CN-122028292-A - Power module and power conversion device

Abstract

The present disclosure provides a power module and a power conversion device capable of improving the utilization efficiency of space. The power module includes a circuit board having one or more power semiconductor elements, and a cooler having a flow path for a cooling medium for cooling the circuit board, wherein the cooler is integrated with the circuit board by being bonded to one surface of the circuit board, a connection terminal connected to an edge connector is provided at an end of the circuit board, and an inlet and an outlet of the flow path are opened in a connection direction of the connection terminal to the edge connector.

Inventors

• IGUCHI TAKUYA

Assignees

• 丰田自动车株式会社

Dates

Publication Date

20260512

Application Date

20251106

Priority Date

20241111

Claims (5)

1. 1. A power module, having: a circuit board having at least one power semiconductor element, and A cooler having a flow path for a cooling medium for cooling the circuit board, The cooler is integrated with the circuit substrate by being bonded to one face of the circuit substrate, A connecting terminal connected with the edge connector is arranged at the end part of the circuit substrate, The inlet and outlet of the flow path are opened in a connection direction of the connection terminal to the edge connector.
2. 2. The power module of claim 1, wherein, The one or more power semiconductor elements are embedded in the circuit board.
3. 3. A power conversion device is provided with: A plurality of power modules as claimed in claim 1 or a plurality of power modules as claimed in claim 2; a plate member having a plate flow path communicating with the flow path of each of the plurality of power modules, and A plurality of edge connectors connected to the connection terminals of the circuit board of each of the plurality of power modules, the plurality of edge connectors being arranged on the board surface of the board member, A plurality of connecting holes are arranged on the plate surface of the plate member, wherein the connecting holes are communicated with the plate flow paths and are connected with the inlets and the outlets of the flow paths of the power modules respectively, The plurality of power modules are arranged such that one surface of the circuit board overlaps in a direction along the plate surface of the plate member.
4. 4. The power conversion device according to claim 3, wherein, The edge connector has a fixing portion that fixes the power module to the edge connector.
5. 5. A power conversion device is provided with: A plurality of power modules as claimed in claim 1 or a plurality of power modules as claimed in claim 2; A plate member having a plate flow path communicating with the flow path of each of the plurality of power modules; An adapter having a substantially plate shape, provided on a plate surface of the plate member so as to be erected in a direction substantially orthogonal to the plate surface, and having an adapter flow path connected to the plate flow path and through which the cooling medium flows, wherein a plurality of sets of connection holes are provided on the plate surface of the adapter, the plurality of sets of connection holes communicate with the adapter flow path and are connected to an inlet and an outlet of the flow path of the plurality of power modules, respectively, and A plurality of edge connectors connected to the connection terminals of the circuit board of each of the plurality of power modules, the plurality of edge connectors and the plurality of groups of connection holes being alternately arranged on the board surface of the adapter along a direction substantially orthogonal to the board surface of the board member, The plurality of power modules are arranged such that one surface of the circuit board overlaps in a direction substantially orthogonal to the plate surface of the plate member.

Description

Power module and power conversion device Technical Field The present invention relates to a power module and a power conversion device. Background Regarding the power module and the power conversion device, for example, patent document 1 describes that, in a PCU (Power Control Unit: power control unit), a plurality of power modules each having a transistor mounted thereon are arranged on a base frame, and are cooled by a cooling device at the lower portion of the base frame. Prior art literature Patent literature Patent document 1 Japanese patent laid-open No. 2009-296708 In recent years, the thickness of switching elements such as transistors has been reduced, and power modules have been miniaturized. However, even if the power module is miniaturized, a large-sized high-voltage component (capacitor or the like) or the like is provided in the power conversion device, and the large-sized high-voltage component or the like is housed in the case together with the plurality of power modules, so that space generated by the thinning of the power module cannot be efficiently utilized, and the miniaturization of the power conversion device is difficult. Disclosure of Invention The present invention has been made in view of the above-described problems, and an object thereof is to provide a power module and a power conversion device capable of improving the space utilization efficiency. The power module includes a circuit board having at least one power semiconductor element, and a cooler having a flow path for a cooling medium for cooling the circuit board, wherein the cooler is integrated with the circuit board by being bonded to one surface of the circuit board, a connection terminal connected to an edge connector is provided at an end of the circuit board, and an inlet and an outlet of the flow path are opened in a connection direction of the connection terminal to the edge connector. In the above power module, the one or more power semiconductor elements may be embedded in the circuit board. The power conversion device of the present invention includes the plurality of power modules, a plate member having a plate flow path communicating with the flow path of each of the plurality of power modules, and a plurality of edge connectors connected to the connection terminals of the circuit board of each of the plurality of power modules, the plurality of edge connectors being arranged on a plate surface of the plate member, and a plurality of connection holes being provided in the plate surface of the plate member, wherein the plurality of connection holes communicate with the plate flow path and are connected to an inlet and an outlet of the flow path of each of the plurality of power modules, and the plurality of power modules are arranged such that one surfaces of the circuit boards overlap each other in a direction along the plate surface of the plate member. The power conversion device of the present invention includes the plurality of power modules, a plate member having plate flow paths communicating with the flow paths of the plurality of power modules, a substantially plate-shaped adapter standing on the plate surface of the plate member in a direction substantially orthogonal to the plate surface of the plate member, and having adapter flow paths connected to the plate flow paths and through which the cooling medium flows, wherein a plurality of sets of connection holes are provided in the plate surface of the adapter, the plurality of sets of connection holes are connected to the adapter flow paths and connected to inlets and outlets of the flow paths of the plurality of power modules, respectively, and a plurality of edge connectors connected to the connection terminals of the circuit boards of the plurality of power modules, respectively, the plurality of edge connectors and the plurality of sets of connection holes being alternately arranged on the plate surface of the adapter in a direction substantially orthogonal to the plate surface of the plate member, and the plurality of power modules being arranged such that one surface of the circuit boards overlaps the plate surface of the plate member in a direction substantially orthogonal to the plate surface of the adapter. In the above-described power conversion device, the edge connector may have a fixing portion for fixing the power module to the edge connector. Effects of the invention According to the invention, the space utilization efficiency can be improved. Drawings Fig. 1 (a) is a plan view showing the front surface of the power module of the embodiment. Fig. 1 (B) is a plan view showing a side surface of the power module of the embodiment. Fig. 1 (C) is a plan view showing the back surface of the power module of the embodiment. Fig. 1 (D) is a plan view showing the lower surface of the power module of the embodiment. Fig. 1 (E) and 1 (F) are cross-sectional views showing an example of the internal configuration of the cooler. Fig. 2 (a) is a pla