Search

CN-122025225-A - Transparent conductive substrate, manufacturing method thereof, transparent display screen and transparent lamp strip

CN122025225ACN 122025225 ACN122025225 ACN 122025225ACN-122025225-A

Abstract

The invention discloses a transparent conductive substrate, a manufacturing method thereof, a transparent display screen and a transparent lamp strip, and belongs to the technical field of LED transparent display. The manufacturing method comprises the steps of preparing a transparent insulating film, a metal foil and a metal wire woven mesh, die-cutting the metal foil into a bonding pad through a die-cutting process, die-cutting the metal wire woven mesh into a strip-shaped metal wire woven mesh, and compositing the strip-shaped metal wire woven mesh and the strip-shaped metal wire woven mesh on the adhesive surface of the transparent insulating film, wherein the metal wire is in direct contact with the bonding pad of the metal foil or in indirect contact with the bonding pad through an adhesive layer, and fixing the bonding pad through rolling or lamination. The invention adopts the metal wire woven mesh to replace the traditional continuous copper foil as a main line, the gaps between the adjacent metal wires enable light to pass through, the light transmittance is obviously improved, a plurality of independent metal wires can release thermal stress independently in a high-temperature process, the wrinkles and dead folds are avoided, the die cutting composite process is adopted to replace the traditional etching, the copper material is saved by more than 40%, and the manufacturing cost is greatly reduced. The invention can be widely applied to the fields of transparent display screens, transparent lamp strips and other transparent conduction.

Inventors

  • RAN CHONGYOU

Assignees

  • 冉崇友

Dates

Publication Date
20260512
Application Date
20260329

Claims (10)

  1. 1. A method for manufacturing a transparent conductive substrate, comprising: Preparing a transparent insulating film, namely preparing a glued transparent insulating film; preparing a metal foil, namely preparing a metal foil without glue; preparing metal wires, namely, metal wire woven meshes; The metal foil without glue is cut into metal foil bonding pads without glue on a die cutter, the metal foil bonding pads without glue are compounded on the glue surface of a transparent insulating film with glue, then a metal wire woven net which is formed by die cutting a metal wire woven net into strips is compounded on the glue surface of the transparent insulating film with glue, the strip-shaped metal wire woven net is partially compounded on part of the metal foil bonding pads, the metal wires are in direct contact with the metal foil bonding pads, no glue exists between the metal wires and the metal foil bonding pads, and independent metal foil units are formed between the metal foil bonding pads, or part of the metal foil bonding pads are connected into combined metal foil units, and the rest of the metal foil bonding pads are independent metal foil units; laminating, namely rolling or laminating the whole roll, and laminating and fixing the glue among the metal wires, the metal foil and the transparent insulating film.
  2. 2. The method of claim 1, wherein the front surface of the substrate is free of solder resist, or the front surface of the substrate is locally provided with solder resist, wherein the solder resist is solder resist oil or a solder resist film, and the substrate is at least one transparent insulating film.
  3. 3. The method of manufacturing a transparent conductive substrate according to claim 1, wherein the transparent adhesive is a transparent adhesive, and the transparent adhesive is disposed in a partial region of one surface of the transparent insulating film or in an entire region of one surface of the transparent insulating film.
  4. 4. A method for manufacturing a transparent conductive substrate, comprising: Preparing a transparent insulating film, namely preparing a transparent insulating film without glue; preparing a metal foil, namely preparing a metal foil with glue; the metal wire is prepared by a metal wire woven net with one surface provided with glue, or/and a metal wire with a local surface provided with glue; The method comprises the steps of die cutting a metal foil with glue into a metal foil bonding pad with glue on a die cutting machine, compounding the glue surface of the metal foil bonding pad with glue on a transparent insulating film without glue, die cutting a metal wire woven net with glue on one side into a metal wire woven net with glue on one side, compounding the glue surface of the metal wire woven net with glue on the transparent insulating film without glue, compounding the glue surface of the metal wire woven net with glue on one side on part of the metal foil bonding pad without direct contact between the metal wire and the metal foil bonding pad, and setting the metal wire and the metal foil on the same side of the transparent insulating film; Or compounding the adhesive surface of the metal wires with adhesive on the local surface on a transparent insulating film without adhesive, wherein gaps are formed between each metal wire, then, the metal conductive paste is arranged on the local transparent insulating film or/and the local metal wires, the metal conductive paste and the metal wires are arranged on the same side surface of the transparent insulating film, the metal conductive paste is dried to form metal foil, part of the metal foil forms a metal foil bonding pad, or part of the metal foil is connected between the metal foil bonding pads, or part of the metal foil and the local metal wires form a combined metal foil bonding pad, or part of the metal foil and a plurality of metal wires are combined to form an interconnection net-shaped metal wire mesh; laminating, namely rolling or laminating the whole roll, and laminating and fixing the glue among the metal wires, the metal foil and the transparent insulating film.
  5. 5. The method of claim 4, wherein the front surface of the substrate is free of solder resist, or the front surface of the substrate is locally provided with solder resist, wherein the solder resist is solder resist oil or a solder resist film, and the substrate is at least one transparent insulating film.
  6. 6. The method of manufacturing a transparent conductive substrate according to claim 4, wherein the adhesive is transparent adhesive or not, the opaque region where the metal wire or/and the metal foil pad is overlapped with the transparent insulating film is provided with adhesive, and the transparent insulating film is provided with the remaining transparent region.
  7. 7. The method of claim 4, wherein the metal conductive paste is conductive copper paste or conductive silver paste.
  8. 8. A method for manufacturing a transparent conductive substrate, comprising: Preparing a transparent insulating film, namely preparing a transparent insulating film without glue; preparing a metal foil, namely preparing a metal foil with one side provided with glue; preparing a substrate, namely a single-sided substrate or a double-sided substrate; preparing metal wires, namely forming a metal wire woven net with one surface provided with glue; Manufacturing a flexible circuit module, namely manufacturing a flexible circuit by a single-sided substrate or a double-sided substrate through a traditional etching process, manufacturing a solder mask layer on one side of the flexible circuit, leaking a metal foil bonding pad area by the solder mask layer, and manufacturing glue on the other side to obtain the glued flexible circuit module; The method comprises the steps of die cutting a metal foil with glue on one side to form a metal foil bonding pad with glue on one side, compounding the glue surface of the metal foil bonding pad with glue on a transparent insulating film without glue, cutting a flexible circuit module with glue into a strip-shaped flexible module, compounding the glue surface of the flexible module with glue on the transparent insulating film without glue, die cutting a metal wire woven mesh with glue on one side to form a metal wire woven mesh with glue, compounding the glue surface of the metal wire woven mesh with glue on the insulating film without glue, compounding the metal wire woven mesh with glue on part of the metal foil bonding pad of the flexible circuit module with glue on one side, compounding the metal wire woven mesh with glue on the metal foil bonding pad with glue on one side, and setting the metal wire and the flexible module with glue on the same side of the insulating film; And pressing, namely rolling or laminating the whole roll, and pressing and fixing the metal wire, the flexible circuit module and the transparent insulating film by glue.
  9. 9. The method for manufacturing a transparent conductive substrate according to any one of claims 1 to 7, wherein the metal wire is a copper wire, an iron wire, an aluminum wire, a silver wire, a tin-plated copper wire or an alloy wire, the cross section of the metal wire is round, flat or abnormal, and the transparent insulating film is transparent PET or transparent PI.
  10. 10. A transparent electronic product is characterized by comprising the transparent conductive substrate according to any one of claims 1-9, wherein LED lamp beads or LEDs and control elements thereof are attached together through solder paste, after reflow soldering is performed at high temperature, metal wires and metal foil bonding pads are connected and conducted with the LED lamp beads or LEDs and the control elements thereof, the LED lamp beads or LEDs and the control elements thereof form a small-current single-period loop, the positive pole and the negative pole of the small-current single-period loop are respectively connected in parallel on a metal wire woven net, the metal wire woven net can bear large current, then a process edge is cut by a jig, and/or the metal wire woven net is cut into a transparent electronic product, wherein the transparent electronic product is a core part of a transparent display screen, or the transparent electronic product is a transparent LED lamp belt.

Description

Transparent conductive substrate, manufacturing method thereof, transparent display screen and transparent lamp strip Technical Field The invention relates to the technical field of LED transparent display, in particular to a transparent conductive substrate, a manufacturing method thereof, a transparent display screen and a transparent lamp strip. Background The transparent conductive substrate is a core component of photoelectric devices such as a transparent display screen, a transparent lamp strip and the like, and the performance of the transparent conductive substrate directly determines the light transmittance, the conductive capability and the reliability of the product. Taking a transparent LED display screen as an example, positive and negative electrode main lines are required to be distributed on a transparent substrate to bear driving large current, and control signals are transmitted through a small current signal line to control the display effect of the LED display screen, so that the display function is realized and meanwhile, the higher light transmittance is kept. There are a large number of transparent display screens such as crystal film screens, hole screens, glass screens, holographic screens, etc. The existing transparent circuit board is manufactured mainly by adopting a chemical etching process, and mainly comprises the following schemes: in the first scheme, the adhesive base material is provided. And (3) attaching the whole copper foil to the transparent insulating material through an adhesive to prepare a glue base material, and then forming a conductive circuit through procedures such as pattern transfer, etching, film stripping and the like. The copper foil and the adhesive in the non-wiring area are dissolved and removed after etching, leaving the transparent insulating material, thereby producing a transparent conductive substrate. Scheme II, no adhesive base material. After surface treatment is carried out on the transparent insulating material, a layer of copper foil is manufactured by adopting a sputtering or vacuum copper plating process, a glue-free base material is obtained, and a circuit is formed by adopting an etching process, so that the transparent conductive substrate is manufactured. And thirdly, combining the base materials. And attaching the traditional circuit board module to the transparent insulating layer through an adhesive, and combining to prepare the transparent conductive substrate. However, the above prior art has the following technical problems in practical application: 1, the light transmittance of the main line area is low. In order to bear large current, the positive and negative electrode main lines must use wider continuous copper foil, and the copper foil is completely opaque, which becomes a bottleneck for improving the light transmittance of the whole plate. Although the non-line region can be made transparent by etching, the low light transmittance of the main line region, which is a necessary channel for current transmission, severely restricts the overall transparent effect. 2, The high temperature process results in wrinkling or even breaking of the copper foil. After the positive and negative electrode main line copper foil is attached to a transparent insulating material (such as a thermoplastic film of PET) and in the high-temperature links of subsequent welding and the like, the shrinkage rate of the transparent insulating material is large and the shrinkage rate of the copper foil is small due to the difference of the heat shrinkage rates of the two materials, so that the main line copper foil is wrinkled. Even if the wrinkles are temporarily flattened through the flattening treatment in the follow-up process, permanent dead folds are formed at the positions of the wrinkles, the internal lattice structure of the copper foil is damaged, becomes brittle and hard, is extremely easy to break in the use process or during slight bending, and seriously influences the reliability and the service life of the product. And 3, the material waste is serious, and the cost is high. The chemical etching process needs to etch and dissolve most of copper after the whole copper is coated, and the utilization rate of the copper is usually less than 50%, so that a large amount of noble metal is wasted. Meanwhile, the etching process is complex, various chemical liquid medicines are involved, the environmental protection treatment cost is high, and the overall manufacturing cost is high. Disclosure of Invention The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, the transparent conductive substrate, the transparent display screen and the transparent lamp strip are high in material utilization rate, high in yield and low in manufacturing cost. The technical scheme adopted for solving the technical problems is as follows: In a first aspect, an embodiment of the present invention provides a metho