CN-122026143-A - Electrical interconnect assembly and electronic device

CN122026143ACN 122026143 ACN122026143 ACN 122026143ACN-122026143-A

Abstract

The application discloses an electrical interconnection assembly and electronic equipment, which relate to the technical field of communication, wherein the electrical interconnection assembly comprises at least one electrical interconnection structure and a protective layer, the electrical interconnection structure comprises a support body and a flexible circuit board, the support body bears the flexible circuit board, the flexible circuit board is arranged along the circumferential direction of the support body, and the flexible circuit board comprises signal wires; the support body is conductive structure, and is equipped with first insulation structure between support body and the flexible circuit board, and the protective layer cover is established in the outside of electrical interconnection structure. The electronic equipment comprises an equipment main body and the electric interconnection assembly, wherein the electric interconnection assembly is arranged on the equipment main body.

Inventors

JIANG ZHICHENG
YANG XIANLONG

Assignees

维沃移动通信有限公司

Dates

Publication Date: 20260512
Application Date: 20260206

Claims (10)

1. An electrical interconnect assembly comprising at least one electrical interconnect structure and a protective layer, the electrical interconnect structure comprising a support body and a flexible circuit board, the support body carrying the flexible circuit board and the flexible circuit board being disposed along a circumference of the support body, the flexible circuit board comprising signal lines; the support body is a conductive structure, a first insulation structure is arranged between the support body and the flexible circuit board, and the protection layer is sleeved outside the electrical interconnection structure.
2. The electrical interconnect assembly of claim 1 wherein a conductive path is provided between the flexible circuit board and the support body, the flexible circuit board and the support body being electrically connected by the conductive path.
3. The electrical interconnect assembly of claim 1 wherein the electrical interconnect structure further comprises a conductive tab disposed on a periphery of the flexible circuit board with a second insulating structure disposed therebetween, the conductive tab extending in a circumferential direction of the support.
4. The electrical interconnect assembly of claim 3 wherein the first insulating structure comprises a first insulating layer extending circumferentially of the support body, the support body being insulated from the flexible circuit board by the first insulating layer; and/or the second insulation structure comprises a second insulation layer, the second insulation layer extends along the circumferential direction of the support body, and the conductive sheet is insulated from the flexible circuit board by the second insulation layer.
5. The electrical interconnect assembly of claim 1 wherein the number of turns of the flexible circuit board in a direction around the support is greater than 1 turn.
6. The electrical interconnect assembly of claim 5 wherein the flexible circuit board is a spiral structure surrounding the support, the spiral structure being stacked in a radial direction of the support to form at least two spiral segments, and a third insulating layer being disposed between adjacent two of the spiral segments.
7. The electrical interconnect assembly of claim 1 wherein a surface of the flexible circuit board is provided with a metallic shield.
8. The electrical interconnect assembly of claim 1 wherein the number of electrical interconnect structures is a plurality, each of the electrical interconnect structures being spaced apart, the protective layer being disposed about an exterior of each of the electrical interconnect structures.
9. The electrical interconnect assembly of claim 1 wherein the protective layer comprises a filler layer and an outer shell layer, the outer shell layer is sleeved outside the electrical interconnect structure, and a gap is provided between the outer shell layer and the electrical interconnect structure, the filler layer filling the gap.
10. An electronic device comprising a device body and the electrical interconnect assembly of any one of claims 1-9 disposed on the device body.

Description

Electrical interconnect assembly and electronic device Technical Field The application belongs to the technical field of communication, and particularly relates to an electrical interconnection assembly and electronic equipment. Background In the field of communication technology, many electronic devices such as AR glasses, robots, etc. need to supply power to some functional devices (such as cameras and optomechanical devices) to realize signal transmission. Taking AR glasses as an example, AR glasses include glasses main part, mirror leg and foot cover, set up functional device in the glasses main part, and the mirror leg links to each other with the glasses main part, and the foot cover sets up the one end of keeping away from the glasses main part at the mirror leg. If the power supply element and the circuit board carrying the signal wires are arranged on one side of the glasses leg close to the glasses body, the interconnection path is beneficial to shortening, but the size of the glasses leg is larger, and the modeling is limited. As well as other electronic devices, electrical interconnect structures are not capable of meeting structural requirements based on making short-path electrical interconnects. Disclosure of Invention The embodiment of the application aims to provide an electrical interconnection assembly and electronic equipment, which can solve the problem that an electrical interconnection structure in the related art cannot meet the structural requirement on the basis of carrying out short-path electrical interconnection. In a first aspect, an embodiment of the present application provides an electrical interconnection assembly, including at least one electrical interconnection structure and a protection layer, where the electrical interconnection structure includes a support body and a flexible circuit board, the support body carries the flexible circuit board, and the flexible circuit board is disposed along a circumferential direction of the support body, and the flexible circuit board includes a signal line; the support body is a conductive structure, a first insulation structure is arranged between the support body and the flexible circuit board, and the protection layer is sleeved outside the electrical interconnection structure. In a second aspect, an embodiment of the present application further provides an electronic device, including an apparatus main body and the electrical interconnection assembly described above, where the electrical interconnection assembly is disposed on the apparatus main body. In the embodiment of the application, the support body of the electrical interconnection structure provides support for the flexible circuit board, so that the flexible circuit board is arranged along the circumferential direction of the support body, and then the flexible circuit board occupies smaller size in the radial direction of the support body, so that the electrical interconnection assembly occupies smaller space in the radial direction of the support body, and the structural requirement is met. And the supporting body is of a conductive structure, the supporting body can participate in forming a conductive loop, and the flexible circuit board can be used for signal transmission and participate in forming the conductive loop, so that power supply transmission and signal transmission are ensured. Therefore, the electrical interconnection component in the embodiment of the application can not only meet the functional requirements of electric energy transmission and signal transmission, but also realize the small-size structural requirements and realize high-density electrical interconnection. Drawings FIG. 1 is a schematic illustration of the structure of an electrical interconnect assembly disclosed in a first embodiment of this application; FIG. 2 is a cross-sectional view of an electrical interconnect assembly as disclosed in a first embodiment of this application; FIG. 3 is a schematic illustration of the structure of an electrical interconnect assembly disclosed in a second embodiment of this application; FIG. 4 is a cross-sectional view of an electrical interconnect assembly disclosed in a second embodiment of this application; FIG. 5 is a schematic view of an electrical interconnect assembly in accordance with a third embodiment of the present application; FIG. 6 is a cross-sectional view of an electrical interconnect assembly disclosed in a third embodiment of this application; FIG. 7 is a schematic view of an electrical interconnect assembly in accordance with a fourth embodiment of the disclosure; FIG. 8 is a cross-sectional view of an electrical interconnect assembly disclosed in a fourth embodiment of this application; FIG. 9 is a schematic view of an electrical interconnect assembly in accordance with a fifth embodiment of the present disclosure; fig. 10 is a cross-sectional view of an electrical interconnect assembly in accordance with a fifth embodiment of the