CN-122026822-A - Dynamic thermal management method and system for high-power density solid-state power source system

CN122026822ACN 122026822 ACN122026822 ACN 122026822ACN-122026822-A

Abstract

The invention provides a dynamic heat management method and a system of a high-power density solid-state power source system, which belong to the technical field of radio frequency, wherein the method comprises the steps of obtaining junction temperature predicted values of a plurality of solid-state power amplifier tubes in the solid-state power source system; when the junction temperature predicted value exceeds a preset threshold value, the level value of the radio frequency signal input to the solid-state power amplifier tube is adjusted, and/or the pulse parameter of the radio frequency signal input to the solid-state power amplifier tube is adjusted, so that the working temperature of the solid-state power amplifier tube falls back into a safe temperature range. The invention realizes the accurate prediction and active control of the junction temperature of the solid-state power amplifier tube, and effectively improves the reliability and output performance of the system.

Inventors

HE YUAN
SHI LONGBO
JIANG GUODONG
SUN LIEPENG
DOU WEIPING
JIN KEAN
WU ZHENGRONG
HUANG GUIRONG

Assignees

中国科学院近代物理研究所

Dates

Publication Date: 20260512
Application Date: 20251208

Claims (10)

1. A method of dynamic thermal management of a high power density solid state power source system, comprising: Obtaining junction temperature predicted values of a plurality of solid-state power amplifier tubes in the solid-state power source system; When the junction temperature predicted value exceeds a preset threshold value, the level value of the radio frequency signal input to the solid-state power amplifier tube is adjusted, and/or the pulse parameter of the radio frequency signal input to the solid-state power amplifier tube is adjusted, so that the working temperature of the solid-state power amplifier tube falls back into a safe temperature range.
2. The method for dynamic thermal management of a high power density solid state power source system of claim 1, wherein obtaining junction temperature predictions for a plurality of solid state power amplifier tubes in the solid state power source system comprises: acquiring shell temperature distribution data of the solid-state power amplifier tube through distributed temperature sensors which are distributed on a liquid cooling heat radiating device in the solid-state power source system and are thermally coupled with the solid-state power amplifier tube; Acquiring a level value of a radio frequency signal input to the solid-state power amplifier tube; and inputting the shell temperature distribution data and the level value into a preset model to obtain the junction temperature predicted value.
3. The method of dynamic thermal management of a high power density solid state power source system of claim 1, wherein adjusting the level value of the radio frequency signal input to the solid state power amplifier tube comprises: And when the junction temperature predicted value is greater than or equal to a first preset threshold value, reducing the level value of the radio frequency signal input to the solid-state power amplifier tube.
4. The method of dynamic thermal management of a high power density solid state power source system of claim 1, wherein adjusting the pulse parameters of the radio frequency signal input to the solid state power amplifier tube comprises: And when the junction temperature predicted value is greater than or equal to a second preset threshold value, reducing the pulse width of the radio frequency signal input to the solid-state power amplifier tube.
5. A high power density solid state power source system, comprising: the excitation power amplification unit is used for amplifying an input radio frequency signal; the device comprises at least one final power amplification unit, a power amplifier unit and a power amplifier unit, wherein the final power amplification unit is used for carrying out final power amplification on the radio frequency signal and comprises N solid-state power amplification tubes, and N is an integer larger than 1; the power distribution synthesis network is respectively and electrically connected with the excitation power amplification unit and the final-stage power amplification unit and is used for carrying out multistage distribution and synthesis on the input radio frequency signals; the liquid cooling heat dissipation device is used for dissipating heat of the final-stage power amplification unit; the distributed temperature sensing network comprises a distributed temperature sensor which is arranged on the liquid cooling heat dissipation device and is thermally coupled with the solid power amplifier tube; A system controller for performing the dynamic thermal management method of a high power density solid state power source system as claimed in any one of claims 1-4; The excitation power amplification unit, the final-stage power amplification unit, the power distribution synthesis network, the liquid cooling heat dissipation device and the distributed temperature sensing network are integrated in a single cabinet, the final-stage power amplification unit forms a plug module of the cabinet, and the overall output power of the solid-state power source system is not lower than 300kW.
6. The high power density solid state power source system of claim 5 wherein the final stage power amplifying unit further comprises: the power amplifier comprises a push stage power amplifier, a power amplifier unit and a power amplifier unit, wherein the push stage power amplifier is used for receiving and amplifying an input radio frequency signal, and the input end of the push stage power amplifier is used as the input end of the final stage power amplifier unit; the first circulator is connected with the push-stage power amplifier and is used for isolating the reflected power of the radio frequency signal; the multistage power divider is electrically connected with the first circulator and is used for dividing the radio frequency signals amplified by the pushing stage power amplifier into N paths; The N solid-state power amplifier tubes are correspondingly and electrically connected with N output ends of the multistage power divider and are used for amplifying power of N paths of radio frequency signals; The multistage power synthesizer is electrically connected with the N solid-state power amplifier tubes and is used for synthesizing N paths of amplified radio frequency signals into one path of high-power radio frequency signals to be output; the directional coupler is electrically connected with the multi-stage power synthesizer and is used for coupling and sampling power signals of forward traveling waves and/or reflected traveling waves in the high-power radio frequency signals and sending the power signals to a monitoring system, wherein the output end of the directional coupler is used as the output end of the final-stage power amplification unit.
7. The high power density solid state power source system of claim 6 wherein the multi-stage power divider comprises one stage one-to-four power divider and four two stage one-to-four power dividers, the multi-stage power divider for dividing the amplified radio frequency signal into sixteen ways; The solid-state power amplifier tube is a gallium nitride power amplifier tube; The multi-stage power synthesizer comprises two eight-in-one synthesizers and one two-in-one synthesizers, and is used for synthesizing sixteen paths of amplified radio frequency signals into one path of high-power radio frequency signals to be output.
8. The high power density solid state power source system of claim 7 wherein the liquid cooled heat sink comprises a liquid cooled substrate having two of said two-stage one-to-four power splitters, eight of said solid state power amplifier tubes and one of said eight-in-one combiners disposed on each side thereof.
9. The high power density solid state power source system of claim 8 wherein eight of said solid state power amplifier tubes are symmetrically distributed around said eight-in-one combiner on a single side of said liquid cooled substrate and two of said two-stage one-to-four power splitters are symmetrically distributed on both sides of said eight of said solid state power amplifier tubes.
10. The high power density solid state power source system of claim 8 or 9 wherein the first circulator and the one-stage one-to-four power divider are distributed on one side of the liquid cooled substrate, the push stage power amplifier and the directional coupler are distributed on the other side of the liquid cooled substrate, and the two-in-one combiner is disposed within a through-hole of the liquid cooled substrate and thermally coupled to the liquid cooled substrate.

Description

Dynamic thermal management method and system for high-power density solid-state power source system Technical Field The invention relates to the technical field of radio frequency, in particular to a dynamic heat management method and a system of a high-power density solid-state power source system. Background High power solid state power source systems are the core components of modern particle accelerators, medical devices, and industrial heating systems. With the development of semiconductor technology, solid-state power amplifier tubes based on gallium nitride and other wide bandgap semiconductor materials have become key devices for realizing high power output. However, the thermal management problem caused by high power density is increasingly prominent, namely, a large amount of heat is generated in the operation process of the solid-state power amplifier tube, if the heat cannot be timely dissipated, the junction temperature of the tube core exceeds a safety threshold value, and further, performance degradation and even permanent damage are caused. Conventional thermal management schemes typically shut down the system directly when the temperature exceeds a fixed threshold, by monitoring the coolant temperature or the power amplifier case temperature. The method has obvious defects that firstly, the method is passive post protection, the system needs to be stopped to influence the reliability of continuous operation, secondly, in order to protect devices, the system usually works at a conservative power level and cannot fully exert the performance potential, and finally, the traditional temperature monitoring points, such as differences and delays between shell temperature and core parameters for determining the service life of the devices, cannot accurately reflect the real thermal state of the devices. Disclosure of Invention The invention provides a dynamic thermal management method and a system for a high-power density solid-state power source system, which realize the accurate prediction and active control of the junction temperature of a solid-state power amplifier tube and effectively improve the reliability and output performance of the system. In a first aspect, the present invention provides a method of dynamic thermal management of a high power density solid state power source system, comprising: Obtaining junction temperature predicted values of a plurality of solid-state power amplifier tubes in the solid-state power source system; When the junction temperature predicted value exceeds a preset threshold value, the level value of the radio frequency signal input to the solid-state power amplifier tube is adjusted, and/or the pulse parameter of the radio frequency signal input to the solid-state power amplifier tube is adjusted, so that the working temperature of the solid-state power amplifier tube falls back into a safe temperature range. According to the dynamic thermal management method of the high-power density solid-state power source system provided by the invention, junction temperature predicted values of a plurality of solid-state power amplifier tubes in the solid-state power source system are obtained, and the method comprises the following steps: acquiring shell temperature distribution data of the solid-state power amplifier tube through distributed temperature sensors which are distributed on a liquid cooling heat radiating device in the solid-state power source system and are thermally coupled with the solid-state power amplifier tube; Acquiring a level value of a radio frequency signal input to the solid-state power amplifier tube; and inputting the shell temperature distribution data and the level value into a preset model to obtain the junction temperature predicted value. According to the dynamic thermal management method of the high-power density solid-state power source system provided by the invention, the level value of the radio frequency signal input to the solid-state power amplifier tube is adjusted, and the method comprises the following steps: And when the junction temperature predicted value is greater than or equal to a first preset threshold value, reducing the level value of the radio frequency signal input to the solid-state power amplifier tube. According to the dynamic thermal management method of the high-power density solid-state power source system provided by the invention, the pulse parameters of the radio frequency signals input to the solid-state power amplifier tube are adjusted, and the method comprises the following steps: And when the junction temperature predicted value is greater than or equal to a second preset threshold value, reducing the pulse width of the radio frequency signal input to the solid-state power amplifier tube. In a second aspect, the present invention also provides a high power density solid state power source system comprising: the excitation power amplification unit is used for amplifying an input radio frequency signa