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CN-122026175-A - Electronic equipment

CN122026175ACN 122026175 ACN122026175 ACN 122026175ACN-122026175-A

Abstract

The invention provides an electronic device, which enables a radiator (a heat conducting fin) to be pressed against a plug shell in a non-sliding manner. In an electronic device (10), a heat sink (51) is supported so as to be movable in a first direction and a second direction relative to a socket housing (61), a first pressing means (63) for pressing the heat sink (51) in a positive first direction relative to the socket housing (61), and a second pressing means (64) for pressing the heat sink (51) in a negative second direction relative to the socket housing (61) are arranged, a guide portion (cam groove (62)) is formed in the socket housing (61), the heat sink (51) has a guided portion (cylindrical protrusion (57)) guided by the guide portion (cam groove (62)), contact surfaces (55, 25) are formed in the heat sink (51) and the plug connector (20), respectively, and the contact surfaces (55, 25) are in contact with each other in the first direction when the plug connector (20) is inserted into an opening (42) of a socket housing (41).

Inventors

  • Minakuguchi

Assignees

  • 日本航空电子工业株式会社

Dates

Publication Date
20260512
Application Date
20250730
Priority Date
20241108

Claims (11)

  1. 1. An electronic device, comprising: a plug connector comprising a plug housing and a plug shell; a socket housing having an opening portion for enabling the plug connector to be inserted and removed, and A heat sink provided via a socket housing mounted to the socket housing so as to be movable with respect to the socket housing, When the plug connector is inserted into the opening of the socket housing and is in a fitted state, the heat radiator radiates heat generated from the plug connector by the contact of the plug housing with the heat radiation surface of the heat radiator, Wherein, when the plug connector is inserted into the opening of the socket housing in a first direction, the plug connector is pulled out of the opening in a positive first direction, and the plug connector is inserted into the opening in a negative first direction, At the same time, when the direction orthogonal to the first direction is defined as a second direction, and the separation direction of the plug housing and the heat-discharging surface of the heat sink is defined as a positive second direction, and the approaching direction is defined as a negative second direction, The heat sink is supported to be movable in a first direction and a second direction with respect to the socket housing, A first pressing unit that presses the heat sink in a positive first direction with respect to the socket housing and a second pressing unit that presses the heat sink in a negative second direction with respect to the socket housing are arranged between the heat sink and the socket housing, A guide portion is formed in the socket housing, the guide portion being configured to raise the heat sink in a positive second direction when the heat sink is positioned in a positive first direction with respect to the socket housing, and to be movable in a negative second direction when the heat sink is positioned in a negative first direction with respect to the socket housing, The heat sink has a guided portion that is guided by the guide portion formed at the receptacle housing, An abutment surface is formed on each of the heat sink and the plug connector, and the abutment surfaces abut against each other in a first direction when the plug connector is inserted into the opening of the receptacle housing.
  2. 2. The electronic device of claim 1, wherein the electronic device comprises a memory device, A locking portion as a fixing unit is formed at the plug housing, A locked portion as a fixed unit is formed at the socket housing, When the plug connector is inserted into the opening of the receptacle housing and is in a fitted state, the locking portion is engaged with the locked portion, so that the fitted state of the plug connector with respect to the receptacle housing is maintained against the pressing force applied by the first pressing means.
  3. 3. The electronic device according to claim 1 or 2, characterized in that, The first pressing unit and the second pressing unit are configured as a member integral with the receptacle housing.
  4. 4. The electronic device according to claim 1 or 2, characterized in that, The first pressing unit and the second pressing unit are configured as components separate from the socket housing.
  5. 5. The electronic device according to claim 1 or 2, characterized in that, An escape groove for releasing the pressing force from the second pressing unit is formed at a position where the heat sink receives the pressing force from the second pressing unit, In a state before the plug connector is inserted into the opening of the socket housing, the second pressing means is located at a portion where the escape groove is formed, so that all or a part of the pressing force from the second pressing means is not applied to the heat sink, When the plug connector is inserted into the opening of the receptacle housing and is in a fitted state, the second pressing means is positioned so as to be away from the formation portion of the escape groove, and all or a part of the pressing force from the second pressing means is applied to the heat sink.
  6. 6. The electronic device according to claim 1 or 2, characterized in that, When the plug connector is inserted into the opening of the receptacle housing and is in a fitted state, the surface of the heat sink to which the pressing force is applied by the second pressing means has a slope in which at least a part of a load component of the pressing force faces in the first direction.
  7. 7. The electronic device according to claim 1 or 2, characterized in that, The first pressing unit and the second pressing unit are formed as cantilever springs formed in a cantilever beam shape or double support springs formed in a double support beam shape.
  8. 8. The electronic device according to claim 1 or 2, characterized in that, When the pressing force of the first pressing means is set to P1 and the force in the negative first direction based on the pressing force of the second pressing means is set to P2, The inequality of P1> P2 holds.
  9. 9. The electronic device according to claim 1 or 2, characterized in that, A heat-conducting sheet is provided on the heat release surface of the heat sink.
  10. 10. The electronic device according to claim 1 or 2, characterized in that, The guide portion is formed as a cam groove constituted by a groove shape, The groove shape of the guide portion is formed in a substantially L-shape.
  11. 11. The electronic device of claim 10, wherein the electronic device comprises a memory device, The guided portion is formed as a cylindrical protrusion portion formed of a cylindrical protrusion shape of a groove shape fitted into the guide portion, In the groove shape of the guide portion having a substantially L-shape, an induction shape for inducing movement of the guided portion in the groove is formed by enlarging the groove inner diameter of the bent right-angle portion having a substantially L-shape.

Description

Electronic equipment Technical Field The present disclosure relates to an electronic device. Background In recent years, electronic devices have been required to have higher heat dissipation efficiency because of increased power consumption of mounted electronic devices due to demands such as increased communication speed and increased processing power. Accordingly, there is a demand for an electronic device that can reasonably obtain a high heat dissipation effect only by contact of solids, such as an optical transceiver having a heat sink. Such a structure of an electronic device is disclosed in, for example, patent document 1 below. As shown in fig. 38 and 39, an optical transceiver (13) as a conventional electronic device disclosed in patent document 1 below is in a form in which a transceiver housing (14) and a heat conductive sheet (18) are pressed by cam protrusions (19 a, 19 b). More specifically, in an optical transceiver (13) as a conventional electronic device, a soft heat conductive sheet (18) is attached to any one of contact surfaces of a heat sink (15) and a transceiver housing (14), wherein the heat sink (15) is disposed on an upper portion of a holder (12) provided on a host board (11). The heat sink (15) is supported so as to be elastically movable downward within a predetermined range with respect to the holder (12), and a cam projection (19) separated from the contact surface (15 a) of the heat sink (15) within the predetermined range is provided on the contact surface (14 a) side of the transceiver housing (14). Patent document 1 discloses a structure in which a transceiver housing (14) is inserted without rubbing against the contact surface of a heat conductive sheet (18), and in the final insertion position of the transceiver housing (14), the contact surface of a heat sink (15) and the transceiver housing (14) are pressed against each other with the heat conductive sheet (18) interposed therebetween. In addition, reference numerals related to descriptions of prior art documents are distinguished from the embodiments of the present disclosure by brackets. Prior art literature Patent literature Patent document 1 Japanese patent laid-open No. 2009-152428 Disclosure of Invention First, the technical problem to be solved However, in the optical transceiver (13) disclosed in patent document 1, as shown in a drawing (E) in fig. 39 showing a pressure-bonded state, when the cam projections (19 a, 19 b) are in contact with the top surface of the cam groove (20 d), it is difficult to stably press-bond the entire surface of the heat conductive sheet (18). As a means for avoiding this problem, it is conceivable that in the pressure-bonding state shown in the diagram (E) of fig. 39, the cam projections (19 a, 19 b) are provided so as not to contact the top surface of the cam groove (20 d), but since one of the inclined surface (20 c) and the cam projection (19 b) has an inclined surface, when the optical transceiver (13) is about to reach the final insertion position, sliding friction occurs between the transceiver housing (14) and the heat conductive sheet (18). Accordingly, an object of the present invention is to provide an electronic device having a structure capable of stably pressing a heat sink (a thermally conductive sheet in the case where the thermally conductive sheet is attached) on the entire surface thereof without sliding with respect to a plug housing as a heating element. (II) technical scheme The electronic device is characterized by comprising a plug connector including a plug housing and a plug housing, a socket housing having an opening portion in which the plug connector can be inserted and removed, and a heat sink provided so as to be movable with respect to the socket housing via the socket housing attached to the socket housing, wherein when the plug connector is inserted into the opening portion of the socket housing and brought into a fitted state, the heat dissipation surface of the heat sink is brought into contact with the plug housing by the plug housing, and the heat sink dissipates heat generated from the plug connector, wherein when a direction in which the plug connector is inserted and removed from the opening portion of the socket housing is defined as a first direction and a direction in which the plug connector is inserted is defined as a negative first direction, and at the same time, a direction orthogonal to the first direction is defined as a second direction, and when a direction in which the plug housing is separated from the heat sink is defined as a second direction, the heat dissipation surface is brought into contact with the heat dissipation surface of the heat sink, the heat sink is pressed against the socket housing by the socket housing, the heat sink unit is pressed against the socket housing in a second direction, and the heat dissipation unit is pressed against the socket housing in the first direction and the second direction, and the heat d