CN-122026050-A - Double-cavity high-heat-conductivity phase-change integrated heat dissipation assembly for phased array antenna and manufacturing method thereof

CN122026050ACN 122026050 ACN122026050 ACN 122026050ACN-122026050-A

Abstract

The invention discloses a phase-change integrated heat dissipation assembly with double cavities for phased array antennas and a manufacturing method thereof. The single heat dissipation module comprises an end cover, 2 high heat conduction bottom sealing plates, a phase change cavity, 2 high heat conduction cavities and 2 high heat conduction core materials, wherein the phase change cavity penetrates through the cold and hot ends and is filled with the encapsulated phase change materials, the high heat conduction cavities are arranged on two sides of the phase change cavity, and the high heat conduction core materials are filled in the cavities. The heat dissipation assembly adopts the heat dissipation module with the integrated double-cavity high heat conduction and phase change, realizes the rapid and uniform heat transfer of the TR assembly, ensures that the heat transfer efficiency of the uniform temperature is faster, is respectively attached to the TR assembly on the hot end surface of the heat dissipation module, can realize the rapid heat transfer of the chip in the TR module of the phased array antenna, is used for uniformly transferring the heat, has a phase change cavity under a heat source, is more conducive to temperature control, and is suitable for application scenes of ultra-high heat sources and ultra-high power.

Inventors

HE YUN

Assignees

西安聚变材料科技有限公司

Dates

Publication Date: 20260512
Application Date: 20241111

Claims (7)

1. The dual-cavity high-heat-conductivity phase-change integrated heat dissipation assembly for the phased array antenna is characterized by comprising a plurality of heat dissipation modules with different channel numbers, wherein each heat dissipation module comprises an end cover, 2 high-heat-conductivity bottom sealing plates, a phase-change cavity, 2 high-heat-conductivity cavities and 2 high-heat-conductivity core materials, the phase-change cavity is divided into a cold end and a hot end and is provided with packaged phase-change materials in a penetrating manner, the high-heat-conductivity cavities are arranged on two sides of the phase-change cavity, and the high-heat-conductivity core materials are arranged in the cavities.
2. The heat dissipating assembly of claim 1 wherein the heat dissipating module is a metal material comprising aluminum alloy and its composite, copper alloy and its composite.
3. The heat dissipating assembly of claim 1 wherein the end of the high thermal conductivity cavity is the hot end and the other end is the cold end.
4. The solid state high thermal conductivity core material of claim 1, wherein: (1) The high heat conduction core material is a graphene pressed product, pyrolytic graphite or a diamond product (a blocky diamond product and a diamond product bonded by particles); (2) The high heat conduction core material is subjected to heat conduction modification in the thickness direction so that the Z heat conduction rate is not lower than 30w.m -1 ·k -1 , and surface heat interface treatment is performed, so that the contact thermal resistance is reduced.
5. The high thermal conductivity core material according to claim 4, wherein the high thermal conductivity core material is filled into the high thermal conductivity cavities at both sides, and the high thermal conductivity core material and the cavities are integrally welded together.
6. The heat sink assembly of claim 1, wherein the phase change material is characterized by: (1) The phase change materials comprise organic phase change materials (paraffin-based phase change materials, sugar alcohol phase change materials and ester phase change materials), inorganic phase change materials (crystalline hydrated salt phase change materials, fused salt phase change materials, metal or alloy phase change materials) and composite phase change materials; (2) The phase change material is encapsulated, and the encapsulating material comprises a high heat conduction metal material, a polymer material, a ceramic material and nano particles, and the encapsulating mode comprises but is not limited to microcapsule encapsulation and solid encapsulation.
7. The phase change material of claim 6, wherein the phase change material is filled by opening from either one of the cold end and the hot end, filling the encapsulated phase change material into the phase change cavity from the opening, and welding and sealing the phase change material after filling.

Description

Double-cavity high-heat-conductivity phase-change integrated heat dissipation assembly for phased array antenna and manufacturing method thereof Technical Field The invention belongs to the field of thermal management, and particularly relates to a dual-cavity high-heat-conductivity phase-change integrated heat dissipation assembly for a phased array antenna and a manufacturing method thereof. Background The TR module is a key factor in the weapon development process, in that it can maintain the heat source chip in a safe and efficient operating temperature range under a long-time, high-strength operating environment. The heat-radiating module is inserted into the groove of the phase-change cold plate, and in the structure, the heat-radiating module plays a role of quick heat conduction, and the heat is transferred to the phase-change material in the phase-change cold plate for phase-change heat absorption. For the high-power phased array antenna, if a traditional heat dissipation mechanism is used, the temperature control is affected, the use of the high-power phased array antenna is not facilitated, the traditional phased array antenna is difficult to dissipate heat, the heat dissipation is uneven, the local temperature is too high, the whole temperature difference is large, the high temperature gradient exists in the far-end refrigeration, the internal parts of the antenna are easily damaged due to overheating, and the design requirements of miniaturization and light weight of weaponry cannot be met. In order to solve the problems, meet the heat dissipation requirement of weaponry and reduce the temperature gradient, the invention provides a high-heat-conductivity phase-change integrated heat dissipation assembly for phased array antenna chip heat management and a preparation method thereof. By optimizing the heat transfer path and the heat dissipation structure, heat can be quickly transferred and the application scene of ultra-high heat source and ultra-high power can be satisfied. Disclosure of Invention The invention aims to solve the problems in the background art, and provides a double-cavity high-heat-conductivity phase-change integrated heat dissipation assembly for a phased array antenna and a manufacturing method thereof. This cooling module is through setting up two high heat conduction cavity and a phase transition chamber simultaneous working, has less conduction thermal resistance and temperature gradient, reduces the temperature by a wide margin, has the effect of forced refrigeration, helps realizing the temperature control of chip, has less volume, can metabolize more heat, satisfies current weapon equipment miniaturization, light-weighted demand, selects simultaneously to encapsulate phase change material, helps accelerating phase change material and external environment's heat exchange rate, promotes phase change reaction efficiency. In order to solve the problems, the technical scheme of the invention is as follows: the scheme indicates a phase change integration radiating component with high heat conduction for phased array antenna double cavities, this radiating component comprises a plurality of radiating module of different passageway numbers, and single radiating module comprises end cover, 2 high heat conduction end shrouding, phase change chamber, 2 high heat conduction chamber and 2 high heat conduction core materials, and the phase change chamber runs through cold and hot end and fills encapsulated phase change material, and 2 high heat conduction chamber symmetry sets up in phase change chamber both sides and fills there is high heat conduction core material. The invention relates to a phase-change heat radiation module, which comprises the following technical scheme: 1. Processing a base seat blank 1 and a top cover blank 2 through CNC, processing the sizes of the inner cavities in place, enabling a phase-change cavity 7 to penetrate through the cold and hot ends of the heat dissipation module, reserving machining allowance on the outer layer, and processing 2 high-heat-conductivity base sealing plates, 2 phase-change end covers and a cold end cover simultaneously; 2. two sides of the cold end phase change cavity are provided with penetrating hollow cylinders which are used for being connected with a phased array antenna; 3. According to the size of the cavity, a high heat conduction core material is selected, a heat conduction core layer with a certain thickness is formed through hot pressing, heat conduction modification in the thickness direction is carried out, the Z heat conduction rate is not lower than 30w.m -1·k-1, surface heat interface treatment is carried out, and contact thermal resistance is reduced. 4. Symmetrically tiling the modified high heat conduction core material 9 on the first high heat conduction cavity 3 and the second high heat conduction cavity 5, respectively buckling and welding and packaging 2 high heat conduction bottom sealing plates with the