CN-122026161-A - Electronic fabric interface and preparation method and application thereof

CN122026161ACN 122026161 ACN122026161 ACN 122026161ACN-122026161-A

Abstract

The invention belongs to the technical field of intelligent textile and flexible electronics, and relates to an electronic fabric interface, a preparation method and application thereof, wherein the electronic fabric interface comprises a fabric-based conductive path and a three-layer gradient packaging structure coated in a connecting area between the fabric-based conductive path and a circuit board, and the three-layer gradient packaging structure consists of an inner-layer high-adhesion layer, a middle gradient and an outer-layer flexible protection layer; the elastic modulus of the inner high-adhesion layer, the middle gradient transition layer and the outer flexible protective layer is sequentially decreased, when the wearable garment system is manufactured, the end part of the fabric-based conductive path is bonded and electrically connected with the circuit board through the conductive adhesive, and then the inner high-adhesion layer, the middle gradient transition layer and the outer flexible protective layer are respectively coated and cured in the connecting area to manufacture the interface, and the interface is formed. The electronic fabric interface can prevent the problem of interface separation caused by stress concentration, and has the advantages of simple preparation method, long-term reliability and durability during application.

Inventors

WANG GANG
ZHOU HONGBIN
SUN HENGDA
ZHU YUWEN

Assignees

东华大学

Dates

Publication Date: 20260512
Application Date: 20260415

Claims (9)

1. The electronic fabric interface is characterized by comprising a fabric-based conductive path and a three-layer gradient packaging structure coated in a connecting area between the fabric-based conductive path and a circuit board, wherein the three-layer gradient packaging structure consists of an inner high-adhesion layer, a middle gradient transition layer and an outer flexible protective layer; the cohesive energy density of the inner high-adhesion layer is 300-450 MPa, and the elastic modulus of the inner high-adhesion layer, the intermediate gradient transition layer and the outer flexible protection layer is sequentially decreased.
2. The electronic fabric interface of claim 1, wherein the inner high adhesion layer has an elastic modulus of 100-5000 mpa; the elastic modulus of the intermediate gradient transition layer is 10-100 MPa; the elastic modulus of the outer flexible protective layer is 0.1-10 MPa, and the elongation at break is more than 100%.
3. An electronic fabric interface according to claim 2, wherein the electronic fabric interface has a total thickness of 500-3000 μm, and the inner high adhesion layer, the intermediate gradient transition layer and the outer flexible protective layer have a thickness in the range of 100-1000 μm; The inner layer high-adhesion layer material is modified epoxy resin, acrylate adhesive or polyurethane adhesive; the outer flexible protective layer material is polydimethylsiloxane or styrene-ethylene-butylene-styrene block copolymer; the intermediate gradient transition layer material is thermoplastic polyurethane or aqueous polyurethane.
4. An electronic fabric interface as claimed in claim 1 wherein the fabric-based conductive paths are formed from conductive fibers by a textile weaving process; The thickness of the fabric-based conductive path is 0.1-0.5 mm, and the width is 1-10 mm; the surface resistivity of the fabric-based conductive path is 0.4-2.0 ohm per square, and the elastic modulus is 0.01-8 MPa.
5. An electronic fabric interface according to claim 4 wherein the textile weaving process is weaving, weft knitting or warp knitting.
6. An electronic fabric interface as claimed in claim 1 wherein the circuit board is a rigid PCB or a flexible PCB with connectable pads.
7. The method for manufacturing an electronic fabric interface according to any one of claims 1 to 6, wherein the electronic fabric interface is obtained by bonding and electrically connecting the end of the fabric-based conductive path with the circuit board through the conductive adhesive, and then coating and curing the connection areas respectively to prepare an inner high-adhesion layer, an intermediate gradient transition layer and an outer flexible protection layer.
8. The method of claim 7, wherein the conductive adhesive is a vertical conductive tape or a low-temperature cured conductive paste.
9. The method of claim 1 to 6, wherein the connection between the different modules is integrated in the wearable garment system.

Description

Electronic fabric interface and preparation method and application thereof Technical Field The invention belongs to the technical field of intelligent textile and flexible electronics, and relates to an electronic fabric interface and a preparation method and application thereof. Background The cross fusion of flexible electronic technology and intelligent textiles is pushing the wearable device to develop towards high performance, high integration and high environmental adaptability. By embedding the sensing, energy supplying, calculating and communication modules in the textile matrix, the intelligent textile realizes real-time sensing and interaction of human physiological signals, motion states and external environments, and has wide application prospects in the fields of personalized medical health monitoring, athletic sports science, special industry operation protection, novel human-computer interfaces and the like. However, how to reliably integrate electronic functional devices based on silicon-based or rigid encapsulation materials into intrinsically soft, highly deformable textile substrates that are subject to daily mechanical loads and chemical environmental effects is faced with a serious "heterogeneous integration" challenge. The core of this challenge is how to construct a robust electrical connection interface, i.e. "electronic fabric interface", that is capable of withstanding dynamic mechanical stress and environmental attack for long periods of time. From a material mechanics perspective, there is a significant modulus difference between the components that make up the smart textile system, namely textile fibers and their aggregates (fabrics) typically have a low elastic modulus (on the order of about MPa to GPa), exhibit excellent flexibility, stretchability and bendability, whereas conventional electronic components (such as integrated circuit chips, chip resistor capacitors, printed circuit boards, etc.) and their packaging materials often have moduli as high as tens of GPa, which fall within the category of rigid or brittle materials. After the two heterogeneous components are electrically interconnected by welding, conductive adhesive bonding and the like, repeated bending, stretching, twisting and shearing deformation of the fabric substrate can be unavoidable in the processes of clothing wearing, human body movement, washing maintenance and the like. Because the strain responses of soft and hard materials under the same external force are quite different, serious strain mismatch can be generated at the connecting interface, and a remarkable stress concentration phenomenon is further caused. The concentrated stress particularly acts on the joint of the welding point or the conductive adhesive which is the weakest key point of the mechanical and electrical connection, so that the joint is easy to generate micro cracks and expand due to fatigue effect, finally mechanical fracture is caused, and meanwhile, the contact resistance of the contact interface is rapidly increased and even the signal is completely interrupted due to fretting wear, oxidation or pollution. Therefore, failure of the interface has become one of the most significant bottlenecks that limit the long-term reliability, durability, and practicality of smart textiles. To improve interface stability, the prior art has generally attempted from two levels. Firstly, a flexible circuit board is used as an intermediate carrier, a rigid chip is assembled on the flexible circuit board (FPC), and then the FPC is integrally attached or sewn on a fabric. Although FPCs are more flexible than rigid Printed Circuit Boards (PCBs), the mechanical properties of their polymeric substrates (e.g., polyimide), particularly multiaxial stretchability, bending fatigue life, and structural fusion with fabrics, remain essentially different from textile materials. In complex and varying wearing deformations, there may still be a risk of interfacial slippage or delamination between FPC and fabric, and this approach increases system thickness, complexity and cost. Secondly, elastic packaging glue (such as silicon rubber and polyurethane) is adopted to carry out local cladding protection on the connection points. However, homogeneous encapsulating materials of a single component are currently in common use. When the material is stressed, the elastic modulus of the material is subjected to step mutation at the interface of the fabric/the packaging adhesive and the interface of the packaging adhesive/the component, and smooth and gradient transmission of load from the low-modulus matrix to the high-modulus element cannot be realized. Stress is still highly concentrated at the modulus abrupt interface, and the fatigue failure problem is not fundamentally solved. In addition, cohesive cracking of the homogeneous package itself under cyclic deformation may also occur due to uneven internal stress distribution. For example, patent application CN1798887a