chip, and belongs to the technical field of integrated circuit design. The SoC chip comprises an analog front-end circuit, a dynamic compensation and signal conditioning module, an analog-to-digital conversion module and a self-organizing bidirectional communication network module, wherein the analog front-end circuit is used for carrying out direct current carrier signal coupling, high-voltage protection and preliminary signal conditioning on a photovoltaic node to obtain a preprocessing signal, the dynamic compensation and signal conditioning module is used for carrying out dynamic compensation and conditioning on the preprocessing signal to obtain a compensation conditioning signal, the analog-to-digital conversion module is used for converting the compensation conditioning signal into a first digital signal, the self-organizing bidirectional communication network module is used for modulating the first digital signal, route adaptation is carried out on the modulated signal through a self-adaption networking, priority of the adapted signal is judged, and then the signal is sent to other nodes. The SoC chip realizes high-precision signal acquisition, high-reliability low-delay communication and stable system performance in a wide temperature range of-40 ℃ to 125 ℃.

Inventors

MEN CHANGYOU
SUN QUAN
CUI GUOYU
QIAN HAIFENG
DU CHUNYAO

Assignees

杭州万高科技股份有限公司

Dates

Publication Date: 20260512
Application Date: 20260413

Claims (10)

1. A wide temperature range distributed photovoltaic direct current carrier SoC chip is characterized by comprising an analog front-end circuit, a dynamic compensation and signal conditioning module, an analog-to-digital conversion module and a self-organizing bidirectional communication network module, The analog front-end circuit is used for coupling, high-voltage protection and preliminary signal conditioning of direct current carrier signals of nodes in the distributed photovoltaic system to obtain a preprocessing signal; the dynamic compensation and signal conditioning module is used for dynamically compensating and conditioning the preprocessing signal to obtain a compensation conditioning signal; The analog-to-digital conversion module is used for converting the compensation conditioning signal into a first digital signal; The self-organizing bidirectional communication network module is used for modulating the first digital signal, performing route adaptation on the modulated signal through the self-adaption networking, performing priority judgment on the adapted signal, obtaining a turn-off instruction signal or a data signal, and sending the turn-off instruction signal or the data signal to other nodes of the distributed photovoltaic system.
2. The distributed photovoltaic direct current carrier SoC chip with wide temperature range according to claim 1, wherein the self-organizing bidirectional communication network module is further used for receiving communication signals sent by other nodes of the distributed photovoltaic system, processing the communication signals to obtain baseband signals, and completing route adaptation of the baseband signals through self-adaption networking to obtain adapted signals; the SoC chip further includes a control module, where the control module is configured to execute an instruction according to the second digital signal.
3. The distributed photovoltaic direct current carrier SoC chip with wide temperature range according to claim 2, wherein the analog front-end circuit comprises a direct current coupling inductance unit, a direct current power supply serial bus high voltage protection circuit and an initial conditioning unit, The direct current coupling inductance unit is used for coupling direct current carrier signals of nodes in the distributed photovoltaic system through a direct current coupling inductance to obtain coupled carrier signals, wherein the direct current coupling inductance adopts a nanocrystalline alloy magnetic core and a 10-turn layered winding process; The direct current power supply is connected in series with the bus high-voltage protection circuit and is used for carrying out high-voltage protection on the coupled carrier signal when the bus voltage exceeds a preset threshold value to obtain a high-voltage protected carrier signal; the initial conditioning unit is used for carrying out adjustable gain amplification and low-pass filtering on the carrier signal after high-voltage protection to obtain a preprocessing signal.
4. The distributed photovoltaic direct current carrier SoC chip with wide temperature range according to claim 3, wherein the dynamic compensation and signal conditioning module comprises a temperature signal conditioning unit, a programmable gain amplifying unit, an adjustable filtering unit, a compensation signal generating unit and a signal superposition unit, The temperature signal conditioning unit is used for collecting the internal temperature of the SoC chip and converting the internal temperature into a voltage signal, namely a temperature detection signal; The programmable gain amplifying unit is used for adjusting the gain of the preprocessing signal according to the temperature detection signal through digital control logic to obtain a gain calibrated signal; The adjustable filtering unit is used for filtering the gain calibrated signal according to the temperature detection signal to obtain a filtered signal; the compensation signal generation unit is used for searching a corresponding digital compensation word according to the temperature detection signal and converting the corresponding digital compensation word into an analog compensation voltage through a digital-to-analog converter; the signal superposition unit is used for superposing the filtered signal and the analog compensation voltage to obtain a compensation conditioning signal.
5. The wide temperature range distributed photovoltaic dc carrier SoC chip as set forth in claim 4, wherein the analog to digital conversion module employs a three-order multi-bit continuous time sigma-delta modulation architecture, combined with a 64-fold oversampling technique and a frequency shifting technique, to obtain the 16-bit first digital signal.
6. The distributed photovoltaic direct current carrier SoC chip with wide temperature range according to claim 5, wherein the self-organizing bidirectional communication network module comprises a modulation unit, an adaptive networking unit, a quick turn-off protocol unit and a signal receiving and transmitting unit, The modulating unit is used for distributing the first digital signal to 8 subcarriers by adopting a 16-QAM modulating mode to obtain a modulating signal; the self-adaptive networking unit is used for carrying out route adaptation on the modulated signal through a route discovery protocol reconstruction topology to obtain a signal after topology adaptation; The rapid turn-off protocol unit is used for judging the priority of the signals after topology adaptation, triggering an immediate confirmation mechanism to output turn-off instruction signals if the signals are turn-off instructions, and outputting data signals after data verification if the signals are data signals; the signal receiving and transmitting unit is used for transmitting the turn-off instruction signal or the data signal to other nodes of the distributed photovoltaic system.
7. The SoC chip of claim 6, wherein the signal transceiver unit is further configured to receive a communication signal sent by another node of the distributed photovoltaic system, amplify and filter the communication signal, and obtain a baseband signal; The self-adaptive networking unit is further used for completing route adaptation on the baseband signal according to the current network topology to obtain an adapted signal; The self-organizing bidirectional communication network module further comprises a demodulation unit, wherein the demodulation unit is used for recovering the 16-bit second digital signal from the 8 subcarriers through fast Fourier transform.
8. The broad temperature range distributed photovoltaic dc carrier SoC chip as defined by claim 7, wherein the reference for the analog to digital conversion module is provided by a dynamic compensation and signal conditioning module.
9. The wide temperature range distributed photovoltaic dc carrier SoC chip as set forth in claim 8, wherein the dc coupled inductor unit includes a dc coupled inductor L1, and the dc power supply serial bus high voltage protection circuit includes a transient voltage suppression diode D1 and a MOSFET switch Q1; the direct current coupling inductor L1 is connected in series with a signal input end, and the signal input end is used for inputting a direct current carrier signal of a node in the distributed photovoltaic system; the transient voltage suppression diode D1 is connected in parallel between the output end of the direct current coupling inductor L1 and the ground, and is used for being instantaneously conducted to release surge current when the bus voltage exceeds a preset threshold value; the drain electrode of the MOSFET switch Q1 is connected to the output end of the direct current coupling inductor L1, the source electrode is grounded, and the grid electrode receives an overvoltage control signal; when bus voltage abnormality is detected, the MOSFET switch Q1 is conducted, and a signal path is bypassed to the ground; The initial conditioning unit comprises a first operational amplifier OPA1, a current limiting resistor R1, a grounding resistor R2 and a feedback resistor R3; The current limiting resistor R1 is connected in series between the output end of the high-voltage protection circuit and the input end of the first operational amplifier OPA 1; The first operational amplifier OPA1, the grounding resistor R2 and the feedback resistor R3 form an active low-pass filtering amplifying circuit, and the active low-pass filtering amplifying circuit is used for carrying out adjustable gain amplification on the carrier signal after high-voltage protection, filtering high-frequency noise and outputting a preprocessing signal.
10. The SoC chip of claim 9, wherein the adjustable filter unit includes a MOS tube M1 and a capacitor C1, the MOS tube M1 and the capacitor C1 form an RC filter network, and the on-resistance of the MOS tube M1 is adjusted according to the temperature detection signal, so as to change the filter cut-off frequency of the signal after gain calibration.

Description

Wide temperature range distributed photovoltaic direct current carrier SoC chip Technical Field The invention belongs to the technical field of integrated circuit design, and particularly relates to a wide-temperature-range distributed photovoltaic direct-current carrier SoC chip. Background The distributed photovoltaic system is used as an important component of new energy, and the reliability and the intelligent level of the distributed photovoltaic system directly influence the energy utilization efficiency. The direct current carrier communication technology is a mainstream scheme of communication among nodes in the distributed photovoltaic system because no additional wiring is needed and the cost is low. However, existing distributed photovoltaic socs (System on Chip) suffer from the following disadvantages over a wide temperature range (e.g. -40 ℃ to 125 ℃): 1. The performance of the analog front end is reduced, namely, the signal coupling efficiency is reduced due to the change of parameters such as the magnetic core characteristic, the winding resistance and the like of the direct current coupling inductor at a wide temperature, and meanwhile, the response speed and the reliability of the high-voltage protection circuit are reduced, and the high-voltage protection circuit is easily damaged by high-voltage impact of a direct current power supply serial bus. 2. The dynamic compensation capability is insufficient, the parameters such as gain, offset voltage, filter cut-off frequency and the like of the analog front-end circuit drift at wide temperature, and the traditional signal conditioning circuit with fixed parameters cannot adapt to the drift, so that the signal acquisition precision is reduced. 3. The communication reliability is low, the network reconstruction is slow when the node dynamic changes (such as component increase and decrease and shadow shielding) of the existing communication network, and the communication protocol delay is high, so that the requirement of the photovoltaic component on quick shutdown (such as NEC 690.12 standard) cannot be met. Therefore, how to design a distributed photovoltaic direct current carrier SoC chip with a wide temperature range, so as to solve the above technical problems is a difficult problem to be solved in the art. Disclosure of Invention The invention aims to solve the technical problem of providing a distributed photovoltaic direct current carrier SoC chip with a wide temperature range aiming at the defects of the prior art. In order to solve the technical problems, the invention discloses a wide temperature range distributed photovoltaic direct current carrier SoC chip, which comprises an analog front-end circuit, a dynamic compensation and signal conditioning module, an analog-to-digital conversion module and a self-organizing bidirectional communication network module. The analog front-end circuit is used for coupling, high-voltage protection and preliminary signal conditioning of direct current carrier signals of nodes in the distributed photovoltaic system to obtain a preprocessing signal; the dynamic compensation and signal conditioning module is used for dynamically compensating and conditioning the preprocessing signal to obtain a compensation conditioning signal; The analog-to-digital conversion module is used for converting the compensation conditioning signal into a first digital signal; The self-organizing bidirectional communication network module is used for modulating the first digital signal, performing route adaptation on the modulated signal through the self-adaption networking, performing priority judgment on the adapted signal, obtaining a turn-off instruction signal or a data signal, and sending the turn-off instruction signal or the data signal to other nodes of the distributed photovoltaic system to realize high-reliability and low-delay communication. Further, the self-organizing bidirectional communication network module is also used for receiving communication signals sent by other nodes of the distributed photovoltaic system, processing the communication signals to obtain baseband signals, and completing route adaptation of the baseband signals through self-adaption networking to obtain adapted signals; the SoC chip further includes a control module, where the control module is configured to execute an instruction according to the second digital signal. Further, the analog front-end circuit comprises a direct current coupling inductance unit, a direct current power supply serial bus high-voltage protection circuit and an initial conditioning unit. The direct current coupling inductance unit is used for coupling direct current carrier signals of nodes in the distributed photovoltaic system through a direct current coupling inductance to obtain coupled carrier signals, wherein the direct current coupling inductance adopts a nanocrystalline alloy magnetic core and a 10-turn layered winding process; The direct current power