CN-122026101-A - Planar ultra-wideband tightly-coupled dual-polarized phased array antenna for low-altitude communication

CN122026101ACN 122026101 ACN122026101 ACN 122026101ACN-122026101-A

Abstract

The invention relates to a planar ultra-wideband tightly-coupled dual-polarized phased array antenna for low-altitude communication, which belongs to the technical field of wireless energy transmission and comprises a first dielectric substrate, a second dielectric substrate, a third dielectric substrate, a fourth dielectric substrate, a fifth dielectric substrate, a sixth dielectric substrate, a short-circuit post, a feed post and an open-circuit post which are arranged from bottom to top, wherein a metal floor is arranged on the lower surface of the first dielectric substrate, a metal circular ring is arranged on the lower surface of the third dielectric substrate, a dipole patch and a microstrip feed line are arranged on the upper surface of the third dielectric substrate, a metal cross strip is arranged on the upper surface of the fourth dielectric substrate, an upper super-surface is arranged on the upper surface of the sixth dielectric substrate, a lower super-surface is arranged on the lower surface of the sixth dielectric substrate, the short-circuit post penetrates through the first dielectric substrate, the second dielectric substrate, the third dielectric substrate and the dipole patch, the feed post penetrates through the first dielectric substrate, the second dielectric substrate, the third dielectric substrate and the microstrip feed line, and the open-circuit post penetrates through the second dielectric substrate, the third dielectric substrate and the microstrip feed line.

Inventors

LI DAJIANG
LIANG CHUN
HU KUNZHI
CHEN SIHONG
CHEN ZHIYUAN
YU YAQING

Assignees

重庆邮电大学

Dates

Publication Date: 20260512
Application Date: 20260326

Claims (8)

1. A planar ultra-wideband tightly-coupled dual-polarized phased array antenna for low-altitude communication is characterized by comprising a first dielectric substrate, a second dielectric substrate, a third dielectric substrate, a fourth dielectric substrate, a fifth dielectric substrate, a sixth dielectric substrate, a short-circuit column, a feed column and an open-circuit column which are arranged from bottom to top, wherein a metal floor is arranged on the lower surface of the first dielectric substrate, a metal circular ring is arranged on the lower surface of the third dielectric substrate, a dipole patch and a microstrip feeder are arranged on the upper surface of the third dielectric substrate, a metal cross strip is arranged on the upper surface of the fourth dielectric substrate, an upper super-surface is arranged on the upper surface of the sixth dielectric substrate, a lower super-surface is arranged on the lower surface of the sixth dielectric substrate, the short-circuit column penetrates through the first dielectric substrate, the second dielectric substrate, the third dielectric substrate and the dipole patch, the feed column penetrates through the first dielectric substrate, the second dielectric substrate, the third dielectric substrate and the microstrip feeder, and the open-circuit column penetrates through the second dielectric substrate, the third dielectric substrate and the microstrip feeder.
2. The planar ultra-wideband tightly-coupled dual-polarized phased array antenna for low-altitude communication of claim 1, wherein the first dielectric substrate, the second dielectric substrate, the third dielectric substrate, the fourth dielectric substrate, the fifth dielectric substrate, the sixth dielectric substrate and the metal floor are formed by cutting off quarter circles from square four corners respectively, so that a shape formed by alternately connecting four straight sides with four circular arc sides is obtained.
3. The planar ultra-wideband tightly-coupled dual-polarized phased array antenna for low-altitude communication of claim 2, wherein the dipole patches are formed by arranging 4 identical pentagonal patches at a certain distance relatively, and the pentagonal patches are connected with 3 circular rings relative to the outer side of the third dielectric substrate and used for penetrating through a short-circuit column.
4. The planar ultra-wideband tightly-coupled dual-polarized phased array antenna for low-altitude communication of claim 3, wherein the total number of microstrip feed lines is 4, and the microstrip feed lines are respectively arranged at the centers of four straight edges of the third dielectric substrate.
5. The planar ultra-wideband tightly-coupled dual-polarized phased array antenna for low-altitude communication of claim 4, wherein the total number of the short-circuit columns is 4, each group of 3 short-circuit columns penetrates through 3 circular rings, the first dielectric substrate, the second dielectric substrate and the third dielectric substrate of 4 pentagonal patches respectively.
6. The planar ultra-wideband tightly-coupled dual-polarized phased array antenna for low-altitude communication of claim 5, wherein the total number of feed posts is 2, and the feed posts respectively penetrate through 2 microstrip feed lines, and the first dielectric substrate, the second dielectric substrate and the third dielectric substrate.
7. The planar ultra-wideband tightly-coupled dual-polarized phased array antenna for low-altitude communication of claim 6, wherein the number of open-loop columns is 2, 2 microstrip feed lines respectively penetrate through the open-loop columns, and the second dielectric substrate and the third dielectric substrate, and the open-loop columns are respectively and symmetrically distributed with the feed columns at intervals of dipole patches.
8. The planar ultra-wideband tightly-coupled dual-polarized phased array antenna for low-altitude communication of claim 7, wherein the cross edge of the metal cross strip is opposite to the four circular arc edges of the fourth dielectric substrate.

Description

Planar ultra-wideband tightly-coupled dual-polarized phased array antenna for low-altitude communication Technical Field The invention belongs to the technical field of wireless energy transmission, and relates to a planar ultra-wideband tightly-coupled dual-polarized phased array antenna for low-altitude communication. Background Under the push of space-ground cooperative networks such as low-orbit satellites and unmanned aerial vehicles, the requirements of modern communication systems on spectrum utilization efficiency and multifunctional integration are increasing, and therefore, the requirements on ultra-wideband array antennas capable of realizing broadband coverage on a single physical aperture are also rapidly increasing. However, when the frequency band of the conventional array antenna is widened, physical limits such as grating lobe appearance, impedance mismatch and the like are often faced, and a thick dielectric layer is generally required to be introduced for suppressing floor reflection, so that low-profile characteristics and wide-angle scanning performance are sacrificed. To solve these contradictions, planar ultra-wideband tightly coupled dual polarized phased arrays are applied in modern radio frequency systems. The tightly coupled antenna array breaks through the inherent cognition that mutual coupling among array elements is harmful, and the inductance introduced by the floor is counteracted by intentionally enhancing the capacitive coupling among the array elements, so that smooth impedance characteristics are realized in an extremely wide frequency band. Meanwhile, the introduction of dual polarization design can obviously improve the channel capacity, inhibit multipath effect and enhance the anti-interference capability of the system. Furthermore, in most tightly coupled array antennas, broadband angular scanning can be achieved by a variety of techniques, such as introducing artificial electromagnetic supersurfaces with strong dispersive properties to provide broadband controllable phase compensation. However, the current dual-polarized tightly coupled array still has a bottleneck in the design of the feed network, and often relies on a huge external broadband power divider network, resulting in crowding of wires and limited port isolation. Therefore, in order to break through the mutual constraint among bandwidth, profile height and large-angle scanning performance, the feed topology and parasitic coupling compensation mechanism of the antenna need to be further innovated and optimized. Disclosure of Invention In view of the above, the invention aims to provide a planar ultra-wideband tightly-coupled dual-polarized phased array antenna for low-altitude communication, which breaks through the mutual constraint of the traditional ultra-wideband antenna between bandwidth, profile height and large-angle scanning performance. The antenna not only can realize ultra-wide impedance bandwidth of up to 2.5 octaves in a low-profile structure smaller than 10mm, but also can keep stable impedance matching in wide angle scanning ranges of +/-60 degrees of an E plane and an H plane. In addition, the antenna structure effectively reduces the complexity of a feed network and a matching layer, ensures good dual polarization characteristics and port isolation, and greatly improves the integration level of the multifunctional radio frequency front end. In order to achieve the above purpose, the present invention provides the following technical solutions: A planar ultra-wideband tightly-coupled dual-polarized phased array antenna for low-altitude communication comprises a first dielectric substrate, a second dielectric substrate, a third dielectric substrate, a fourth dielectric substrate, a fifth dielectric substrate, a sixth dielectric substrate, a short-circuit post, a feed post and an open-circuit post which are arranged from bottom to top, wherein a metal floor is arranged on the lower surface of the first dielectric substrate, a metal circular ring is arranged on the lower surface of the third dielectric substrate, a dipole patch and a microstrip feeder are arranged on the upper surface of the third dielectric substrate, a metal cross strip is arranged on the upper surface of the fourth dielectric substrate, an upper-layer super-surface is arranged on the upper surface of the sixth dielectric substrate, a lower-layer super-surface is arranged on the lower surface of the sixth dielectric substrate, the short-circuit post penetrates through the first dielectric substrate, the second dielectric substrate, the third dielectric substrate and the dipole patch, the feed post penetrates through the first dielectric substrate, the second dielectric substrate, the third dielectric substrate and the microstrip feeder, and the open-circuit post penetrates through the second dielectric substrate, the third dielectric substrate and the microstrip feeder. Further, the first dielectric substrate, the second di