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CN-122028297-A - Damage prevention structure of outgoing line of IMC (in-mold computer) process and manufacturing method thereof

CN122028297ACN 122028297 ACN122028297 ACN 122028297ACN-122028297-A

Abstract

The invention relates to the technical field of IMC (in-mold molding) processes, in particular to an anti-damage structure of an outgoing line of an IMC process and a manufacturing method thereof, wherein the structure comprises a PET (polyethylene terephthalate) substrate, a conductive ink layer, a tail OPP (OPP) protective layer, a reinforcing component, a stop bar and foam, wherein the conductive ink layer is arranged on a functional printing surface of the PET substrate so as to be far away from a mold closing position, and a connector contact surface is changed in cooperation with a client; the manufacturing method comprises the steps of PET substrate aging, functional printing surface and injection molding adhesive surface layered printing, protective layer laminating, reinforcing, punching electrical measurement, injection molding, post-treatment and the like; the damage prevention structure of the outgoing line of the IMC technology and the manufacturing method thereof thoroughly avoid the risk of tearing the outgoing line, improve the product yield, reduce the market rejection rate, simultaneously reduce the use of glue raw materials, reduce the environmental pollution, and are suitable for the production and the processing of the IMC three-in-one product.

Inventors

  • QIAN XIAOLING
  • MEI DABAO
  • SUN TAO

Assignees

  • 无锡市科虹标牌有限公司

Dates

Publication Date
20260512
Application Date
20260209

Claims (10)

  1. 1. An anti-damage structure of an IMC (in-mold computer) process outgoing line is characterized by comprising a PET (polyethylene terephthalate) base material (1) and a conductive ink layer (2); the PET substrate (1) is provided with a functional printing surface and an injection molding bonding surface; the conductive ink layer (2) is arranged on the functional printing surface of the PET substrate (1), and the conductive ink layer (2) is far away from the die closing position (3); an insulating protection structure is arranged outside the conductive ink layer (2), and an adhesion structure is arranged on an injection molding adhesion surface of the PET substrate (1); The tail of the outgoing line is provided with a reinforcing component, and the outgoing line is also provided with a stop bar and foam.
  2. 2. The damage preventing structure of the IMC process outgoing line according to claim 1, wherein the conductive ink layer (2) comprises a transparent conductive ink layer, a silver paste layer and a carbon paste layer from bottom to top in sequence; the transparent conductive ink layer is used as a key electrode, the silver paste layer is used for signal conduction, and the carbon paste layer is used as a connector; The insulating protection structure is two layers of insulating oil layers, and the insulating oil layers are covered on the surface of the carbon paste layer and are used for protecting the transparent conductive ink layer, the silver paste layer and the carbon paste layer.
  3. 3. The damage preventing structure of the IMC process outgoing line according to claim 1, wherein the adhesion structure comprises a color film layer, a gloss oil layer and an adhesive layer in order from bottom to top; the color film layer is used for forming color patterns, the gloss oil layer is used for improving the binding force of the PET base material (1) and the ABS decorative plate (5), and the adhesive layer is used as a medium for injection molding and binding of the PET base material (1) and the ABS decorative plate (5).
  4. 4. The damage preventing structure of the IMC process outgoing line according to claim 1, characterized in that a tail OPP protection layer (4) is coated on the surface of the conductive ink layer (2); The tail OPP protective layer (4) is a high-temperature resistant protective film and is used for protecting the conductive ink layer (2) in the processing process.
  5. 5. The IMC process outlet damage prevention structure according to claim 1, wherein the reinforcement member is used to increase the thickness and strength of the outlet connection portion to fit the connector of the client computer board; the barrier strip is used for preventing the PET base material (1) from being torn when the outgoing line is pulled; The foam is used for increasing the bending angle of the outgoing line and preventing the silver paste line from being broken; the damage prevention structure of the IMC process outgoing line is matched with the connector contact surface after the client is changed, so that normal transmission of line signals is ensured.
  6. 6. A method of manufacturing an anti-damage structure for an IMC process outlet, comprising the steps of: step 1, aging the PET substrate (1); Step 2, printing the conductive ink layer (2) on the functional printing surface of the PET substrate (1), and arranging the insulating protection structure outside the conductive ink layer (2); Step 3, arranging the bonding structure on the injection molding bonding surface of the PET substrate (1); step 4, attaching a protective layer on the surface of the conductive ink layer (2); step 5, attaching the reinforcing component to the tail part of the outgoing line; step 6, punching and electrically testing the PET base material (1); And 7, performing injection molding on the semi-finished product which is qualified by electric testing, welding the stop strip on the injection molded product, attaching the foam, and obtaining the finished product after the electric testing is qualified again.
  7. 7. The method for manufacturing an anti-damage structure of an IMC process outlet according to claim 6, wherein in step 1, the aging treatment is a high-temperature water condensation pretreatment for eliminating internal stress of the PET substrate (1) and preventing the PET substrate (1) from secondary shrinkage in a subsequent process.
  8. 8. The method of manufacturing an anti-damage structure for IMC process lead-out wires according to claim 6, wherein in step2, the process of forming the conductive ink layer (2) comprises: printing and baking transparent conductive ink to form a transparent conductive ink layer; Printing silver paste on the surface of the transparent conductive ink layer and baking to form a silver paste layer; Printing and baking carbon paste on the surface of the silver paste layer to form a carbon paste layer; Printing insulating oil on the surface of the carbon paste layer twice and baking to form the insulating protection structure; step 2 further comprises the operation of printing diffusion ink on the surface of the insulating protection structure.
  9. 9. The method of manufacturing an anti-damage structure for IMC process lead-out wires according to claim 6, wherein in step 3, the process of disposing the adhesive structure comprises: Spraying a color film on the injection molding bonding surface and drying the color film by ultraviolet rays to form a color film layer; printing gloss oil on the surface of the color film layer and baking to form a gloss oil layer; Printing and baking an adhesive on the surface of the gloss oil layer to form an adhesive layer.
  10. 10. The method of manufacturing an anti-damage structure for IMC process lead-out wires according to claim 6, characterized in that in step 4, the protective layer is a tail OPP protective layer (4) for preventing the conductive ink layer (2) from being scratched during processing; in step 6, the punching is outline punching, and the electrical measurement is used for screening semi-finished products with perfect functions; In step 7, the injection molding is IMC injection molding, and the electrical measurement is performed again to ensure the line conductivity of the finished product.

Description

Damage prevention structure of outgoing line of IMC (in-mold computer) process and manufacturing method thereof Technical Field The invention relates to the technical field of IMC (in-mold computer) processes, in particular to an anti-damage structure of an outgoing line of an IMC process and a manufacturing method thereof. Background In the IMC process, particularly, the design of the lead-out wire and the functional chip tail of the circuit is integrated, and no other medium exists between the conductive ink layer and the ABS decorative plate at the die closing position after injection molding is completed. At present, the printing surface of the silver paste of the IMC three-in-one product is tightly attached to an injection molding piece, and as the outgoing line is just positioned at the die closing position, the part is fragile and has lower adhesive force, the conventional process adopts electronic silica gel for sealing, and the width of a sealing area is limited to a certain extent. When a computer board is assembled at a later client end, the lead wire is required to be inserted into the board end, the operation also directly pulls the lead wire, the silica gel has certain ductility, the lead wire is still broken or damaged under the condition of excessive force, in the use process of a subsequent user, the long-term electrifying of the product can cause the rise of the resistance of the silver paste line, the oxidation of the silver paste is accelerated to form micro-insulating substance silver oxide, and finally, the disconnection is formed, so that the function failure of a washing machine is caused, the occurrence source of the problem is also verified by the condition of market withdrawal, and therefore, the anti-damage structure of the lead wire of the IMC technology and the manufacturing method thereof are urgently needed to be developed aiming at the current situation, so that the defects in the current practical application are overcome. Disclosure of Invention The invention aims to provide an anti-damage structure of an outgoing line of an IMC (in-mold computer) process and a manufacturing method thereof, so as to solve the problems in the prior art. In order to achieve the above purpose, the present invention provides the following technical solutions: an anti-damage structure of an IMC (in-mold computer) process outgoing line comprises a PET (polyethylene terephthalate) base material and a conductive ink layer; the PET substrate is provided with a functional printing surface and an injection molding bonding surface; the conductive ink layer is arranged on the functional printing surface of the PET substrate and is far away from the die closing position of the die; an insulating protection structure is arranged outside the conductive ink layer, and an adhesion structure is arranged on the injection molding adhesion surface of the PET substrate; The tail of the outgoing line is provided with a reinforcing component, and the outgoing line is also provided with a stop bar and foam. The conductive ink layer comprises a transparent conductive ink layer, a silver paste layer and a carbon paste layer from bottom to top in sequence; the transparent conductive ink layer is used as a key electrode, the silver paste layer is used for signal conduction, and the carbon paste layer is used as a connector; The insulating protection structure is two layers of insulating oil layers, and the insulating oil layers are covered on the surface of the carbon paste layer and are used for protecting the transparent conductive ink layer, the silver paste layer and the carbon paste layer. The invention further provides a scheme that the bonding structure comprises a color film layer, a gloss oil layer and an adhesive layer from bottom to top; The color film layer is used for forming color patterns, the gloss oil layer is used for improving the binding force of the PET base material and the ABS decorative plate, and the adhesive layer is used as a medium for injection molding and binding of the PET base material and the ABS decorative plate. As a further scheme of the invention, a tail OPP protective layer is covered on the surface of the conductive ink layer; the tail OPP protective layer is a high-temperature resistant protective film and is used for protecting the conductive ink layer in the processing process. The reinforcement component is used for increasing the thickness and strength of the outgoing line connection part so as to adapt to the connector of the client computer board; the barrier strip is used for preventing the PET base material from being torn when the outgoing line is pulled; The foam is used for increasing the bending angle of the outgoing line and preventing the silver paste line from being broken; the damage prevention structure of the IMC process outgoing line is matched with the connector contact surface after the client is changed, so that normal transmission of line signals is ensured