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CN-122023309-A - Electronic patch manufacturing method and system based on visual detection

CN122023309ACN 122023309 ACN122023309 ACN 122023309ACN-122023309-A

Abstract

The invention relates to the technical field of visual detection and discloses a method and a system for manufacturing an electronic patch based on visual detection, wherein the method comprises the steps of identifying a microcircuit area and a welding spot area of the electronic patch by utilizing a visual detection method; calculating sub-pixel edge coordinates of the microcircuit area, fitting a contour curve of the microcircuit area based on the sub-pixel edge coordinates, adjusting internal electrode printing parameters and laminating parameters of the electronic patch based on the contour curve to obtain first manufacturing parameters, identifying gray distribution characteristics of each welding point in the welding point area, analyzing the degree of ectopic degree of each welding point in the welding point area based on the gray distribution characteristics, adjusting electroplating parameters of the electronic patch based on the degree of ectopic degree to obtain second manufacturing parameters, and executing manufacturing of the electronic patch based on the first manufacturing parameters and the second manufacturing parameters. The invention can improve the manufacturing quality of the electronic patch.

Inventors

  • CHEN JIANGHUA

Assignees

  • 深圳市金源讯科科技有限公司

Dates

Publication Date
20260512
Application Date
20260123

Claims (10)

  1. 1. A method of manufacturing an electronic patch based on visual inspection, the method comprising: identifying a microcircuit area and a welding spot area of the electronic patch by using a visual detection method; Calculating sub-pixel edge coordinates of the microcircuit area, fitting a contour curve of the microcircuit area based on the sub-pixel edge coordinates, and adjusting internal electrode printing parameters and laminating parameters of the electronic patch based on the contour curve to obtain first manufacturing parameters; recognizing gray level distribution characteristics of each welding spot in the welding spot area, analyzing the ectopic degree of each welding spot in the welding spot area based on the gray level distribution characteristics, and adjusting electroplating parameters of the electronic patch based on the ectopic degree to obtain second manufacturing parameters; The manufacturing of the electronic patch is performed based on the first manufacturing parameter and the second manufacturing parameter.
  2. 2. The method of manufacturing an electronic patch based on visual inspection of claim 1, wherein fitting a contour curve of the microcircuit area based on the sub-pixel edge coordinates comprises: Topological ordering is carried out on the sub-pixel edge coordinates to obtain an edge point sequence; identifying the contour characteristics of the microcircuit area to perform preliminary contour fitting on the microcircuit area to obtain a preliminary fitting contour; Optimizing curve points of the preliminary fitting contour by utilizing a curve control point function to obtain an optimized contour curve; And calculating average deviation, maximum deviation and root mean square error between the optimized contour curve and sub-pixel edge coordinates so as to perform fitting accuracy optimization on the optimized contour curve and obtain the contour curve of the microcircuit region.
  3. 3. A method of manufacturing an electronic patch based on visual inspection as claimed in claim 2 wherein the curve control point function is constructed with the deviation of the distance from the edge points of the microcircuit area to the fitted curve.
  4. 4. The method for manufacturing an electronic patch based on visual inspection according to claim 1, wherein adjusting the internal electrode printing parameters and the lamination parameters of the electronic patch based on the contour curve to obtain the first manufacturing parameters comprises: Calculating the contour position deviation, the contour dimension deviation and the shape fidelity error of the electronic patch and the standard design contour by utilizing the contour curve; Determining the type and the adjustment direction of the internal electrode printing parameters to be adjusted according to the type and the size of the outline position deviation and the outline size deviation; Determining the type and the adjustment direction of lamination parameters to be adjusted according to the shape fidelity error; And generating a first manufacturing parameter after adjusting according to the adjusting direction and the adjusting amount corresponding to the internal electrode printing parameter and the laminating parameter.
  5. 5. The method of manufacturing an electronic patch based on visual inspection according to claim 1, wherein analyzing the degree of ectopic sites of each solder joint in the solder joint region based on the gradation distribution characteristics, comprises: Inquiring the standard area of the welding spot area corresponding to the electronic patch and the actual area of the current welding spot area; Calculating the position offset of the welding spot area by utilizing the gray level distribution characteristics; and calculating the degree of the ectopic of each welding spot in the welding spot area based on the standard area, the actual area and the position offset.
  6. 6. The method of manufacturing an electronic patch based on visual inspection of claim 1, wherein calculating sub-pixel edge coordinates of the microcircuit area comprises: Extracting a single-channel gray level image of the microcircuit area; calculating a horizontal gradient value and a vertical gradient value of the single-channel gray level image; positioning sub-pixel positions of the microcircuit region by using a gray moment holding method based on the horizontal gradient value and the vertical gradient value; and calculating sub-pixel edge coordinates of the microcircuit area based on the sub-pixel positions.
  7. 7. The method of claim 1, wherein adjusting the plating parameters of the electronic patch based on the degree of the dislocation to obtain the second manufacturing parameters comprises: performing process mapping on the ectopic degree and electroplating parameters of the electronic patch to obtain an ectopic-parameter relation; constructing an electroplating parameter adjustment instruction of the electronic patch based on the ectopic-parameter relation; And adjusting the electroplating parameters of the electronic patch according to the electroplating parameter adjustment instruction to obtain a second manufacturing parameter.
  8. 8. The method of manufacturing an electronic patch based on visual inspection according to claim 1, wherein identifying the microcircuit area and the solder joint area of the electronic patch using the visual inspection method comprises: After a high-definition image of an electronic patch is acquired, filtering and contrast enhancement processing are carried out on the high-definition image, and then a target image is generated; performing region segmentation on the target image by using an edge detection algorithm to obtain a region segmentation patch image; and identifying a microcircuit area and a welding spot area of the corresponding electronic patch in the area division patch image.
  9. 9. The method of manufacturing an electronic patch based on visual inspection of claim 1, wherein the manufacturing of the electronic patch is performed based on the first manufacturing parameter and the second manufacturing parameter, comprising: integrating and checking the first manufacturing parameters and the second manufacturing parameters to generate a manufacturing process instruction set; After the manufacturing process instruction sets are respectively issued to the internal electrode printing system, the laminating equipment system and the electroplating production system, the systems execute the manufacturing of the electronic patch according to the instructions received by the systems.
  10. 10. An electronic patch manufacturing system based on visual inspection, the system comprising: The area characteristic recognition module is used for recognizing a microcircuit area and a welding spot area of the electronic patch by utilizing a visual detection method; The first parameter adjustment module is used for calculating the sub-pixel edge coordinates of the microcircuit area, fitting a contour curve of the microcircuit area based on the sub-pixel edge coordinates, and adjusting the internal electrode printing parameters and laminating parameters of the electronic patch based on the contour curve to obtain first manufacturing parameters; the second parameter adjustment module is used for identifying gray level distribution characteristics of each welding spot in the welding spot area, analyzing the ectopic degree of each welding spot in the welding spot area based on the gray level distribution characteristics, and adjusting electroplating parameters of the electronic patch based on the ectopic degree to obtain second manufacturing parameters; And the manufacturing execution module is used for executing the manufacturing of the electronic patch based on the first manufacturing parameter and the second manufacturing parameter.

Description

Electronic patch manufacturing method and system based on visual detection Technical Field The invention relates to an electronic patch manufacturing method and system based on visual detection, and belongs to the technical field of visual detection. Background Electronic patches, also commonly referred to as "flexible electronic patches" or "electronic skin", are an emerging type of miniaturized, flexible, and integrated electronic device. The electronic patch has wide application in the fields of current medical health monitoring, human activity recognition, human-computer interaction interface and the like. Currently, static parameter methods in the traditional manufacturing process are mostly adopted for manufacturing the electronic patches, and the method cannot form real-time visual feedback information according to the actual printing contour precision of microcircuits on each patch and the actual forming position of welding spots. Therefore, the problem of uneven resistance and reduced signal integrity due to rough or distorted edges of the microcircuit lines often occurs. Disclosure of Invention The invention provides a method and a system for manufacturing an electronic patch based on visual detection, and mainly aims to improve the manufacturing quality of the electronic patch. In order to achieve the above object, the present invention provides a method for manufacturing an electronic patch based on visual inspection, including: identifying a microcircuit area and a welding spot area of the electronic patch by using a visual detection method; Calculating sub-pixel edge coordinates of the microcircuit area, fitting a contour curve of the microcircuit area based on the sub-pixel edge coordinates, and adjusting internal electrode printing parameters and laminating parameters of the electronic patch based on the contour curve to obtain first manufacturing parameters; recognizing gray level distribution characteristics of each welding spot in the welding spot area, analyzing the ectopic degree of each welding spot in the welding spot area based on the gray level distribution characteristics, and adjusting electroplating parameters of the electronic patch based on the ectopic degree to obtain second manufacturing parameters; The manufacturing of the electronic patch is performed based on the first manufacturing parameter and the second manufacturing parameter. Optionally, fitting a contour curve of the microcircuit area based on the sub-pixel edge coordinates includes: Topological ordering is carried out on the sub-pixel edge coordinates to obtain an edge point sequence; identifying the contour characteristics of the microcircuit area to perform preliminary contour fitting on the microcircuit area to obtain a preliminary fitting contour; Optimizing curve points of the preliminary fitting contour by utilizing a curve control point function to obtain an optimized contour curve; And calculating average deviation, maximum deviation and root mean square error between the optimized contour curve and sub-pixel edge coordinates so as to perform fitting accuracy optimization on the optimized contour curve and obtain the contour curve of the microcircuit region. Optionally, the curve control point function is constructed with a distance deviation of the microcircuit area edge points to the fitted curve. Optionally, adjusting the internal electrode printing parameter and the lamination parameter of the electronic patch based on the profile curve to obtain a first manufacturing parameter, including: Calculating the contour position deviation, the contour dimension deviation and the shape fidelity error of the electronic patch and the standard design contour by utilizing the contour curve; Determining the type and the adjustment direction of the internal electrode printing parameters to be adjusted according to the type and the size of the outline position deviation and the outline size deviation; Determining the type and the adjustment direction of lamination parameters to be adjusted according to the shape fidelity error; And generating a first manufacturing parameter after adjusting according to the adjusting direction and the adjusting amount corresponding to the internal electrode printing parameter and the laminating parameter. Optionally, analyzing the degree of ectopic of each welding spot in the welding spot area based on the gray scale distribution feature includes: Inquiring the standard area of the welding spot area corresponding to the electronic patch and the actual area of the current welding spot area; Calculating the position offset of the welding spot area by utilizing the gray level distribution characteristics; and calculating the degree of the ectopic of each welding spot in the welding spot area based on the standard area, the actual area and the position offset. Optionally, calculating the sub-pixel edge coordinates of the microcircuit area includes: Extracting a single-channel gray level im