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CN-122028295-A - Circuit board bottom plate and circuit board

CN122028295ACN 122028295 ACN122028295 ACN 122028295ACN-122028295-A

Abstract

The invention discloses a circuit board bottom plate and discloses a circuit board, wherein the circuit board bottom plate comprises a substrate body and a plurality of capsules, the substrate body is provided with a plurality of through holes and a plurality of stress cavities, the through holes penetrate through the substrate body along the thickness direction of the substrate body, the stress cavities are arranged along the circumference of the corresponding through holes, the cavity walls of the stress cavities are provided with tips, shear thickening fluid is encapsulated in the capsules, the plurality of capsules are arranged in the substrate body and are arranged along the circumference of the tips, the tips are configured to generate stress concentration effect when the capsules are subjected to shear stress of a doctor blade along the doctor blade direction, so that the capsules are broken and release the shear thickening fluid, the released shear thickening fluid generates shear thickening effect, so that the strength of the substrate body corresponding to the broken areas of the capsules is improved, and when the doctor blade scrapes on the substrate body, the strength of the substrate bottom plate can be enhanced, so that the deformation resistance of the substrate body is improved, the hole sealing quality is improved, and the yield and the reliability of the circuit board can be improved.

Inventors

  • CHEN GUOXING
  • Dai Fuqun

Assignees

  • 皆利士多层线路版(中山)有限公司

Dates

Publication Date
20260512
Application Date
20260205

Claims (10)

  1. 1. Circuit board bottom plate, its characterized in that includes: the substrate body (100) is provided with a plurality of through holes (101) and a plurality of stress cavities (102), the through holes (101) penetrate through the substrate body (100) along the thickness direction of the substrate body (100), the stress cavities (102) are arranged along the circumferential direction of the corresponding through holes (101), and the cavity walls of the stress cavities (102) are provided with tips (103); The plurality of capsules (200) are internally packaged with a shear thickening fluid (210), the plurality of capsules (200) are arranged in the substrate body (100) and are arranged along the circumference of the tip (103), the tip (103) is configured to generate a stress concentration effect when being subjected to the shear stress of a doctor blade along the doctor direction, so that the capsules (200) are broken and the shear thickening fluid (210) is released, and the released shear thickening fluid (210) generates a shear thickening effect so as to improve the strength of the substrate body (100) corresponding to the breaking area of the capsules (200).
  2. 2. The circuit board bottom plate of claim 1, wherein the substrate body (100) comprises a first resin layer (110) and a second resin layer (120) which are sequentially stacked, a plurality of first grooves (111) are formed in one side of the first resin layer (110) facing the second resin layer (120), a plurality of second grooves (121) are formed in one side of the second resin layer (120) facing the first resin layer (110), the number of the first grooves (111) is equal to the number of the second grooves (121), the stress cavities (102) are formed by the first grooves (111) and the corresponding second grooves (121), and the capsules (200) are formed in the first resin layer (110) and the second resin layer (120).
  3. 3. The circuit board chassis according to claim 2, wherein said substrate body (100) further comprises a third resin layer (130) and a metal layer (140), said metal layer (140) being connected to a side of said first resin layer (110) facing away from said second resin layer (120), said third resin layer (130) being connected to a side of said metal layer (140) facing away from said first resin layer (110).
  4. 4. The circuit board backplane of claim 2, wherein said substrate body (100) further comprises a wear resistant dielectric layer (150), said wear resistant dielectric layer (150) being attached to a side of said second resin layer (120) facing away from said first resin layer (110), said wear resistant dielectric layer (150) having a thickness in the range of 5 microns to 15 microns.
  5. 5. The circuit board chassis according to claim 1, wherein the maximum dimension of the stress chamber (102) in the thickness direction of the substrate body (100) is T 1 , and the thickness of the substrate body (100) is T 2 , which satisfies 0.2T 2 ≤T 1 ≤0.6T 2 .
  6. 6. The circuit board chassis according to claim 1, wherein the substrate body (100) has a first direction and a second direction, the first direction, the second direction, and a thickness direction of the substrate body (100) are perpendicular to each other, the plurality of capsules (200) are arranged at intervals along the first direction and the second direction, a minimum pitch of adjacent capsules (200) along the first direction is smaller than a minimum pitch of adjacent capsules (200) along the second direction, the tip (103) is arranged to extend along the first direction, and the first direction is parallel to a moving direction of the doctor blade.
  7. 7. The circuit board chassis according to claim 1, wherein the stress chamber (102) has an axis arranged in the first direction, and a profile of a chamber wall of the stress chamber (102) is an elliptical structure in a cross section passing through the axis.
  8. 8. The circuit board chassis of claim 1, wherein the maximum dimension of the stress cavity (102) in the first direction is L 1 and the maximum dimension of the stress cavity (102) in the second direction is L 2 , 1.5L 2 ≤L 1 ≤2L 2 is satisfied.
  9. 9. The circuit board chassis according to claim 1, wherein the outer contour of the capsule (200) has a spherical structure, and the wall thickness of the capsule (200) gradually decreases from the middle of the capsule (200) to both ends of the capsule (200) in the first direction.
  10. 10. A wiring board, comprising the wiring board base plate according to any one of claims 1 to 9.

Description

Circuit board bottom plate and circuit board Technical Field The invention relates to the technical field of circuit board manufacturing, in particular to a circuit board bottom plate and a circuit board. Background The bottom plate of current circuit board adopts the resin to form generally, because the array interval of the through-hole on the bottom plate is less and less, leads to the bottom plate to need large tracts of land gong sky, and the intensity of bottom plate reduces, when the sealed through-hole of scraping on the bottom plate, the bottom plate appears warping easily, causes the hole sealing quality of circuit board to reduce. Disclosure of Invention The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, the invention provides the circuit board bottom plate, which can improve the strength of the circuit board bottom plate, thereby improving the hole sealing quality of the circuit board. The invention further provides a circuit board with the circuit board bottom plate. According to an embodiment of the first aspect of the present invention, a circuit board chassis includes: the substrate body is provided with a plurality of through holes and a plurality of stress cavities, the through holes penetrate through the substrate body along the thickness direction of the substrate body, the stress cavities are arranged along the circumferential direction of the corresponding through holes, and the cavity walls of the stress cavities are provided with tips; The plurality of capsules are internally packaged with shear thickening fluid, the plurality of capsules are arranged in the substrate body and are arranged along the circumference of the tip, the tip is configured to generate a stress concentration effect when being subjected to the shear stress of a doctor blade along the doctor direction so as to fracture the capsules and release the shear thickening fluid, and the released shear thickening fluid generates a shear thickening effect so as to improve the strength of the substrate body corresponding to the fracture area of the capsules. The circuit board bottom plate provided by the embodiment of the first aspect of the invention has at least the following beneficial effects: When the circuit board bottom plate is in the frictioning process, the frictioning sword removes along the frictioning direction to in making the colloid fill to the through-hole, when the frictioning sword acted on the base plate body, produced along the shear stress of frictioning direction on the base plate body, when the stress concentration of tip department reached the critical value, the capsule on its periphery was broken in the tip initiation of stress chamber, thereby release shear thickening fluid, viscosity rose when shear thickening fluid received shearing, the shear thickening effect takes place, the intensity in the surrounding area of this tip department improves in the twinkling of an eye, can strengthen the intensity of base plate bottom plate, thereby improve the anti deformability of base plate body, thereby improve hole sealing quality, can promote the yields and the reliability of circuit board. According to some embodiments of the invention, the substrate body includes a first resin layer and a second resin layer which are sequentially stacked, a plurality of first grooves are formed on a side of the first resin layer facing the second resin layer, a plurality of second grooves are formed on a side of the second resin layer facing the first resin layer, the number of the first grooves is equal to that of the second grooves, the first grooves and the corresponding second grooves form the stress cavity, and the capsule is arranged on the first resin layer and the second resin layer. According to some embodiments of the invention, the substrate body further comprises a third resin layer and a metal layer, the metal layer is connected to a side of the first resin layer facing away from the second resin layer, and the third resin layer is connected to a side of the metal layer facing away from the first resin layer. According to some embodiments of the invention, the substrate body further comprises a wear resistant dielectric layer connected to a side of the second resin layer facing away from the first resin layer, the wear resistant dielectric layer having a thickness in the range of 5 to 15 microns. According to some embodiments of the invention, the maximum dimension of the stress cavity along the thickness direction of the substrate body is T 1, and the thickness of the substrate body is T 2, which satisfies 0.2T 2≤T1≤0.6T2. According to some embodiments of the invention, the substrate body has a first direction and a second direction, the first direction, the second direction and a thickness direction of the substrate body are perpendicular to each other, a plurality of capsules are arranged at intervals along the first direction and the second