CN-122021691-A - Dual-frequency electronic identifier

Abstract

The application provides a dual-frequency electronic mark, which solves the problems of unstable performance, single function, insufficient safety and difficulty in considering metal and nonmetal surface application of the existing mark in a complex environment, and comprises a substrate; the dual-frequency chip is arranged on the substrate, a high-frequency communication module, an ultrahigh-frequency communication module and a storage area accessed by the high-frequency communication module and the ultrahigh-frequency communication module together are integrated in the dual-frequency chip, the high-frequency antenna is arranged on the substrate and is electrically connected with the high-frequency communication module of the dual-frequency chip, the ultrahigh-frequency antenna is arranged on the substrate and is electrically connected with the ultrahigh-frequency communication module of the dual-frequency chip, and the shell is used for coating the substrate, the dual-frequency chip, the high-frequency antenna and the ultrahigh-frequency antenna.

Inventors

• LI YANG
• ZOU HEPING
• LI QIUYANG
• CHENG DA
• WANG JINGZE
• LI JIADAI

Assignees

• 中国电力科学研究院有限公司

Dates

Publication Date

20260512

Application Date

20260123

Claims (10)

1. 1. A dual-frequency electronic tag, comprising: A substrate; The dual-frequency chip is arranged on the substrate, and a high-frequency communication module, an ultrahigh-frequency communication module and a storage area which is accessed by the high-frequency communication module and the ultrahigh-frequency communication module together are integrated in the dual-frequency chip; The high-frequency antenna is arranged on the substrate and is electrically connected with the high-frequency communication module of the dual-frequency chip; the ultrahigh frequency antenna is arranged on the substrate and is electrically connected with the ultrahigh frequency communication module of the dual-frequency chip; And the shell is used for coating the substrate, the double-frequency chip, the high-frequency antenna and the ultrahigh-frequency antenna.
2. 2. The dual frequency electronic signature of claim 1, wherein the thickness of the substrate is no greater than 0.4mm.
3. 3. The dual-frequency electronic tag of claim 1, wherein the high-frequency antenna is an etched double-layer rectangular spiral coil, wherein the double-layer rectangular spiral coil comprises a first coil trace and a second coil trace in different layers, the first coil trace and the second coil trace being in conductive communication through a metallized via.
4. 4. The dual-band electronic tag of claim 1, wherein the ultra-high frequency antenna is a microstrip two-element array antenna.
5. 5. The dual-frequency electronic tag of claim 1, wherein the housing is formed from engineering plastic by an integral injection molding process, and the outer surface of the housing is provided with a laser marking.
6. 6. The method of claim 5, wherein the injection molding process is a two shot injection molding process, the two shots being formed with compatible plastic materials to form a molecular level fusion at the bonding surface.
7. 7. The dual frequency electronic signature as recited in claim 1, wherein the overall thickness of the dual frequency electronic signature is no greater than 3.5mm.
8. 8. The dual-frequency electronic tag of claim 1, wherein the ultra-high frequency communication module of the dual-frequency chip is integrated with a security protection unit, and the security protection unit supports security authentication and data encryption functions based on a national encryption algorithm.
9. 9. The dual frequency electronic identification of claim 8, wherein the national encryption algorithm is an SM1 algorithm or an SM7 algorithm.
10. 10. The dual-frequency electronic tag of claim 1, wherein the dual-frequency chip is attached to the substrate by a surface-mount technology, and the high-frequency antenna and the ultra-high-frequency antenna are both copper and are formed on the surface of the substrate by an etching process.

Description

Dual-frequency electronic identifier Technical Field The application relates to the technical field of automatic identification, in particular to a dual-frequency electronic identifier. Background Radio frequency identification (RFID, radio Frequency Identification) is widely used as a non-contact automatic identification technology in various fields such as logistics, retail, asset management and identity recognition. The RFID acquires related data of the object through the wireless radio frequency signals and identifies the object. The RFID technology can complete the input and processing of object information without directly contacting an object to be identified, has the advantages of high identification speed, multi-target identification, adaptation to severe environments and the like, and becomes one of key data sensing technologies in the field of the Internet of things. However, the RFID electronic identification currently in common use still faces a series of technical bottlenecks in the actual industrial application. Firstly, a single-frequency-band identifier (such as only high frequency or only ultrahigh frequency) is difficult to simultaneously meet the requirements of a composite scene such as close-range accurate interaction, long-range quick inventory and the like. Secondly, the performance of the traditional mark is seriously attenuated when the metal surface works, and the traditional mark is easily influenced by temperature, humidity and physical abrasion in an outdoor complex environment, so that the reliability and the service life are insufficient. In addition, the common identification generally lacks an active safety protection mechanism, the data is at risk of being tampered or forged in the transmission and storage processes, and the asset management requirements of industries with high safety requirements such as electric power, finance and the like are difficult to meet. Therefore, in view of the above problems, the present application proposes a dual-frequency electronic tag. Disclosure of Invention The embodiment of the application provides a dual-frequency electronic tag, which solves the problems of unstable performance, single function, insufficient safety and difficulty in considering metal and nonmetal surface application of the existing tag in a complex environment by integrating a high-frequency antenna and an ultrahigh-frequency antenna into a whole and adopting an integrated injection molding sealed shell and a built-in national security chip. In order to achieve the above purpose, the application adopts the following technical scheme: in a first aspect, the present application provides a dual-frequency electronic tag, comprising: A substrate; The double-frequency chip is arranged on the substrate, and a high-frequency communication module, an ultrahigh-frequency communication module and a storage area accessed by the high-frequency communication module and the ultrahigh-frequency communication module are integrated in the double-frequency chip; the high-frequency antenna is arranged on the substrate and is electrically connected with the high-frequency communication module of the dual-frequency chip; the ultrahigh frequency antenna is arranged on the substrate and is electrically connected with the ultrahigh frequency communication module of the double-frequency chip; And the shell is used for coating the substrate, the double-frequency chip, the high-frequency antenna and the ultrahigh-frequency antenna. In an alternative, the thickness of the substrate is no greater than 0.4mm. In an alternative mode, the high-frequency antenna is a double-layer rectangular spiral coil formed by etching, wherein the double-layer rectangular spiral coil comprises a first coil wire and a second coil wire which are positioned on different layers, and the first coil wire and the second coil wire are conducted through a metallized through hole. In an alternative, the uhf antenna is a microstrip two-element array antenna. In an alternative mode, the shell is made of engineering plastics and is formed through an integrated injection molding process, and laser marking is arranged on the outer surface of the shell. In an alternative, the injection molding process is a two shot injection molding process, the two shots being formed with a compatible plastic material to form a molecular level fusion at the interface. In an alternative, the overall thickness of the dual-frequency electronic signature is no greater than 3.5mm. In an alternative mode, the ultra-high frequency communication module of the dual-frequency chip is integrated with a safety protection unit, and the safety protection unit supports safety authentication and data encryption functions based on a national encryption algorithm. In an alternative, the cryptographic algorithm is the SM1 algorithm or the SM7 algorithm. In an alternative mode, the dual-frequency chip is attached to the substrate through a surface assembly technolo