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CN-122026079-A - Low-dielectric low-loss panel antenna manufacturing method based on laser activation chemical plating and product thereof

CN122026079ACN 122026079 ACN122026079 ACN 122026079ACN-122026079-A

Abstract

The invention discloses a manufacturing method of a low-dielectric low-loss flat antenna based on laser activation chemical plating and a product thereof, relating to the technical field of electronic component manufacturing, wherein the manufacturing method comprises the steps of firstly selecting plastic particles with low dielectric constant and low dielectric loss, and preparing a flat film or plate by extrusion molding; then carrying out laser scanning on an antenna circuit pattern preset on the surface of the antenna circuit pattern to form an activation area; the manufacturing method provided by the invention is used for manufacturing the flat antenna by extrusion molding, the material cost is far lower than that of an LDS special material, and the obtained flat antenna product has excellent performance, stable overall process and good consistency, meets the high-performance requirement and has the cost advantage.

Inventors

  • CHEN SHE

Assignees

  • 心之光电子科技(广东)有限公司

Dates

Publication Date
20260512
Application Date
20260409

Claims (10)

  1. 1. The manufacturing method of the low-dielectric low-loss panel antenna based on the laser activated electroless plating is characterized by comprising the following steps of: s1, selecting plastic particles with a dielectric constant Dk less than or equal to 4.0@10GHz and a dielectric loss Df less than or equal to 0.008@10GHz, and preparing a planar film or plate by extrusion molding; s2, performing laser scanning activation on the surface of the film or the plate according to a preset antenna circuit pattern to form an activation area, and obtaining a base material after laser activation; S3, sequentially carrying out oil removal, ultrasonic cleaning, chemical roughening, palladium activation and reduction treatment on the base material after laser activation; S4, selectively depositing a metal copper layer in an activation area through an electroless copper plating process to form a conductive antenna circuit; s5, performing anti-oxidation protection treatment on the conductive antenna circuit, wherein the treatment mode is passivation, nickel plating passivation hole sealing or nickel plating gold hole sealing; s6, cutting and testing to obtain the panel antenna.
  2. 2. The method for manufacturing a low dielectric low loss planar antenna based on laser activated electroless plating according to claim 1, wherein said plastic particles are at least one of PPO, LCP, PPS, SPS, PC.
  3. 3. The method for manufacturing the low-dielectric low-loss planar antenna based on the laser activated electroless plating according to claim 2, wherein the plastic particles are at least one of PPO, LCP, PPS, SPS for manufacturing the planar antenna of the WiFi 7 router and PC or SPS for manufacturing the planar antenna of the WiFi 6 router.
  4. 4. The method for manufacturing a low dielectric low loss planar antenna based on laser activated electroless plating according to claim 1, wherein the extrusion molding in S1 is a continuous extrusion molding process.
  5. 5. The method for manufacturing a low dielectric low loss planar antenna based on laser activated electroless plating according to claim 1, wherein said electroless copper plating in S4 is an additive process.
  6. 6. The method for manufacturing a low dielectric low loss planar antenna based on laser activated electroless plating according to claim 1, wherein the oxidation protection treatment in S5 is a separate process after electroless copper plating is completed.
  7. 7. A low dielectric low-loss planar antenna based on laser activated electroless plating, characterized in that it is prepared by a low dielectric low-loss planar antenna manufacturing method based on laser activated electroless plating as described in any one of claims 1-6.
  8. 8. The low-dielectric low-loss planar antenna based on laser activated electroless plating of claim 7, wherein the substrate of the planar antenna is plastic particles with a dielectric constant Dk less than or equal to 4.0@10GHz and a dielectric loss Df less than or equal to 0.008@10GHz, and the plastic particles are at least one of PPO, LCP, PPS, SPS, PC.
  9. 9. The low dielectric low loss planar antenna based on laser activated electroless plating as claimed in claim 7, wherein the planar antenna wire is formed by laser activation and electroless copper plating and is protected from oxidation.
  10. 10. The low-dielectric low-loss planar antenna based on laser activated electroless plating of claim 7, wherein the antenna is planar in structure, has lower dielectric constant and lower dielectric loss than the FR4 substrate PCB antenna, and is suitable for WiFi 6 and WiFi 7 router terminals.

Description

Low-dielectric low-loss panel antenna manufacturing method based on laser activation chemical plating and product thereof Technical Field The invention relates to the technical field of electronic component manufacturing, in particular to a manufacturing method of a low-dielectric low-loss panel antenna based on laser activation electroless plating and a product thereof. Background With the rapid development of wireless communication technology, high-bandwidth and high-rate communication protocols such as WiFi 6 and next-generation WiFi 7 are becoming popular. These protocols place far higher demands on the signal transmission performance, loss control, manufacturing cost, and mass throughput of router antennas than before. The flat antenna is a preferred scheme of the built-in antenna of the router because of simple structure and easy integration. Currently, about 95% of router panel antennas in the industry are manufactured using FR4 (glass fiber reinforced epoxy) board materials. However, the dielectric constant (Dk, typically 4.2-4.8) and dielectric dissipation factor (Df, typically 0.015-0.02) of the FR4 material are high, and the signal transmission loss in the middle-high frequency band (e.g. 5GHz, 6 GHz) is significant, so that it is difficult to fully exert the high-rate and low-delay performance required by WiFi 6 and WiFi 7. In addition, the FR4 antenna is manufactured by adopting an etching reduction method process, and the process has the problems of low copper foil utilization rate (a large amount of copper is wasted by etching), high environmental protection pressure caused by generating a large amount of copper-containing etching waste liquid, high comprehensive cost caused by complex process flow and the like. While the traditional Laser Direct Structuring (LDS) antenna has better performance, the special LDS plastic particles are expensive, and the investment of laser equipment and a plating process is large, so that the cost of a single piece is too high, and the single piece is difficult to popularize in a large area in the router market with sensitive cost. Therefore, it is needed to provide a method for manufacturing a low-dielectric low-loss planar antenna based on laser activated electroless plating and a product thereof, so as to solve the problems of high dielectric loss, high cost, unstable process and unsuitability for mass production of the conventional planar antenna. Disclosure of Invention The invention aims to provide a manufacturing method of a low-dielectric low-loss flat antenna based on laser activation chemical plating and a product thereof, which are used for solving the problems of high dielectric loss, high cost, unstable process and unsuitability for mass production of the conventional flat antenna. In order to achieve the purpose, the invention provides the following technical scheme that the manufacturing method of the low-dielectric low-loss panel antenna based on laser activated electroless plating specifically comprises the following steps: s1, selecting plastic particles with a dielectric constant Dk less than or equal to 4.0@10GHz and a dielectric loss Df less than or equal to 0.008@10GHz, and preparing a planar film or plate by extrusion molding; s2, performing laser scanning activation on the surface of the film or the plate according to a preset antenna circuit pattern to form an activation area, and obtaining a base material after laser activation; S3, sequentially carrying out oil removal, ultrasonic cleaning, chemical roughening, palladium activation and reduction treatment on the base material after laser activation; S4, selectively depositing a metal copper layer in an activation area through an electroless copper plating process to form a conductive antenna circuit; S5, performing anti-oxidation protection treatment on the conductive antenna circuit, wherein the treatment mode is passivation, nickel plating passivation hole sealing or nickel plating gold hole sealing, so that the copper layer is prevented from being oxidized, and the circuit reliability is improved; s6, cutting and testing to obtain the panel antenna. Further, the plastic particles are at least one of polyphenyl ether (PPO), liquid Crystal Polymer (LCP), polyphenylene sulfide (PPS), syndiotactic Polystyrene (SPS) and Polycarbonate (PC), and have lower dielectric constant and dielectric loss, so that the signal transmission loss of the antenna can be remarkably reduced. Further, for manufacturing of the WiFi 7 router flat antenna, the plastic particles are at least one of polyphenyl ether (PPO), liquid Crystal Polymer (LCP), polyphenylene sulfide (PPS) and Syndiotactic Polystyrene (SPS), and for manufacturing of the WiFi 6 router flat antenna, the plastic particles are Polycarbonate (PC) or polyphenylene sulfide (PPS). Further, the extrusion molding in S1 is a continuous extrusion molding process, which is used for realizing large-scale continuous production of the planar antenna. Fur