CN-122028293-A - Electronic component and electronic equipment

Abstract

The application provides an electronic component and an electronic device, the electronic assembly includes a circuit board assembly and a cold plate. The circuit board assembly comprises a single board, a first heating device and a second heating device, wherein the first heating device and the second heating device are arranged on the single board. The cooling plate comprises a liquid inlet and a liquid outlet, wherein the cooling port flows into the cooling plate from the liquid inlet, and flows out of the cooling plate from the liquid outlet. The cold plate includes a first cooling zone and a second cooling zone, the second cooling zone being closer to the liquid outlet than the first cooling zone. The cooling liquid flows through the first cooling area from the liquid inlet and then flows to the second cooling area, and the heat dissipation capacity of the first cooling area is higher than that of the second cooling area. The heating density of the first heating device is higher than that of the second heating device, so that the first heating device is in heat conduction connection with the first cooling area, and the second heating device is in heat conduction connection with the second cooling area. The heat dissipation capacity of the cold plate is reasonably utilized, the heat dissipation effect of the first heating device and the second heating device is improved, and energy consumption can be saved.

Inventors

• GAO QIANG
• WEI LONGHE
• QIU YONGQI
• LIU JIHUI
• HUANG XINQUAN

Assignees

• 华为数字能源技术有限公司

Dates

Publication Date

20260512

Application Date

20221021

Claims (16)

1. 1. The utility model provides a module charges, its characterized in that includes circuit board assembly and cold plate, circuit board assembly includes veneer and a plurality of heating device, a plurality of heating device include first heating device and second heating device, the circuit board orientation the surface of cold plate is provided with first heating device and second heating device, the heating density of first heating device is greater than the heating density of second heating device, the cold plate includes inlet and liquid outlet, follows the direction of inlet orientation the liquid outlet first heating device with the second heating device arranges in proper order.
2. 2. The charging module according to claim 1, wherein a plurality of heat radiating fins are provided on the cold plate, and the density of the heat radiating fins corresponding to the first heat generating device is greater than the density of the heat radiating fins corresponding to the second heat generating device.
3. 3. The charging module according to claim 1 or 2, wherein the cold plate comprises a die-cast cold plate and a cover plate, a cavity enclosed by the die-cast cold plate and the cover plate is used for cooling liquid to flow, the circuit board, the die-cast cold plate and the cover plate are arranged in sequence, and a plurality of radiating fins are arranged on the surface of the die-cast cold plate, which faces the cover plate.
4. 4. A charging module according to any one of claims 1-3, further comprising a relieved tooth heat sink disposed between the first heating device and the cold plate.
5. 5. The charging module of claim 4, wherein the tooth heat spreader includes a first base plate and a plurality of heat dissipation teeth disposed in the first base plate, the first base plate disposed toward the first heating device, the plurality of heat dissipation teeth disposed toward the cold plate.
6. 6. A charging module according to claim 2 or 3, wherein the number of the heat dissipation fins corresponding to the first heat generating device is plural, and a protrusion structure is provided between every two adjacent heat dissipation fins in the plurality of heat dissipation fins corresponding to the first heat generating device, and the protrusion structure is provided on the second substrate and protrudes with respect to the second substrate.
7. 7. The charging module of claim 6, wherein the protruding structure is a trapezoidal tooth or a cambered tooth.
8. 8. The charging module according to claim 6 or 7, wherein the cold plate comprises a die-cast cold plate and a cover plate, the cover plate and the die-cast Leng Banwei being combined with a cavity for cooling liquid to flow; the side of second base plate is provided with the bending structure, the bending structure orientation the circuit board is bent, the bending structure with the corresponding radiating fin joint of first heating device.
9. 9. The charging module according to any one of claims 1 to 8, wherein a part of a surface of the cold plate facing the circuit board is convex toward the circuit board, and a height of a heat generating device corresponding to the part of the surface is smaller than a height of a heat generating device corresponding to other surfaces than the part of the surface of the cold plate facing the circuit board.
10. 10. The charging module of any one of claims 1-9, wherein a surface of the cold plate facing the second heat generating device comprises a plurality of coamings, the plurality of coamings and the surface of the cold plate facing the second heat generating device enclose a glue-pouring groove, the second heat generating device is located in the glue-pouring groove, and the glue-pouring groove is filled with pouring sealant.
11. 11. The charging module according to any one of claims 1 to 10, wherein the cooling plate comprises a plurality of flow channels, each two adjacent flow channels in the plurality of flow channels are communicated, the plurality of flow channels are sequentially arranged along the direction that the liquid inlet points to the liquid outlet, and the extending direction of each flow channel is intersected with the direction that the liquid inlet points to the liquid outlet.
12. 12. The charging module of claim 11, further comprising columnar teeth disposed at a communication between two adjacent flow channels.
13. 13. The charging module according to any one of claims 11 or 12, wherein each of at least one of the flow channels includes a main flow channel and a plurality of sub flow channels communicating with the main flow channel, the plurality of sub flow channels are arranged in parallel, each of the at least one flow channel corresponds to a plurality of the first heat generating devices, and the plurality of sub flow channels are arranged in one-to-one correspondence with the plurality of first heat generating devices.
14. 14. The charging module according to claim 13, wherein an extending direction of the total flow path is the same as an extending direction of each flow path, the plurality of first heat generating devices are sequentially arranged along the extending direction of the total flow path, the plurality of sub flow paths are sequentially arranged along the extending direction of the total flow path, and the extending direction of each of the plurality of sub flow paths intersects with the extending direction of the total flow path.
15. 15. The charging module according to any one of claims 1 to 14, wherein the circuit board assembly further includes a third heat generating device, the third heat generating device is disposed on the single board, the heat generating density of the second heat generating device is higher than that of the third heat generating device, and the first heat generating device, the second heat generating device, and the third heat generating device are sequentially arranged along a direction in which the liquid inlet is directed toward the liquid outlet.
16. 16. A charging pile comprising a housing and a charging module according to any one of claims 1 to 15, the charging module being arranged in the housing.

Description

Electronic component and electronic equipment The present application is a divisional application, the application number of the original application is 202211291005.5, the original application date is 2022, 10 and 21, and the whole content of the original application is incorporated by reference. Technical Field The present application relates to the field of heat dissipation devices, and in particular, to an electronic component and an electronic device. Background With the great development of new energy automobiles, the power of the charging pile is gradually increased, and the charging module is a core component of the charging pile. At present, air cooling heat dissipation is still a mainstream heat dissipation structure of a charging module, along with development of a high-power charging module, heat dissipation requirements of the charging module are gradually improved, and liquid cooling heat dissipation is one of main development directions in the future. Fig. 1 is a schematic structural diagram of an electronic component in the prior art. As shown in fig. 1, in the prior art, an electronic assembly includes a circuit board assembly 1 and a cold plate 2, wherein the circuit board assembly 1 includes a single board 11 and a heat generating device 12, and the heat generating device 12 is disposed on the single board 11. The cold plate 2 is internally provided with a liquid cooling cavity, a liquid cooling working medium flows in the liquid cooling cavity, and the cold plate 2 is in heat conduction connection with the heating device 12, so that heat generated by the heating device 12 can be taken away by using the liquid cooling working medium, and heat dissipation is performed on the heating device 12. The electronic component is typically provided with a plurality of heat generating devices 12, whereas the plurality of heat generating devices 12 are cooled by one cold plate 2. However, in the electronic component, the heat generating densities of the plurality of heat generating devices 12 are likely to be different, heat cannot be dissipated pertinently, the heat dissipation effect is poor, and resource waste is easily caused. Disclosure of Invention The application provides an electronic component and electronic equipment, which reasonably utilizes the heat dissipation capability of different areas of a cold plate, improves the heat dissipation effect of a heating device and can save energy consumption. In a first aspect, the present application provides an electronic assembly comprising a circuit board assembly and a cold plate. The circuit board assembly comprises a single board, a first heating device and a second heating device, wherein the first heating device and the second heating device are arranged on the single board. Specifically, the board may have a circuit pattern, and the first heat generating device and the second heat generating device may be electrically connected to the circuit pattern. The cold plate comprises a liquid inlet and a liquid outlet, wherein the cooling inlet flows into the liquid cooling cavity of the cold plate from the liquid inlet, and then flows out of the cold plate from the liquid outlet. So that the cold plate can be used to dissipate heat from the circuit board assembly. The cold plate includes a first cooling zone and a second cooling zone, the second cooling zone being closer to the liquid outlet than the first cooling zone. That is, the cooling liquid flows through the first cooling area from the liquid inlet and then flows to the second cooling area, so that the heat dissipation capacity of the first cooling area is higher than that of the second cooling area. The heating density of the first heating device is higher than that of the second heating device, so that the first heating device is in heat conduction connection with the first cooling area, and the second heating device is in heat conduction connection with the second cooling area. The first cooling area is utilized to radiate heat for the first heating device, and the second cooling area is utilized to radiate heat for the second heating device, so that the radiating capacity of the cold plate can be reasonably utilized, the radiating effect of the first heating device and the second heating device is improved, and the energy consumption can be saved. In a specific technical scheme, the first cooling area is provided with a plurality of first radiating fins for improving the radiating capacity of the first cooling area, and the second cooling area is provided with a plurality of second radiating fins for improving the radiating capacity of the second cooling area. The density of the plurality of first radiating fins is greater than that of the plurality of second radiating fins, so that the radiating capacity of the first cooling area is further higher than that of the second cooling area. In a specific technical scheme, the electronic component further comprises a relieved tooth radiator, t