CN-122024586-A - Display module, manufacturing method thereof and display device

CN122024586ACN 122024586 ACN122024586 ACN 122024586ACN-122024586-A

Abstract

The invention provides a display module, a manufacturing method thereof and a display device, wherein the display module comprises a display panel, a flexible circuit board, a covering belt, a conductive layer and a grounding structure, wherein the display panel comprises a display area and a binding area bent to the back surface of the display area, the flexible circuit board is electrically connected with the binding area, a copper exposure area is formed in one side of the flexible circuit board, which is away from the display area, the copper exposure area is electrically connected with the conductive layer through the second via hole, one end of the covering belt is attached to the binding area, the other end of the covering belt is attached to one side of the flexible circuit board, which is away from the display area, the covering belt comprises a first insulating layer, a conductive layer and a second insulating layer, which are sequentially arranged away from the display area, a first via hole is formed in the thickness direction of the first insulating layer, a second via hole is formed in the thickness direction of the second insulating layer, the grounding structure is located on one side of the covering belt, which is away from the display area, the copper exposure area is electrically connected with the conductive layer through the second via hole, and the copper exposure area is grounded.

Inventors

WANG QIANSONG
Hou shuai
WANG ZIJIAN
CHENG JINXU
LIU WEN

Assignees

京东方科技集团股份有限公司
绵阳京东方光电科技有限公司

Dates

Publication Date: 20260512
Application Date: 20260304

Claims (11)

1. A display module, comprising: the display panel comprises a display area and a binding area bent to the back of the display area; The flexible circuit board is electrically connected with the binding area, and a copper exposure area is formed on one side of the flexible circuit board, which is away from the display area; The display device comprises a binding area, a cover band, a flexible circuit board, a display area, a first insulating layer, a conductive layer and a second insulating layer, wherein one end of the cover band is attached to the binding area, and the other end of the cover band is attached to one side of the flexible circuit board, which is away from the display area; The structure to be grounded is positioned on one side of the cover tape, which is away from the display area, wherein the structure to be grounded is electrically connected with the conductive layer through the second via hole, the copper exposing area is electrically connected with the conductive layer through the first via hole, and the copper exposing area is grounded.
2. The display module of claim 1, wherein the exposed copper areas are disposed in one-to-one correspondence with the first vias, and the orthographic projections of the exposed copper areas on the display area fall entirely within the area of the orthographic projections of the first vias on the display area.
3. The display module of claim 2, wherein the first via is one and there is an overlap area between an orthographic projection of the first via on the display area and an orthographic projection of the second via on the display area.
4. A display module according to claim 3, wherein the orthographic projection of the second via on the display area falls entirely within the area of the orthographic projection of the first via on the display area.
5. The display module of claim 2, wherein the number of exposed copper areas is at least two, and orthographic projections of each exposed copper area on the display area are not overlapped with each other and are all grounded.
6. The display module of any one of claims 1-5, further comprising a display driver integrated circuit located on a side of the binding region facing away from the display region, wherein a front projection of the display driver integrated circuit on the display region and a front projection of the structure to be grounded on the display region do not overlap each other, and wherein the display driver integrated circuit is completely covered by the cover tape.
7. A display module according to any one of claims 1-5, wherein the orthographic projection of the structure to be grounded on the display area falls entirely within the area of the orthographic projection of the cover tape on the display area.
8. The display module of any one of claims 1-5, further comprising a first conductive paste received in the first via and a second conductive paste received in the second via, wherein the structure to be grounded is electrically connected to the conductive layer through the second conductive paste, and the conductive layer is electrically connected to the copper-exposed region through the first conductive paste.
9. The display module of any one of claims 1-5, wherein the structure to be grounded is one of an ultrasonic fingerprint module and a temperature control module.
10. A display device, comprising: the display module of any one of claims 1-9.
11. A method of manufacturing a display module according to any one of claims 1 to 9, comprising: the first via hole is formed along the thickness direction of the first insulating layer through a laser windowing process; Forming the second via hole along the thickness direction of the second insulating layer through a laser windowing process; one end of the cover tape is attached to the binding area, and the other end of the cover tape is attached to the flexible circuit board; The conductive layer is attached to the copper exposure area through the first via hole, the conductive layer is attached to the structure to be grounded through the second via hole, and the copper exposure area is grounded; and bending the binding area to the back surface of the display area to form a display module comprising the display panel, the flexible circuit board, the cover tape and the structure to be grounded.

Description

Display module, manufacturing method thereof and display device Technical Field The invention relates to the technical field of display, in particular to a display module, a manufacturing method thereof and a display device. Background Along with the development of the electronic equipment towards light weight and high integration, the ultrasonic fingerprint module is used as a mainstream biological identification component, and the structural design of the ultrasonic fingerprint module has obvious influence on the overall performance of the equipment. The traditional ultrasonic fingerprint scheme adopts the design that an ultrasonic fingerprint module is directly attached to a copper exposure area of a main flexible circuit board (Main Flexible Printed Circuit Board, MFPC). In this way, in order to meet the bonding requirement of the ultrasonic fingerprint module, the MFPC needs to reserve a larger copper exposure area, which results in a larger layout area, thereby causing space redundancy of the MFPC and limiting the light and thin design of the electronic device. Disclosure of Invention The invention provides a display module, a manufacturing method thereof and a display device, which are used for reducing the layout area of a flexible circuit board and providing guarantee for light and thin design. In a first aspect, an embodiment of the present invention provides a display module, including: the display panel comprises a display area and a binding area bent to the back of the display area; The flexible circuit board is electrically connected with the binding area, and a copper exposure area is formed on one side of the flexible circuit board, which is away from the display area; The display device comprises a binding area, a cover band, a flexible circuit board, a display area, a first insulating layer, a conductive layer and a second insulating layer, wherein one end of the cover band is attached to the binding area, and the other end of the cover band is attached to one side of the flexible circuit board, which is away from the display area; The structure to be grounded is positioned on one side of the cover tape, which is away from the display area, wherein the structure to be grounded is electrically connected with the conductive layer through the second via hole, the copper exposing area is electrically connected with the conductive layer through the first via hole, and the copper exposing area is grounded. In one possible implementation manner, the copper exposing areas are arranged in one-to-one correspondence with the first through holes, and the orthographic projection of the copper exposing areas on the display area completely falls into the area range of the orthographic projection of the first through holes on the display area. In one possible implementation, the first via is one, and there is an overlapping area between the front projection of the first via on the display area and the front projection of the second via on the display area. In one possible implementation, the orthographic projection of the second via on the display area falls entirely within the area of the orthographic projection of the first via on the display area. In one possible implementation manner, the number of the copper exposing areas is at least two, and the orthographic projections of each copper exposing area on the display area are not overlapped with each other and are all grounded. In one possible implementation manner, the display driving integrated circuit is further arranged on one side of the binding area away from the display area, the front projection of the display driving integrated circuit on the display area and the front projection of the structure to be grounded on the display area are not overlapped, and the display driving integrated circuit is completely covered by the cover tape. In one possible implementation, the front projection of the structure to be grounded on the display area falls completely within the area of the front projection of the cover tape on the display area. In one possible implementation manner, the device further comprises a first conductive adhesive contained in the first via hole and a second conductive adhesive contained in the second via hole, wherein the structure to be grounded is electrically connected with the conductive layer through the second conductive adhesive, and the conductive layer is electrically connected with the copper exposure region through the first conductive adhesive. In one possible implementation manner, the structure to be grounded is one of an ultrasonic fingerprint module and a temperature control module. In a second aspect, an embodiment of the present invention further provides a display apparatus, including: a display module according to any one of the preceding claims. In a third aspect, an embodiment of the present invention further provides a method for manufacturing a display module, including: the first via hole is formed along the