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CN-122028298-A - Printed circuit board structure with buried copper block and manufacturing method thereof

CN122028298ACN 122028298 ACN122028298 ACN 122028298ACN-122028298-A

Abstract

The invention relates to the technical field of printed circuit board manufacture, in particular to a printed circuit board structure with a buried copper block and a manufacturing method thereof, the printed circuit board comprises a plurality of Core layers and PP layers, wherein at least one target Core layer corresponding to the copper block is provided with a wavy window, and the distance between wave crests is matched with the size of the copper block. The manufacturing method comprises the steps of machining a wavy window on a target Core layer, placing copper blocks in the window, and laminating. According to the invention, through the wavy windowing design, the effective limit of the embedded copper block is realized, the neutral setting is obviously improved, the copper block is prevented from falling off, the off-line operation is allowed, and the production efficiency is improved.

Inventors

  • SU HUIBIN
  • HU DONGHUA

Assignees

  • 宏华胜精密电子(烟台)有限公司

Dates

Publication Date
20260512
Application Date
20260225

Claims (7)

  1. 1. A printed circuit board with a buried copper block comprises a plurality of Core layers and a plurality of PP layers, and is characterized in that a window for accommodating the copper block is arranged on at least one target Core layer corresponding to the copper block, the inner contour of the window is wavy, and the distance between wavy peaks is matched with the corresponding size of the copper block.
  2. 2. A printed circuit board with buried copper block according to claim 1, characterized in that the wave-shaped inter-peak distance is equal to the corresponding dimension of the copper block.
  3. 3. A printed circuit board with buried copper block according to claim 2, characterized in that the wave shape is a periodic wave shape.
  4. 4. A method for manufacturing a printed circuit board with a buried copper block according to any one of claims 1 to 3, comprising the steps of: S1, a step of wavy windowing, namely processing a window with wavy inner outline on at least one target Core layer corresponding to the copper block; S2, placing a copper block in the wavy fenestration of the target Core layer; And S3, laminating and pressing, namely laminating and pressing the Core layer with the copper block and at least one PP layer.
  5. 5. The method of manufacturing as set forth in claim 4, wherein the step of S1 wave-shaped windowing further comprises machining an auxiliary window having a size greater than a corresponding size of the copper block on an adjacent Core layer of the target Core layer.
  6. 6. The method according to claim 4, wherein the step of placing the copper block in S2 comprises performing a placing operation in a region other than the lamination stage, and applying an external force to the copper block so that the surface thereof is flush with the surface of the target Core layer.
  7. 7. The method according to any one of claims 4 to 6, further comprising a step of browning the copper block before the copper block placement step, and further comprising a step of aligning and fixing the Core layer with the PP layer by thermal fusion before the lamination and press-bonding steps.

Description

Printed circuit board structure with buried copper block and manufacturing method thereof Technical Field The invention belongs to the technical field of printed circuit board manufacturing, in particular relates to a printed circuit board structure with a buried copper block and a manufacturing method thereof, and particularly relates to a structure and a method for controlling neutral arrangement of the buried copper block. Background In the manufacture of high performance printed circuit boards, copper block embedding techniques are often employed to enhance localized heat dissipation or electrical conductivity. In the prior art, the conventional method for embedding the copper block is to window on the Core layer and the PP layer which are required to embed the copper plate, and the window size is usually 0.1-0.15 mm larger than the unilateral size of the copper block so as to provide space for gumming. However, the traditional windowing mode has the obvious defects that firstly, the copper block is difficult to keep in the central position after being put in due to larger windowing clearance, so that the neutrality is poor, the product quality is affected, and secondly, the copper block is easy to fall off from the windowing in the lamination and carrying processes due to larger clearance. In order to avoid the falling of the copper block, the existing technology generally requires the placement of the copper block on a lamination table, and then the lamination is performed immediately, so that the lamination operation efficiency is low, and the equipment occupation time is long. Therefore, a technical scheme of the copper-embedded plate capable of improving the neutrality of the copper block, preventing the copper block from falling off and improving the production efficiency is needed. Disclosure of Invention Aiming at the defects existing in the prior art, the invention aims to provide a copper-embedded plate structure capable of effectively controlling the neutrality of a copper block, convenient to operate and free from affecting the gumming effect and a manufacturing method thereof. In order to achieve the above purpose, the present invention provides the following technical solutions: The utility model provides a printed circuit board with bury copper billet, includes a plurality of Core layers and a plurality of PP layer, on with at least one target Core layer that the copper billet corresponds, be equipped with and be used for holding the windowing of copper billet, the interior profile of windowing is the wave, just the wave crest interval with the corresponding size looks adaptation of copper billet. Preferably, the wave-shaped inter-peak distance is equal to the corresponding dimension of the copper block. Preferably, the wave form is a periodic wave form. In addition, the method for manufacturing the printed circuit board with the embedded copper block comprises the following steps: S1, a step of wavy windowing, namely processing a window with wavy inner outline on at least one target Core layer corresponding to the copper block; S2, placing a copper block in the wavy fenestration of the target Core layer; And S3, laminating and pressing, namely laminating and pressing the Core layer with the copper block and at least one PP layer. Preferably, the step of windowing in the wave shape in the step S1 further comprises the step of processing auxiliary windowing with the size larger than the corresponding size of the copper block on the adjacent Core layer of the target Core layer. Preferably, the step of placing the copper block in S2 specifically includes performing a placing operation in an area outside the lamination table, and applying an external force to the copper block so that the surface of the copper block is flush with the surface of the target Core layer. Preferably, before the copper block placing step, the method further comprises a step of carrying out brown-out treatment on the copper block, and before the laminating and pressing step, the method further comprises a step of aligning the Core layer with the PP layer and fixing the Core layer by hot melting. Compared with the prior art, the invention has the beneficial effects that: 1. according to the invention, the wavy window is arranged on at least one target Core layer, the distance between the peaks is matched with the size of the copper block, so that constraint can be formed on the copper block on a plurality of points, the horizontal movement of the copper block is effectively limited, and the centering accuracy of the copper block is obviously improved. 2. The point contact type clamping structure is formed between the wavy windowing and the copper block, so that the copper block is not easy to fall off from the windowing before lamination, and the plate is convenient to take, place and transport. 3. According to the invention, the copper block is effectively fixed, so that the placement operation of the copper block is