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CN-122026145-A - Orthogonal plastic cavity three-dimensional circuit connector and manufacturing method thereof

CN122026145ACN 122026145 ACN122026145 ACN 122026145ACN-122026145-A

Abstract

The invention discloses an orthogonal plastic cavity three-dimensional circuit connector and a manufacturing method thereof, which relate to the technical field of electronic elements and precise electroplating manufacturing, wherein the orthogonal plastic cavity three-dimensional circuit connector adopts common LCP/SPS/PPS and other high-frequency base materials, is independent of special laser modified raw materials, comprises laser activation, chemical roughening, ionic palladium activation, chemical copper plating bottoming, dilute sulfuric acid post-activation, copper rolling plating of a primary basket and a secondary basket matched with a conductive co-plating medium, surface weldability treatment, low-temperature three-stage baking at less than or equal to 120 ℃ and post-treatment and detection steps, and forms an integrated orthogonal plastic cavity three-dimensional circuit connector.

Inventors

  • CHEN SHE

Assignees

  • 心之光电子科技(广东)有限公司

Dates

Publication Date
20260512
Application Date
20260325

Claims (10)

  1. 1. A three-dimensional circuit connector of quadrature plastic cavity, comprising: The base material body is integrally injection molded; The top and the bottom of the substrate body are symmetrically provided with a plurality of front bonding pads and a plurality of back bonding pads, and the front bonding pads and the back bonding pads are electrically communicated through side lines positioned on the inner side wall of the substrate body; the surface of the substrate body is also provided with an outer shielding metal layer; The front bonding pad, the adjacent back bonding pad and the side circuit for connecting the front bonding pad and the adjacent back bonding pad are integrally formed.
  2. 2. The three-dimensional circuit connector of claim 1, wherein the material of the substrate body is glass fiber reinforced liquid crystal polymer LCP, glass fiber reinforced syndiotactic polystyrene SPS or glass fiber reinforced polyphenylene sulfide PPS, and the substrate body does not contain laser activated sensitized fillers.
  3. 3. A method for manufacturing an orthorhombic plastic cavity three-dimensional circuit connector, which is characterized in that the method is used for manufacturing the orthorhombic plastic cavity three-dimensional circuit connector according to any one of claims 1-2, and the method specifically comprises the following steps: s1, injection molding a connector matrix, namely injection molding a base material body raw material to obtain a three-dimensional circuit connector matrix with an orthogonal plastic cavity; S2, laser selective activation, namely adopting a laser to perform laser activation roughening on a side line area, a front bonding pad area, a back bonding pad area and an outer shielding metal layer area of the connector matrix, and forming a micro-rough structure on the surface of the connector matrix to form a laser activation area; S3, ultrasonic cleaning and degreasing, namely removing oil stains, micro dust and scraps generated by laser processing remained on the surface of the connector matrix after laser activation through an ultrasonic cleaning procedure to obtain a cleaned connector matrix; s4, chemical roughening treatment, namely adopting an acid roughening system or an alkaline roughening system to chemically roughen the cleaned connector matrix, and forming a nanoscale anchoring structure in a laser activation area; s5, activating ionic palladium, namely activating the nanoscale anchoring structure by adopting an ionic palladium system, and depositing a palladium catalytic activation area; S6, electroless copper plating, namely depositing a copper bottom layer in the laser activation area and the palladium catalytic activation area by adopting an electroless copper plating process to form an electroless copper plating layer; s7, performing weak activation treatment, namely soaking the connector matrix subjected to electroless copper plating in a dilute sulfuric acid system, and performing weak activation treatment; S8, thickening barrel plating copper of the primary and secondary basket, namely placing the connector matrix subjected to weak activation treatment in an electroplating roller of the primary and secondary basket, then adding a conductive co-plating medium to assist conductive barrel plating, and forming an electroplated copper thickening layer on the surface of the electroless copper plating layer; S9, carrying out tin plating or silver plating treatment on the connector matrix thickened by electroplated copper, and forming a surface solderability coating on the surface of the thickened layer of electroplated copper to obtain a side circuit, a front bonding pad, a back bonding pad and an outer shielding metal layer; s10, low-temperature sectional baking, namely performing multistage step baking with the highest temperature of not more than 120 ℃ on the connector matrix subjected to surface weldability treatment; and S11, post-processing and detection, namely detecting and screening the baked connector matrix to obtain the orthogonal plastic cavity three-dimensional circuit connector.
  4. 4. The method of manufacturing a three-dimensional circuit connector with orthogonal plastic cavities according to claim 3, wherein the thickness of the electroless copper plating layer in S6 is 0.3-2 μm.
  5. 5. The method for manufacturing the three-dimensional circuit connector with the orthogonal plastic cavities according to claim 3, wherein the dilute sulfuric acid system in the step S7 is a normal-temperature dilute sulfuric acid solution, the weakening treatment time is 2-3 min, and the weakening treatment time is used for removing the weak bonding layer and the slight passivation layer on the surface of the electroless copper plating bottom layer.
  6. 6. The method for manufacturing the three-dimensional circuit connector with the orthogonal plastic cavities according to claim 3, wherein the conductive co-plating medium in the step S8 is at least one of steel balls and copper balls, and the conductive co-plating medium is used by adopting single particle size or mixture of multiple particle sizes.
  7. 7. The method for manufacturing a three-dimensional circuit connector with orthogonal plastic cavities according to claim 3, wherein the side surface circuit, the front surface bonding pad, the back surface bonding pad and the outer shielding metal layer in the step S9 are integrally formed by laser selective activation, electroless copper plating, primary and secondary basket barrel copper thickening and surface solderability treatment steps to form a metal plating layer.
  8. 8. The method of claim 7, wherein the metal plating layer does not include electroless nickel plating, and the metal plating layer includes electroless copper plating, electroplated copper thickening layer and surface solderability plating layer in this order from inside to outside.
  9. 9. The method for manufacturing the three-dimensional circuit connector with the orthogonal plastic cavities according to claim 3, wherein the low-temperature sectional baking in the step S10 comprises three stages, namely, the first stage of baking at 80 ℃ for 60min, the second stage of baking at 100 ℃ for 90min, the third stage of baking at 110-120 ℃ for 60min, and the baking is gradually cooled to room temperature along with a furnace after completion of baking.
  10. 10. The method for manufacturing the three-dimensional circuit connector with the orthogonal plastic cavity according to claim 3, wherein the orthogonal plastic cavity structure of the orthogonal plastic cavity connector manufactured by the manufacturing method is suitable for vertical interconnection, chiplet multi-chip stacking interconnection and SiP system-level packaging interconnection of radio frequency power amplifier modules of 5.5G/6G communication base stations.

Description

Orthogonal plastic cavity three-dimensional circuit connector and manufacturing method thereof Technical Field The invention relates to the technical field of electronic element and precision electroplating manufacture, in particular to a three-dimensional circuit connector with an orthogonal plastic cavity and a manufacturing method thereof. Background Under the development trend of heterogeneous integration of 5.5G and next-generation high-frequency communication hardware and Chiplet, the radio frequency power amplifier and the chip module set provide comprehensive requirements of high frequency, low loss, stable size, temperature impact resistance, mass production and the like for an interconnection structure, and the traditional PCB board-to-board connector and the conventional three-dimensional circuit metallization scheme are difficult to adapt. The conventional vertical/orthogonal PCB board-to-board connector in the current industry has the inherent defects of (1) large high-frequency dielectric loss, poor impedance continuity, obvious parasitic parameters, obvious high-speed and radio frequency signal degradation, (2) large mismatch between the Z-axis thermal expansion coefficient of a PCB base material and a metal circuit, easy occurrence of coating fatigue, cracking and unstable contact at high and low temperatures, 3) contact conduction by virtue of a contact pin, abrasion, contact resistance drift and vibration reliability risks, (4) large control difficulty of electroplating uniformity of a three-dimensional deep cavity structure, large difference between internal and external thicknesses, limited yield and consistency, and (5) low overall integration level, multiple assembly links and unfavorable high-density miniaturization design. The traditional PCB board-to-board connector and the vertical pin type connection have obvious bottlenecks in the scenes of the radio frequency power amplifier and the chip module. In addition, the current three-dimensional circuit processing technology and substitutes have the following defects: (1) The traditional water electroplating commonly adopts laser to divide the circuit after full plating, easily causes side wall damage, burrs and impedance dispersion, and deep cavity and fine line region uniformity are poor, and the process is complicated, is unfavorable for accurate three-dimensional spare stable production in batches. (2) The full chemical plating process has the advantages of low deposition speed, long production period, high comprehensive production cost, lower plating density and conductivity than the electroplating process, and limited signal and reliability under the high-frequency and high-reliability requirements. (3) Part of laser activation forming process depends on modified base materials added with special laser active fillers, raw materials are limited in selection and high in cost, and the binding force and long-term temperature-resistant circulating reliability of a coating still have defects under severe working conditions. (4) The conventional barrel plating or hanging plating process has weaker control on the consistency of the internal and external thickness of a small three-dimensional cavity and a multi-fine line structure, and is easy to cause local miss plating, thin plating or excessive plating, thereby influencing the consistency of the product performance. In summary, the prior art is difficult to simultaneously meet the comprehensive requirements of high frequency low loss, three-dimensional uniform plating, temperature impact resistance and mass production. Therefore, it is needed to provide a three-dimensional circuit connector with orthogonal plastic cavities and a manufacturing method thereof, which has strong versatility, high reliability, mature process route and no dependence on special modified substrate, so as to solve the above technical problems. Disclosure of Invention The invention aims to provide a three-dimensional circuit connector with an orthogonal plastic cavity and a manufacturing method thereof, which are used for solving the problem that the prior art is difficult to simultaneously meet the comprehensive requirements of high-frequency low-loss, three-dimensional uniform plating, temperature impact resistance and mass manufacturing. In order to achieve the above purpose, the invention provides a technical scheme that the orthogonal plastic cavity three-dimensional circuit connector comprises: The base material body is integrally injection molded; The top and the bottom of the substrate body are provided with a plurality of front bonding pads and a plurality of back bonding pads, and the front bonding pads and the back bonding pads are electrically communicated through side lines positioned on the inner side wall of the substrate body; The surface of the substrate body is also provided with an outer shielding metal layer, so that the electronic components welded in the inner circuit and the cavity are prot