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CN-122026076-A - Broadband laminated patch antenna unit suitable for phased array system, preparation method and application

CN122026076ACN 122026076 ACN122026076 ACN 122026076ACN-122026076-A

Abstract

The invention discloses a broadband laminated patch antenna unit suitable for a phased array system, which comprises a parasitic radiation layer and a main radiation layer from top to bottom, wherein the parasitic radiation layer comprises a dielectric plate and a rectangular parasitic patch formed on the dielectric plate, the main radiation layer comprises a multilayer rewiring structure, the top layer of the main radiation layer is patterned into an E-shaped radiation patch, the E-shaped radiation patch and the E-shaped radiation patch are laminated and attached through insulating glue, and the working bandwidth of the antenna unit is remarkably expanded through electromagnetic coupling. The invention also discloses a preparation method of the antenna unit, an antenna array comprising the antenna unit and a phased array front-end module for three-dimensional stacking and packaging through an heterogeneous integration process. The invention has the characteristics of low profile, large bandwidth, easy integration with advanced packaging technology and the like, and is suitable for a high-density phased array system.

Inventors

  • ZHOU PEIGEN
  • HAN ZIYI
  • YAO DAYUE
  • ZHANG HAOCHI

Assignees

  • 东南大学

Dates

Publication Date
20260512
Application Date
20260327

Claims (10)

  1. 1. A broadband laminated patch antenna unit suitable for a phased array system, characterized by comprising a parasitic radiation layer (110), an insulating adhesive layer (120) and a main radiation layer (130) which are laminated from top to bottom; The parasitic radiation layer (110) comprises a first dielectric substrate (111) and an upper-layer rectangular parasitic patch (112) formed on the upper surface of the first dielectric substrate; The main radiating layer (130) comprises a plurality of rewiring layers (131), and the top metal of the plurality of rewiring layers (131) is patterned to form a bottom E-type radiating patch (132); The parasitic radiation layer (110) and the main radiation layer (130) are adhered and fixed through an insulating adhesive layer (120); The working bandwidth of the antenna is expanded between the upper rectangular parasitic patch (112) and the bottom E-type radiating patch (132) through electromagnetic coupling.
  2. 2. The broadband laminated patch antenna unit suitable for a phased array system according to claim 1, wherein the first dielectric substrate (111) is a high-frequency plate, two parallel longitudinal slits are formed on the bottom layer E-shaped radiation patch (132), the slits are formed through an etching process, and the centers of the upper layer rectangular parasitic patch (112) and the bottom layer E-shaped radiation patch (132) are aligned with each other.
  3. 3. The broadband laminated patch antenna unit for a phased array system according to claim 1, wherein the multilayer rewiring layer (131) comprises at least two copper metal layers, an upper metal layer for patterning a bottom E-type radiating patch (132), and a lower metal layer for signal interconnection and rewiring, wherein the metal layers are isolated by polyimide dielectric layers and electrically connected by polyimide metal vias, and the lower metal layer comprises signal routing traces, signal distribution traces, and radio frequency ground of the antenna.
  4. 4. Broadband laminated patch antenna unit suitable for phased array systems according to claim 1, characterized in that the insulating glue layer (120) is an epoxy glue with a thickness between 10 μm and 100 μm and a dielectric constant between 2.0 and 4.0.
  5. 5. An antenna array comprising the wideband laminated patch antenna units as claimed in any one of claims 1 to 4, wherein the wideband laminated patch antenna units are integrated in a periodic arrangement to form a one-dimensional linear array or a two-dimensional planar array, the multi-layer rewiring layer (131) of the main radiation layer (130) is a shared interconnection substrate, a plurality of bottom-layer E-shaped radiation patches (132) are arrayed on the shared interconnection substrate, an independent upper-layer rectangular parasitic patch (112) is correspondingly arranged above each bottom-layer E-shaped radiation patch (132), the arrangement interval of the wideband laminated patch antenna units is half a wavelength, and each bottom-layer E-shaped radiation patch (132) is connected to a bonding pad of a radio frequency chip through an independent upper-layer metal layer, a lower-layer metal layer wiring and polyimide metal via below the wideband laminated patch antenna unit.
  6. 6. A method of making a wideband laminated patch antenna unit as claimed in any one of claims 1 to 4, including the steps of: Step 201, preparing a main radiation layer (130), sequentially forming a multilayer rewiring layer (131) comprising a lower metal layer, an upper metal layer, a polyimide dielectric layer and a via hole on a resin carrier through deposition, photoetching and electroplating processes, and patterning the upper metal layer to form a bottom E-type radiation patch (132); step 202, preparing a parasitic radiation layer (110), and forming an upper layer rectangular parasitic patch (112) on the upper surface of a first dielectric substrate (111) in a patterning way; And 203, coating an insulating adhesive layer (120) on the surface of the upper metal layer of the main radiation layer (130), aligning the parasitic radiation layer (110) with the main radiation layer (130), aligning the centers of the upper rectangular parasitic patch (112) and the bottom E-type radiation patch (132), and laminating and curing through the insulating adhesive layer (120) to complete lamination integration.
  7. 7. The method of claim 6, wherein the press-fit curing includes applying pressure and heating to cure the dielectric paste layer (120) in step 203, and wherein the resin carrier is a chip feed layer (140) for providing a feed input to the antenna element in step 201.
  8. 8. A phased array front end module, comprising: The antenna array of claim 5; And And the chip feed layer (140) is connected with the antenna array, at least one beam forming chip and at least one mixer chip are packaged in the chip feed layer (140), and the chip feed layer is connected with external solder balls through a vertical interconnection structure (141).
  9. 9. The phased array front end module of claim 8, wherein the chip feed layer (140) comprises a resin substrate with periodic openings and filled with metal to form a TMV structure for achieving vertical interconnection between the antenna array and an external signal substrate.
  10. 10. The phased array front end module of claim 9, wherein the bottom of the TMV structure is ball-bumped in an array to form a ball grid array package, the ball grid array package being electrically connected to an underlying multilayer signal substrate by reflow soldering.

Description

Broadband laminated patch antenna unit suitable for phased array system, preparation method and application Technical Field The invention relates to millimeter wave communication and radio frequency integrated circuit technology, in particular to a broadband laminated patch antenna unit suitable for a phased array system, a preparation method and application. Background With the large-scale commercial laying of 5G technology and 6G research, the demand of communication equipment for spectrum resources is increasing, and millimeter wave high frequency band becomes a key potential frequency band for realizing ultra-high speed wireless communication due to the abundant available bandwidth. However, the development of millimeter wave high-band communication systems is also facing a number of challenges, mainly due to the fact that millimeter wave high-band is subject to higher atmospheric attenuation than low-frequency signals. Secondly, the millimeter wave high-frequency band transmitter is limited by circuit performance, and high output power is difficult to obtain in a single channel. The two points lead to the limit of the transmission distance of the millimeter wave high-frequency band communication system, so that the phased array technology becomes an effective solution. The antenna unit array is helpful to improve the beam gain, and the phased array technology can realize the digital control beam synthesis, and improve the signal to noise ratio by optimizing the antenna angle of the transceiver system, thereby expanding the communication transmission distance. Third, because millimeter-wave high-band wavelengths are in millimeter-scale, the size of the single channel of the radio frequency device is greatly limited, and is difficult to implement using discrete chips on a Printed Circuit Board (PCB), and each separate transceiver chip requires its own components, possibly including mixers, switches, etc., resulting in a phased array system that is difficult to control in cost. For phased array systems, multiple transmit-receive channels need to be integrated in a limited area, and extremely high requirements are placed on system architecture, interconnection technology, heat dissipation design and the like. In 2016, DEAN MALTA from U.S. RTI international proposes a heterogeneous 3D integrated millimeter wave high-frequency band phased array radar based on SiGe BiCMOS beam forming chips, and the system integrates 64 patch antenna units, thereby providing support for the feasibility of the advanced 3D heterogeneous integration method of millimeter wave phased array technology. 2019. The year, ahmed s.h. Ahmed from san banla division, california university, usa reported a millimeter wave high band transmitter and receiver employing an isomerically integrated InP HBT and Si CMOS, the transmitter having a saturated output power of 16dBm at 90GHz and the receiver channel providing a small signal gain of 26dB at 58.6 mW dc power. In 2021, yang Xiao at the university of Shanghai transportation microwave and radio frequency technology center proposed a 94 GHz high performance, highly compact frequency modulated continuous wave radar sensor with an output power of 22 dBm, which provides a dynamic range of 55 dB at 2 m. 2022. In the year, ching-WEN CHIANG of Taiwan Yangming transportation university introduces a high-cost-performance millimeter wave high-frequency band antenna level package adopting the IPD and PCB technology, and the manufactured package antenna realizes the gain of 3.75dBi and the impedance bandwidth of-10 dB of 1.9GHz at 94.5 GHz. It can be seen that the research and realization of high-integration, miniaturized wideband phased array antenna and corresponding phased array system by means of heterogeneous integration technology has very important practical significance for solving the great challenges faced by millimeter wave high-frequency band communication systems. Disclosure of Invention The invention aims to provide a broadband laminated patch antenna unit suitable for a phased array system, a preparation method and application thereof, and aims to solve the problems that the existing millimeter wave high-frequency band antenna design and high-precision packaging interconnection process are poor in compatibility and difficult to integrate, and the conventional structure is difficult to control the precise coupling distance in a millimeter wave band. The technical scheme for realizing the purpose of the invention is that the broadband laminated patch antenna unit suitable for the phased array system comprises a parasitic radiation layer (110), an insulating adhesive layer (120) and a main radiation layer (130) which are laminated from top to bottom; The parasitic radiation layer (110) comprises a first dielectric substrate (111) and an upper-layer rectangular parasitic patch (112) formed on the upper surface of the first dielectric substrate; The main radiating layer (130) comprises a plurali