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CN-122028291-A - Electronic board and manufacturing method thereof

CN122028291ACN 122028291 ACN122028291 ACN 122028291ACN-122028291-A

Abstract

An electronic board includes a stack including at least one electrically insulating layer structure and a plurality of electrically conductive layer structures, wherein one of the plurality of electrically conductive layer structures is disposed on one major surface of the at least one electrically insulating layer structure and another of the plurality of electrically conductive layer structures is disposed on an opposite other major surface of the at least one electrically insulating layer structure, a through hole formed in the stack and laterally defined by a conductive material, at least one plating layer disposed on at least a portion of two opposite major surfaces of the stack and on a sidewall of the stack, an axial annular protrusion disposed at one end of the through hole, and a radial annular protrusion disposed at a sidewall of the stack. The application also provides a method for manufacturing the electronic board.

Inventors

  • Harald Klein Schuster

Assignees

  • 奥特斯奥地利技术与系统技术股份公司

Dates

Publication Date
20260512
Application Date
20251031
Priority Date
20241111

Claims (20)

  1. 1. An electronic board (100), wherein the electronic board (100) comprises: A stack (102), the stack (102) comprising at least one electrically insulating layer structure (104) and a plurality of electrically conducting layer structures (106, 108), wherein one electrically conducting layer structure (106) of the plurality of electrically conducting layer structures is arranged on one main surface (110) of the at least one electrically insulating layer structure (104) and another electrically conducting layer structure (108) of the plurality of electrically conducting layer structures is arranged on the opposite other main surface (112) of the at least one electrically insulating layer structure (104); -a through hole (120), the through hole (120) being formed in the stack (102) and being laterally delimited by a conductive material; At least one plating layer (122), the at least one plating layer (122) being disposed on at least part of two opposite major surfaces (114, 116) of the stack (102) and on a side wall (118) of the stack (102); An axial annular protrusion (126, 128), the axial annular protrusion (126, 128) being provided at one end of the through hole (120), and -Radial annular protrusions (130, 132, 134), said radial annular protrusions (130, 132, 134) being provided at the side wall (118) of the stack (102).
  2. 2. The electronic board (100) according to claim 1, wherein the axial annular protrusion (126, 128) is at least partially defined by the one electrically conductive layer structure (106) and/or the other electrically conductive layer structure (108) and/or the at least one plating layer (122), and/or wherein the radial annular protrusion (130, 132, 134) is at least partially defined by the one electrically conductive layer structure (106) and/or the other electrically conductive layer structure (108) and/or the at least one plating layer (122).
  3. 3. The electronic board (100) according to claim 1, wherein the axial annular protrusion (126, 128) and/or the radial annular protrusion (130, 132, 134) have a substantially constant cross-section along a circumferential portion of the through hole (120).
  4. 4. The electronic board (100) of claim 1, wherein the electronic board (100) comprises a plurality of through holes (120) in the stack (102), wherein the at least one plating layer (122) is disposed on a sidewall (118) of the stack (102) defining each of the through holes (120), and each through hole (120) has a respective axial annular protrusion (126, 128) disposed at one end of the respective through hole (120), and each through hole (120) has a respective radial annular protrusion (130, 132, 134) disposed at a sidewall (118) of the stack (102) defining the respective through hole (120).
  5. 5. The electronic board (100) of claim 1, wherein the axial annular protrusion (126, 128) extends from the side wall (118) of the stack (102).
  6. 6. The electronic board (100) according to claim 1, wherein the at least one plating layer (122) comprises a plurality of stacked plating layers (122 ', 122 ") wherein in particular an outermost one of the plating layers (122 ', 122") comprises a material different from a further material of one or more inner plating layers of the plating layers (122 ', 122 ").
  7. 7. The electronic board (100) according to claim 6, wherein the material comprises silver and/or the further material comprises copper.
  8. 8. The electronic board (100) according to claim 1, wherein the at least one plating layer (122) forms at least part of the axial annular protrusion (126, 128) and/or the radial annular protrusion (130, 132, 134), in particular the at least one plating layer (122) comprising a seed layer (122 ') and at least one further plating layer (122 ") located on the seed layer (122') forms at least part of the axial annular protrusion (126, 128) and/or the radial annular protrusion (130, 132, 134).
  9. 9. The electronic board (100) according to claim 1, wherein the electrically insulating layer structure (104) has irregularities (140) relative to the respective planar main surface (112) of the electrically insulating layer structure (104) at a circumferential portion of the electrically insulating layer structure (104) extending around the through hole (120), wherein in particular a portion of the at least one plating layer (122) at least partially fills the irregularities (140) of the electrically insulating layer structure (104).
  10. 10. The electronic board (100) according to claim 9, wherein the irregularities (140) of the electrically insulating layer structure (104) comprise at least one of a circumferential groove, a circumferential thickness variation and/or a groove-peak structure facing the through hole (120).
  11. 11. The electronic board (100) according to claim 1, wherein the electrically insulating layer structure (104) has a diameter (B) that is smaller than a diameter (B1) of the one electrically conducting layer structure (106) comprising the at least one plating layer (122), and/or the electrically insulating layer structure (104) has a diameter (B) that is smaller than a diameter (B2) of the other electrically conducting layer structure (108) comprising the at least one plating layer (122).
  12. 12. The electronic board (100) according to claim 1, wherein the electrically insulating layer structure (104) is made of a plastic material, in particular the electrically insulating layer structure (104) is made of polyimide.
  13. 13. The electronic board (100) of claim 1, wherein the at least one plating layer (122) comprises a plurality of plating layers (122 ', 122 ") and wherein at least one of the plurality of plating layers (122', 122") does not extend or does not extend continuously on at least one of the major surfaces (114, 116) of the stack (102) at a circumferential portion of the through hole (120).
  14. 14. The electronic board (100) according to claim 1, wherein one edge portion of one of the plurality of electrically conductive layer structures (106, 108) covered by the at least one plating layer (122) is sharpened, and/or wherein an edge portion of each respective one of the electrically conductive layer structures (106, 108) covered by the at least one plating layer (122) is sharpened.
  15. 15. The electronic board (100) of claim 1, wherein the electronic board (100) has a respective axial annular protrusion (126, 128) at each of two opposite ends of the through hole (120).
  16. 16. The electronic board (100) according to claim 1, wherein the respective axial annular protrusion (126, 128) forms a separate protruding island at different ones of the through holes (120), in particular the respective axial annular protrusion (126, 128) forms a separate protruding island around different ones of the through holes (120).
  17. 17. The electronic board (100) of claim 1, wherein the radial annular protrusion (130, 132, 134) forms a bottleneck of the through hole (120) such that at least a portion of the through hole (120) widens at one or both of the one electrically conductive layer structure (106) and the other electrically conductive layer structure (108).
  18. 18. The electronic board (100) according to claim 1, wherein the radial annular protrusion (130, 132, 134) is provided at a height level of the stack (102) corresponding to the electrically insulating layer structure (104).
  19. 19. The electronic board (100) according to claim 1, wherein the through hole (120) has an inner diameter that increases from the electrically insulating layer structure (104) in an axial direction towards an axially intermediate portion (136) of one or both of the one electrically conductive layer structure (106) and the other electrically conductive layer structure (108), and the through hole (120) has an inner diameter that decreases from the axially intermediate portion (136) further away from the electrically insulating layer structure (104) in an axial direction.
  20. 20. The electronic board (100) according to claim 1, wherein the one electrically conductive layer structure (106) and/or the other electrically conductive layer structure (108) has a thickness of at least 80 μιη, in particular the one electrically conductive layer structure (106) and/or the other electrically conductive layer structure (108) has a thickness of at least 100 μιη.

Description

Electronic board and manufacturing method thereof Technical Field The present invention relates to an electronic board and a method of manufacturing the same. Background With the increasing product functions of electronic boards and the increasing miniaturization of such electronic boards, such as printed circuit boards, increasingly powerful packages are being employed, which have a plurality of contacts or connections, with smaller and smaller spacings between the contacts. In particular, the electronic board should be mechanically robust and electrically reliable in order to be able to operate even under severe conditions. Conventional methods of forming electronic boards remain challenging. Disclosure of Invention It may be desirable to form a compact and reliable electronic board. According to an exemplary embodiment of the present invention, an electronic board is provided, the electronic board comprising a stack comprising at least one electrically insulating layer structure and a plurality of electrically conducting layer structures, one of the plurality of electrically conducting layer structures being arranged on one main surface of the at least one electrically insulating layer structure, the other of the plurality of electrically conducting layer structures being arranged on the opposite other main surface of the at least one electrically insulating layer structure, a through hole formed in the stack and being laterally delimited by electrically conducting material, at least one plating layer arranged on at least part of the two opposite main surfaces of the stack and on a side wall of the stack, an axial annular protrusion arranged at one end of the through hole, and a radial annular protrusion arranged at the side wall of the stack. According to another exemplary embodiment of the present invention, a method of manufacturing an electronic board is provided, wherein the method comprises providing a stack comprising at least one electrically insulating layer structure and a plurality of electrically conducting layer structures, wherein one of the plurality of electrically conducting layer structures is provided on one main surface of the at least one electrically insulating layer structure and another of the plurality of electrically conducting layer structures is provided on the opposite other main surface of the at least one electrically insulating layer structure, forming a through hole in the stack, forming at least one plating layer on at least part of two opposite main surfaces of the stack and on a side wall of the stack, forming an axial annular protrusion at one end of the through hole, and forming a radial annular protrusion at the side wall of the stack. In the context of the present application, the term "electronic board" may particularly denote any supporting structure having an electrical function. For example, the electronic board may be a Printed Circuit Board (PCB) or the like. The printed circuit board may be a simple laminar stack, not necessarily carrying any components. However, the electronic board may also be a component carrier. More generally, the electronic board or PCB, etc. may also be an interposer or an IC (integrated circuit) substrate. The electronic board may be capable of housing one or more components thereon and/or therein to provide mechanical support and/or electrical and/or thermal connection, or may not have one or more components housed thereon and/or therein. In other words, the electronic board may be configured as a mechanical board and/or an electronic board and/or a thermal board, for example, but not necessarily, also acting as a carrier for the components. The electronic board may comprise a laminate stack, such as a laminated layer stack. In particular, the electronic board may be one of a printed circuit board, an organic interposer, and an IC (integrated circuit) substrate. The electronic board may also be a hybrid board incorporating the different types of electronic boards described above. The electronic board may be flat or plate-like. In the context of the present application, the term "stack" may particularly denote a planar or planar sheet. For example, the stack may be a laminate stack, in particular a laminated or calendered laminate stack. Such a laminate may be formed by joining a plurality of layer structures by applying mechanical pressure and/or heat. Preferably, the plurality of layer structures are arranged parallel to each other. The electrical stack may comprise an electrically conductive structure and at least one electrically insulating structure. In the context of the present application, the term "layer structure" may particularly denote a continuous layer, a patterned layer or a plurality of discontinuous islands in a common plane, which may perform the function of electrical conductivity and/or electrical insulation. The layer structure may further comprise an interconnect structure protruding from a plane of the layer st