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CN-122028229-A - Low-temperature heating power supply assembly for printed circuit board

CN122028229ACN 122028229 ACN122028229 ACN 122028229ACN-122028229-A

Abstract

The application discloses a printed circuit board low-temperature heating power supply component which comprises a printed circuit board and a circuit element arranged on the printed circuit board, wherein the printed circuit board comprises a surface metal wiring layer and at least one inner layer metal wiring layer, the surface metal wiring layer is arranged on the front side and/or the back side of the printed circuit board, the inner layer metal wiring layer is arranged in the middle of the thickness direction of the printed circuit board and is arranged at intervals with the surface metal wiring layer through an insulating base material, the circuit element comprises a heating element, a switching element and a temperature control electronic component, the heating element, the surface metal wiring layer and the inner layer metal wiring layer form a heating current loop, the switching element is connected in series on the heating current loop, and is used for controlling the on-off of the heating element, and the temperature control electronic component forms a temperature control circuit which is electrically connected with the switching element and is used for detecting temperature and controlling the on-off of the switching element.

Inventors

  • ZHENG LIWEI

Assignees

  • 北京泰派斯特电子技术有限公司

Dates

Publication Date
20260512
Application Date
20260211

Claims (10)

  1. 1. A printed circuit board low temperature heating power assembly comprising: The printed circuit board (10) comprises a surface metal wiring layer (11) and at least one inner metal wiring layer (12), wherein the surface metal wiring layer (11) is arranged on the front side and/or the back side of the printed circuit board (10) in the thickness direction, the inner metal wiring layer (12) is arranged in the middle area of the printed circuit board (10) in the thickness direction, and the inner metal wiring layer and the surface metal wiring layer (11) are arranged at intervals through an insulating base material; a circuit element (20) arranged on the printed circuit board (10) and comprising a heating element (21), a switching element (22) and a temperature-control electronic assembly (23); The heating element (21) comprises a first end and a second end, wherein the first end is electrically connected with the surface metal wiring layer (11) and is connected to the ground through the surface metal wiring layer (11), the second end is electrically connected with at least one inner metal wiring layer (12) and is connected to a power supply through at least one inner metal wiring layer (12), and the heating element (21), the surface metal wiring layer (11) and the inner metal wiring layer (12) form a heating current loop; the switch element (22) is connected in series with the heating current loop and is used for controlling the on-off of the heating element (21); The temperature control electronic component (23) forms a temperature control circuit and is electrically connected with the switching element (22) and used for detecting temperature and controlling the on and off of the switching element (22).
  2. 2. A printed circuit board low temperature heating power supply assembly according to claim 1, characterized in that the switching element (22) is connected in series between the first end of the heating element (21) and ground.
  3. 3. The printed circuit board low-temperature heating power supply assembly according to claim 2, further comprising a switch protection module (221), wherein the switch protection module (221) comprises a seventh diode D7 and a third capacitor C3, the switching element (22) is a MOS transistor Q1, and the seventh diode D7 and the third capacitor C3 are connected in parallel to the gate terminal and the ground terminal of the MOS transistor Q1.
  4. 4. The printed circuit board low-temperature heating power supply assembly according to claim 1, wherein the temperature control circuit comprises a reference voltage generation module (231), a temperature sampling module (232) and a comparison module (233); The reference voltage generation module (231) is connected between a power supply and a first input end of the comparison module (233) and is used for providing a reference voltage for the comparison module (233); the temperature sampling module (232) comprises a thermistor RT, is connected between a power supply and a second input end of the comparison module (233) and is used for converting the detected temperature into a sampling voltage and outputting the sampling voltage to the comparison module (233); the output end of the comparison module (233) is electrically connected with the switching element (22) and is used for comparing the reference voltage with the sampling voltage and outputting a control signal according to a comparison result, and the control signal is used for controlling the switching element (22) to be turned on or off.
  5. 5. The printed circuit board low temperature heating power supply assembly of claim 4, wherein the reference voltage generating module (231) comprises an adjustable reference source D6 and a bias resistor R6, the bias resistor R6 having a first end connected to a power supply and a second end connected to a cathode of the adjustable reference source D6 and a reference end, an anode of the adjustable reference source D6 being grounded, and a cathode outputting a reference voltage to a first input of the comparing module (233).
  6. 6. The printed circuit board low temperature heating power supply assembly of claim 4, wherein the temperature sampling module (232) further comprises at least one voltage divider resistor connected in series with the thermistor RT to form a voltage divider circuit, a first end of the voltage divider resistor being connected to the power supply, a second end of the voltage divider resistor being connected to a first end of the thermistor RT, a second end of the thermistor RT being grounded, a junction of the thermistor RT and the voltage divider resistor outputting the sampling voltage to a second input of the comparison module (233).
  7. 7. The printed circuit board low temperature heating power supply assembly according to claim 4, wherein the comparing module (233) comprises a positive feedback circuit connected between the output terminal and the second input terminal of the comparing module (233) for adjusting the sampling voltage of the second input terminal of the comparing module (233) when the output signal of the comparing module (233) changes, the positive feedback circuit comprising a feedback resistor R5 and a second diode D2 connected in series, an anode of the second diode D2 being connected to the second input terminal of the comparing module (233), a cathode being connected to the first terminal of the feedback resistor R5, and a second terminal of the feedback resistor R5 being connected to the output terminal of the comparing module (233).
  8. 8. The printed circuit board low-temperature heating power supply assembly according to claim 5, wherein the reference voltage generating module (231) further comprises a linear voltage stabilizing unit, the linear voltage stabilizing unit comprises a second resistor R2, a fifth diode D5, a first voltage stabilizing capacitor C1, a triode Q2 and a third diode D3, the second resistor R2 and the fifth diode D5 are connected in series between a power supply and the ground, the first voltage stabilizing capacitor C1 is connected in parallel with the fifth diode D5, a control end of the triode Q2 is connected to a series node of the second resistor R2 and the fifth diode D5, an input end of the triode Q2 is connected to the power supply, an output end of the triode Q2 is connected to an anode of the third diode D3, and a cathode of the third diode D3 is connected to a first end of the bias resistor R6.
  9. 9. The printed circuit board low-temperature heating power supply assembly according to claim 4, wherein the temperature control circuit further comprises an anti-reverse connection module, an input end of the anti-reverse connection module is connected with a power supply, and an output end of the anti-reverse connection module is connected with a power supply input end of the reference voltage generating module (231) and a power supply input end of the temperature sampling module (232) respectively.
  10. 10. The printed circuit board low-temperature heating power supply assembly according to claim 1, wherein the heating element (21) is an axial lead power resistor, a first end is welded with the surface metal wiring layer (11), a second end is welded with the inner metal wiring layer (12), and a heat conducting pad is arranged between the heating element (21) and the surface metal wiring layer (11).

Description

Low-temperature heating power supply assembly for printed circuit board Technical Field The application relates to the technical field of printed circuit boards, in particular to a low-temperature heating power supply assembly for a printed circuit board. Background In extremely low temperature scenarios such as polar exploration, high altitude, on-board equipment, etc., electronic devices often need to be reliably started in environments of-55 ℃ and below. The lower limit of the working temperature of the current industrial-grade chip is at most-40 ℃ and cannot meet the requirement of extremely low-temperature starting, while the military chip can adapt to the environment of-55 ℃, but the cost of the military chip is 5-10 times of that of the industrial-grade chip, and the total cost of the military chip can be obviously increased under the multi-material scene. In order to solve the low-temperature starting problem, the prior art mainly adopts two heating schemes, namely external heating, heating film, heating sheet and other independent elements are adhered to heat the whole equipment, the problems of low heating speed, high energy loss, occupation of additional installation space and easy falling under the vibration impact environment exist, and the other heating scheme is integrated heating, wherein the heating elements are embedded into a circuit board, but heating resistors are arranged on the surface of the board, heat is concentrated locally and is difficult to uniformly transfer to core elements in the circuit board, the circuit board is easy to warp and deform due to uneven heating, and the reliability of the equipment is reduced. For the above related art, the existing low-temperature heating scheme cannot satisfy both low cost and high reliability requirements, and a special heating scheme for a printed circuit board adapted to an extremely low-temperature scene is needed. Disclosure of Invention In order to solve the technical problems, the application provides a low-temperature heating power supply assembly for a printed circuit board. The application provides a low-temperature heating power supply assembly for a printed circuit board, which adopts the following technical scheme: A low-temperature heating power supply assembly for a printed circuit board comprises the printed circuit board, a circuit element, a heating element and a temperature control electronic assembly, wherein the printed circuit board comprises a surface metal wiring layer and at least one inner metal wiring layer, the surface metal wiring layer is arranged on the front side and/or the back side of the thickness direction of the printed circuit board, the inner metal wiring layer is arranged in the middle area of the thickness direction of the printed circuit board and is arranged at intervals with the surface metal wiring layer through an insulating base material, the circuit element is arranged on the printed circuit board and comprises the heating element, the switching element and the temperature control electronic assembly, the heating element comprises a first end and a second end, the first end is electrically connected with the surface metal wiring layer and is connected to the ground through the surface metal wiring layer, the second end is electrically connected with the at least one inner metal wiring layer and is connected to a power supply through the at least one inner metal wiring layer, the heating element, the surface metal wiring layer and the inner metal wiring layer form a heating current loop, the switching element is connected in series on the heating current loop, the temperature control electronic assembly forms a temperature control circuit, and is electrically connected with the switching element, and is used for detecting temperature and controlling the switching element. By adopting the technical scheme, aiming at the problems of high cost caused by the fact that electronic equipment depends on military chips in extremely low-temperature scenes such as polar detection and high altitude, or the warp deformation of a circuit board caused by slow heating, large energy consumption, uneven heating and the like in the traditional heating scheme such as an external heating film, local heating and the like, the application builds a low-cost high-reliability scheme by conducting heat of a metal layer of the PCB and closed-loop temperature control, on one hand, a heating loop is formed by utilizing the inherent surface metal wiring layer and the inner metal wiring layer of the PCB, a heat conducting device is not required to be additionally arranged, heat can be quickly transferred to a full board through the two metal layers, the whole temperature is improved, meanwhile, the local overheating is prevented, and the inner metal wiring layer keeps the original power network function without increasing the cost of a board layer; on the other hand, the temperature control circuit accurately controls the on-