CN-122026936-A - Radio frequency module and electronic equipment

CN122026936ACN 122026936 ACN122026936 ACN 122026936ACN-122026936-A

Abstract

The embodiment of the application relates to the field of radio frequency and discloses a radio frequency module and electronic equipment. The radio frequency module comprises a first substrate, a second substrate and a radio frequency chip. The first substrate is configured with a radio frequency ground. The second substrate comprises a second substrate body and a first electrode, the second substrate body is mounted on the first substrate, the second substrate body comprises a first surface and a second surface which are oppositely arranged along a first direction, the first surface faces towards the first substrate, the second surface faces away from the first substrate, and the first electrode is arranged on the second surface and electrically connected with radio frequency. The radio frequency chip is arranged on the second surface and comprises an input end and an output end, a reference ground electrode is arranged on one surface facing the second surface, the first electrode comprises a first part and a second part, the first part and the second part are oppositely arranged with the reference ground electrode along a first direction, and the reference ground electrode is insulated from the first electrode. The electronic equipment can improve the current situation that the use reliability of the radio frequency chip is affected due to self-sustained oscillation.

Inventors

Ou Chixiang
ZHOU TAO

Assignees

深圳市万里眼技术有限公司

Dates

Publication Date: 20260512
Application Date: 20251223

Claims (10)

1. The radio frequency module is characterized by comprising the following components in a sequentially laminated mode: a first substrate configured with a radio frequency ground; The second substrate comprises a second substrate body and a first electrode, wherein the second substrate body is arranged on the first substrate and comprises a first surface and a second surface which are oppositely arranged along a first direction, the first surface faces towards the first substrate, the second surface faces away from the first substrate, the first electrode is arranged on the second surface and is electrically connected with the radio frequency, and The radio frequency chip is arranged on the second surface and comprises an input end and an output end, a reference ground electrode is arranged on one surface of the radio frequency chip facing the second surface, the first electrode comprises a first part positioned between the second substrate main body and the output end and a second part positioned between the second substrate main body and the input end, the first part and the second part are opposite to the reference ground electrode along the first direction, and the reference ground electrode is insulated from the first electrode; The first direction is a direction in which the first substrate, the second substrate and the radio frequency chip are stacked.
2. The rf module of claim 1 wherein the second substrate further comprises a layer of insulating material; the insulating material layer includes a fifth portion disposed between the first electrode and the reference ground electrode.
3. The rf module of claim 2 wherein the second substrate further comprises a second electrode; The second electrode is arranged on the second surface, and an isolation groove is formed between the second electrode and the first electrode on the second substrate; the reference ground electrode is fixed to the second electrode.
4. A radio frequency module according to claim 3, wherein the first electrode is disposed around the second electrode, and the isolation groove extends in a ring shape on the second surface.
5. The radio frequency module according to claim 4, wherein the layer of insulating material further comprises a sixth portion; the sixth part is arranged in the isolation groove and is connected with the fifth part.
6. The radio frequency module according to any one of claims 3 to 5, further comprising a first conductive glue at least partially filled between the reference ground electrode and the second electrode.
7. The radio frequency module of any of claims 2-6, wherein the second substrate further comprises: A third electrode disposed on the first surface and electrically connected to the radio frequency, and The second substrate main body further comprises side surfaces respectively connected with the first surface and the second surface, the conductive material layer is arranged on the side surfaces, and the conductive material layer is respectively connected with the first electrode and the third electrode.
8. The radio frequency module of claim 7, wherein the layer of insulating material further comprises a seventh portion; The fifth part covers the first electrode, the seventh part is arranged on the surface of the conductive material layer and is connected with the fifth part, and the seventh part covers one end, close to the first electrode, of the conductive material layer.
9. The rf module of claim 8 wherein the side of the second substrate includes a plurality of connection surfaces connected in sequence along an edge profile of the first surface, at least one of the connection surfaces having a countersink extending through the first surface and the second surface in the first direction; The second substrate comprises at least one conductive material layer, the conductive material layers are in one-to-one correspondence with the sink grooves, and the conductive material layers are arranged in the corresponding sink grooves; the insulating material layer comprises at least one seventh part, the seventh part corresponds to the sinking grooves one by one, and the seventh part is arranged in the corresponding sinking groove.
10. An electronic device comprising a housing and a radio frequency module according to any one of claims 1 to 9.

Description

Radio frequency module and electronic equipment Technical Field The present application relates to the field of radio frequency, and in particular, to a radio frequency module and an electronic device. Background With the development of technology, nowadays, electronic devices are mostly mounted with wireless communication modules, such as radio frequency chips. The radio frequency chip is an integrated circuit specially used for processing radio frequency signals, is a translation function responsible for receiving and transmitting wireless signals in electronic equipment, and is particularly responsible for translating digital signals processed in the electronic equipment into radio waves which can be transmitted in the air and translating received radio waves into digital signals which can be understood by the electronic equipment. Typically, the radio frequency chip includes an amplifier for boosting a weak or low power signal to a usable level. However, the radio frequency chip often has a self-sustained oscillation phenomenon in operation. Specifically, an input signal enters the radio frequency chip from the input end of the radio frequency chip, amplification is realized through the amplifier, the radio frequency chip outputs a target signal at the output end of the radio frequency chip, then, part of the target signal is returned to the input end of the radio frequency chip again as a feedback signal, the feedback signal has an enhancement effect on the input signal due to the fact that the phase of the feedback signal is identical to that of the input signal, the feedback signal is amplified again, and the amplitude of the feedback signal is larger and larger after multiple cycles. The self-sustaining oscillation can cause the radio frequency chip to output abnormal signals, and the use reliability of the radio frequency chip is affected. Disclosure of Invention The embodiment of the application aims to provide a radio frequency module and electronic equipment, so as to improve the current situation that the use reliability of a radio frequency chip is affected by self-sustained oscillation in the related technology. The application adopts the following technical scheme: In one aspect, the present application provides a radio frequency module. The radio frequency module comprises a first substrate, a second substrate and a radio frequency chip which are sequentially stacked. The first substrate is configured with a radio frequency ground. The second substrate comprises a second substrate body and a first electrode, the second substrate body is mounted on the first substrate, the second substrate body comprises a first surface and a second surface which are oppositely arranged along a first direction, the first surface faces towards the first substrate, the second surface faces away from the first substrate, the first electrode is arranged on the second surface, and the first electrode is electrically connected with the radio frequency. The radio frequency chip is installed in the second surface, the radio frequency chip includes input and output, the radio frequency chip is in the orientation the one side of second surface is equipped with the reference ground electrode, first electrode is including being located second base plate main part with first part between the output, and be located second base plate main part with second part between the input, first part with the second part with the reference ground electrode is followed the first direction sets up relatively, the reference ground electrode with insulating between the first electrode. The first direction is a direction in which the first substrate, the second substrate and the radio frequency chip are stacked. The radio frequency module provided by the embodiment of the application comprises a first substrate, a second substrate and a radio frequency chip, wherein the second substrate is arranged between the first substrate and the radio frequency chip. The first electrode of the second substrate and the reference ground electrode of the radio frequency chip form a capacitor structure together. In addition, since the rf signal is an alternating signal with a high frequency, it may generate a skin effect, which makes parasitic inductance effect of the wires in the rf module not negligible. Thus, the parasitic inductance and the capacitance structure together form an LC resonant circuit. The LC resonant circuit may be blocked for low frequency signals that are significantly below the resonant frequency. For high frequency signals that are significantly above the resonant frequency, the LC resonant circuit may form a high impedance to the high frequency signal such that the high frequency signal energy is attenuated and the effects of self-sustaining oscillations are improved even though the high frequency signal may still oscillate. For a radio frequency signal in the vicinity of the resonant frequency, the LC resonant circuit will allow