CN-122026201-A - Intelligent side-expanded bus connector production process

CN122026201ACN 122026201 ACN122026201 ACN 122026201ACN-122026201-A

Abstract

The invention relates to the technical field of side-spread bus connectors, in particular to an intelligent side-spread bus connector production process, which comprises the following steps of S1, performing thermal management; S2, precisely arranging sensors, S3, performing injection vulcanization on the composite thermal field, S4, and performing electric field gradient self-adaptive spraying. The invention realizes the active buffering of the temperature rise peak by molding and coating the phase change heat dissipation material on the periphery of the metal conductive core to form the inner core thermal buffer sleeve, and realizes the in-situ real-time monitoring of the temperature field and the stress field by spirally winding the distributed optical fiber sensor on the surface of the inner core thermal buffer sleeve to construct the state sensing layer. The process also adopts a microwave and infrared composite thermal field to synchronously vulcanize the insulating layer, improves the insulating uniformity, and optimizes the electric field distribution by gradient spraying of the graphene shielding material. The production process solves the problems that the existing production process of the side-spread bus connector cannot solve the problem that local overheat is accumulated and the running state is unknown.

Inventors

HOU GUIHUA
Pi Xiaohua
LI JIYUAN
LAI SHANHUI

Assignees

安瑞普科技(广东)有限公司

Dates

Publication Date: 20260512
Application Date: 20260313

Claims (10)

1. The intelligent side-expanded bus connector production process is characterized by comprising the following steps of: Step S1, performing thermal management, namely coating a phase change heat dissipation material on the periphery of a metal conductive core by using a mould pressing process to form an inner core thermal buffer sleeve with a heat storage function; S2, precisely arranging sensors, spirally winding a distributed optical fiber sensor on the surface of the inner core thermal buffer sleeve by using automatic wrapping equipment, and performing pre-fixing treatment to construct a state sensing layer; s3, performing injection vulcanization on the composite thermal field, namely placing the preset piece with the sensors arranged in a microwave transparent mold, and performing synchronous vulcanization on the composite thermal field by combining microwave heating and infrared radiation while injection molding of insulating rubber materials to form an insulating main body layer; And S4, performing gradient self-adaptive spraying on an electric field, and performing gradient spraying on the graphene modified shielding material on the outer surface of the vulcanized insulating main body layer by using plasma spraying equipment to form an unevenly distributed outer shielding layer.
2. The process for producing an intelligent side-spread busbar connector according to claim 1, wherein, in said step S1, The equivalent thermal diffusivity alpha of the phase-change heat-dissipation material in the phase-change interval meets the condition that the deviation ratio of the phase-change interface moving speed of the phase-change heat-dissipation material to the radial heat conduction speed of the metal conductive core is less than 15% under the rated temperature rise rate; The phase-change heat dissipation material takes expanded graphite as a supporting framework, the expanded graphite supporting framework is of an anisotropic three-dimensional network structure, the porosity of the expanded graphite supporting framework is 85% -92%, and the vacuum filling rate of the base material in the framework is more than 98%.
3. The process for producing an intelligent side-spread busbar connector according to claim 1, wherein, in step S2, The tension F and the winding pitch P of the automatic wrapping equipment meet the relation: ; Wherein F0 is a reference tension preset according to the minimum bending radius allowed by the distributed optical fiber sensor, and k is a compensation coefficient calculated in real time according to the curvature of the wrapping track.
4. The process for producing an intelligent side-spread busbar connector according to claim 1, wherein, in the step S3, A plurality of microwave emitting units which are annularly and symmetrically distributed and used for microwave heating are arranged around the microwave transparent mold, and the phase difference of each microwave emitting unit is controlled to generate a coherent superimposed microwave resonance mode in the mold cavity; The microwave transparent mold is provided with a plurality of groups of infrared lamp groups for infrared radiation along the axial direction, and the thermal stress gradient of the inner wall and the outer wall of the insulating main body tends to be consistent by independently adjusting the radiation power of each infrared lamp group.
5. The process for producing an intelligent side-spread busbar connector according to claim 4, further comprising a closed-loop control logic in step S3, wherein the specific steps of the closed-loop control logic include: calculating a second derivative d 2 T/dt 2 of temperature to time in real time based on temperature data acquired by the distributed optical fiber sensor; When d 2 T/dt 2 shows a forward abrupt change peak value, the insulating rubber material is judged to enter a severe vulcanization heat release stage, and accordingly the output power of the microwave transmitting unit is automatically adjusted down.
6. The process for producing an intelligent side-spread bus bar connector according to claim 1, further comprising, between said step S3 and step S4: step S3a, coating a self-healing buffer layer, wherein the surface of the insulating main body layer is coated with a self-healing buffer layer containing an insulating repair liquid microcapsule; And S3b, forming an interface interpenetrating network, wherein the contact interface between the self-healing buffer layer and the insulating main body layer forms the interface interpenetrating network by molecular chain diffusion by utilizing the demolding waste heat after the step S3 is finished.
7. The process for producing an intelligent side-spread bus bar connector according to claim 1, further comprising, before the plasma spraying in step S4: And performing plasma activation treatment on the outer surface of the insulating main body layer to enable the fractal dimension Df of the surface roughness of the outer surface of the insulating main body layer to reach the range of 2.2-2.5.
8. The process for producing an intelligent side-spread busbar connector according to claim 1 or 7, wherein the step S4 further includes a real-time deviation rectifying step, and the real-time deviation rectifying step specifically includes: And when detecting that the local potential gradient exceeds a preset threshold value, controlling the plasma spraying equipment to execute local self-adaptive complementary spraying on the corresponding area.
9. The process for producing an intelligent side-spread bus bar connector according to claim 1, further comprising, after said step S4 is completed: S5, carrying out coupling encapsulation on the tail fibers, carrying out high-strength polyimide encapsulation on the tail fiber leading-out ends of the distributed optical fiber sensor, and integrating an electromagnetic interference resistant precision flange interface; And S6, multiplexing and collecting signals, wherein the packaged distributed optical fiber sensor synchronously collects high-frequency acoustic emission signals and low-frequency temperature rise signals sensed by the state sensing layer through a single optical fiber link.
10. The process for producing an intelligent side-spread busbar connector according to claim 9, further comprising a life prediction step based on the monitored data: S7, constructing an initial state tensor, extracting an energy entropy characteristic E entropy of the high-frequency acoustic emission signal, and constructing a three-field coupling initial state tensor S 0 representing the initial quality of a finished product by combining key data of a vulcanization process, wherein the key data at least comprises temperature uniformity and pressure bias; S8, life prediction and risk early warning, inputting the initial state tensor S 0 into a trained life prediction model to calculate a residual life expected value L res , and simultaneously, analyzing a phase lag angle between a dynamic strain signal and an active heat pulse excitation signal in the operation process The drift trend of the interface failure risk is predicted.

Description

Intelligent side-expanded bus connector production process Technical Field The invention relates to the technical field of side-spread bus connectors, in particular to an intelligent production process of a side-spread bus connector. Background In power transmission and distribution, rail transit and industrial busbar systems, the side-spread busbar connector is used as a key conductive connecting device, and the reliability of long-term operation of the side-spread busbar connector is crucial. As the system progresses toward high voltage, high current, and high density, joule heat generated by the side-spread busbar connector during operation increases dramatically, and overheating has become a major cause of accelerated insulation aging, increased contact resistance, and even failure. At present, common technical means for improving the heat dissipation capacity of a side-spread bus connector in the industry mainly focus on optimizing the conductor section, adding heat dissipation fins or using external reinforced heat dissipation modes such as high-heat-conductivity pouring sealant. These methods improve the heat diffusion condition to some extent, but cannot fundamentally solve the problem of local overheat accumulation due to instantaneous fluctuation of load or abnormality of local contact resistance. More prominently, the side expansion bus connector manufactured by the existing production process belongs to a passive element, key state parameters such as an internal temperature field, a stress field and the like of the side expansion bus connector cannot be perceived in real time, the running state is in a black box mode, and the side expansion bus connector can be roughly maintained only by means of regular power failure maintenance or simple surface temperature measurement, so that the latent fault cannot be early warned, and accurate data support is difficult to provide for state maintenance. Therefore, how to design an innovative production process, so that an efficient thermal buffering mechanism and embedded state sensing capability can be built in the connector, in-situ monitoring and intelligent thermal management of key physical quantities are realized, passive heat dissipation is changed into active regulation, regular overhaul is changed into predictive maintenance, and the technical problem to be solved is solved in advance, which is to improve the intelligent level and operation reliability of high-end power equipment. Disclosure of Invention The invention aims to overcome the defects of the prior art, provides an intelligent production process of a side-expansion bus connector, active buffering of a temperature rise peak is realized by forming an inner core thermal buffer sleeve by molding and coating a phase-change heat dissipation material on the periphery of a metal conductive core, and in-situ real-time monitoring of a temperature field and a stress field is realized by constructing a state sensing layer on the surface of the inner core thermal buffer sleeve by spirally winding a distributed optical fiber sensor. The process also adopts a microwave and infrared composite thermal field to synchronously vulcanize the insulating layer, improves the insulating uniformity, and optimizes the electric field distribution by gradient spraying of the graphene shielding material. The production process solves the problems that the existing production process of the side-spread bus connector cannot solve the problem that local overheat is accumulated and the running state is unknown. In order to achieve the above purpose, the invention provides an intelligent side-spread bus connector production process, which comprises the following steps: Step S1, performing thermal management, namely coating a phase change heat dissipation material on the periphery of a metal conductive core by using a mould pressing process to form an inner core thermal buffer sleeve with a heat storage function; S2, precisely arranging sensors, spirally winding a distributed optical fiber sensor on the surface of the inner core thermal buffer sleeve by using automatic wrapping equipment, and performing pre-fixing treatment to construct a state sensing layer; s3, performing injection vulcanization on the composite thermal field, namely placing the preset piece with the sensors arranged in a microwave transparent mold, and performing synchronous vulcanization on the composite thermal field by combining microwave heating and infrared radiation while injection molding of insulating rubber materials to form an insulating main body layer; And S4, performing gradient self-adaptive spraying on an electric field, and performing gradient spraying on the graphene modified shielding material on the outer surface of the vulcanized insulating main body layer by using plasma spraying equipment to form an unevenly distributed outer shielding layer. Preferably, in said step S1, The equivalent thermal diffusivity alpha of the phase-change