CN-122028302-A - Double-sided PCB (printed Circuit Board) optimization structure based on local pin header connection and manufacturing method thereof

CN122028302ACN 122028302 ACN122028302 ACN 122028302ACN-122028302-A

Abstract

The invention relates to the technical field of PCB manufacture and discloses a double-sided PCB optimized structure based on local pin header connection and a manufacturing method thereof, wherein the method comprises the steps of carrying out partition circuit design on a double-sided PCB substrate to obtain a circuit layout of the double-sided PCB substrate; the invention divides the interconnection node between the top layer and the bottom layer of the double-sided PCB into a pin arranging connection area and a signal transmission area, and only executes a metallization process on the through holes in the signal transmission area, thereby reducing the number of through holes which need to go through three high-cost processes of removing gumming residues, electroless copper deposition and electroplating copper, reducing the consumption of electroplated copper materials and the dosage of chemical liquid medicine, and shortening the production period.

Inventors

CHEN YUANJUN
ZHANG QI

Assignees

深圳市新赛搏科技有限公司

Dates

Publication Date: 20260512
Application Date: 20260322

Claims (10)

1. The manufacturing method of the double-sided PCB based on the local pin header connection is characterized by comprising the following steps of: Carrying out partition circuit design on the double-sided PCB substrate to obtain a circuit layout of the double-sided PCB substrate; Drilling holes on the double-sided PCB substrate based on the circuit layout, and performing photoresist residue removal, electroless copper deposition and electrolytic copper plating treatment on the through holes in the signal transmission area only to obtain a target PCB substrate; pressing a brass conductive pin into a pin position hole of an insulating base to manufacture a pin arranging connection assembly, and inserting the pin arranging connection assembly into a mechanical through hole of the target PCB substrate to obtain a preassembly; and performing wave soldering on the preassembled body to obtain a double-sided PCB finished product.
2. The method for manufacturing the double-sided PCB based on the partial pin header connection according to claim 1, wherein the step of performing the partition circuit design on the double-sided PCB substrate to obtain the circuit layout of the double-sided PCB substrate includes: performing array arrangement on the interconnection nodes of the top layer and the bottom layer of the pin header connecting region in the double-sided PCB substrate to obtain a pin header connecting region hole site layout; And based on the pin header connecting region hole site layout, the power line and the ground line are intensively routed to the pin header connecting region, the signal line is routed to the signal transmission region, and through hole sites for executing PTH metallization procedures are planned at each interconnection node in the signal transmission region, so that the circuit layout of the double-sided PCB substrate is obtained.
3. The method for manufacturing a double-sided PCB based on local pin header connection according to claim 2, wherein the performing array arrangement on the interconnection nodes of the top layer and the bottom layer of the pin header connection area in the double-sided PCB substrate to obtain the pin header connection area hole site layout comprises: Array arrangement is carried out on the top layer and the bottom layer interconnection nodes in the pin array connection area in the double-sided PCB substrate according to the standard pin distance, and the center positions of the top layer bonding pads and the bottom layer bonding pads at the interconnection nodes are determined; And planning the hole diameters of the mechanical through holes and the pin-arranging bonding pad sizes matched with the pin diameters of the conductive pins at each interconnection node based on the center position of the bonding pad, and obtaining the pin-arranging connection region hole site layout.
4. The method for manufacturing a double-sided PCB based on local pin header connection according to claim 3, wherein the drilling the double-sided PCB substrate based on the circuit layout and performing desmutting, electroless copper plating and electrolytic copper plating processes only on the via holes in the signal transmission area to obtain a target PCB substrate comprises: Drilling holes on the pin arranging connection area and the signal transmission area of the double-sided PCB substrate respectively based on the circuit layout of the double-sided PCB substrate to obtain mechanical through holes on the pin arranging connection area and holes to be plated on the signal transmission area; And sequentially performing photoresist residue removal, electroless copper deposition and electrolytic copper plating on the hole to be plated in the signal transmission area, so that a metallized copper layer is formed on the wall of the hole to be plated in the signal transmission area, and the target PCB substrate is obtained.
5. The method for manufacturing a double-sided PCB based on local pin header connection according to claim 4, wherein the sequentially performing desmutting, electroless copper plating and electrolytic copper plating on the hole to be plated in the signal transmission area to form a metallized copper layer on the wall of the hole to be plated in the signal transmission area, to obtain a target PCB substrate, comprises: Performing glue residue removal treatment on the hole wall of the signal transmission area to be plated by using a glue removing agent to obtain a signal transmission area to be plated with exposed hole wall copper rings; And sequentially performing chemical copper deposition and copper electroplating treatment on the holes to be plated in the signal transmission area with the exposed hole wall copper rings, so that the hole walls of the holes to be plated are firstly deposited with a chemical copper layer, and then the surface of the chemical copper layer is electroplated with a copper layer to obtain the target PCB substrate, wherein the pin array connection area of the target PCB substrate comprises mechanical through holes and metal through holes in the signal transmission area.
6. The method for manufacturing a double-sided PCB based on partial pin header connection according to claim 5, wherein the pin header connection assembly is manufactured by pressing a brass conductive pin into a pin location hole of an insulation base, and inserting the pin header connection assembly into a mechanical through hole of the target PCB substrate, to obtain a pre-assembly, comprising: sequentially performing nickel plating and gold plating treatment on the surface of the brass conductive pins, and pressing the brass conductive pins subjected to the surface treatment into pin position holes of an insulating base one by one to obtain a pin arranging connection assembly; and aligning each conductive pin body of the pin arranging connection assembly with each mechanical through hole of the pin arranging connection area of the target PCB substrate, inserting the conductive pin body into the mechanical through holes until the bottom surface of the insulating base clings to the top plate surface of the target PCB substrate and the bottom end of the conductive pin body extends out of the bottom layer of the target PCB substrate, so as to obtain a preassembly body.
7. The method for manufacturing a double-sided PCB based on partial pin header connection according to claim 6, wherein the sequentially performing nickel plating and gold plating on the surface of the brass conductive pins, and pressing the brass conductive pins after the surface treatment into the pin holes of the insulating base one by one, to obtain the pin header connection assembly, comprises: sequentially performing nickel plating treatment and gold plating treatment on the surface of the brass conductive needle, so that a nickel layer serving as a barrier layer and a gold layer serving as a conductive surface layer, which is positioned outside the nickel layer, are formed on the surface of the brass conductive needle, and a brass conductive needle with nickel-gold plated surface is obtained; pressing the brass conductive pins with the nickel-plated gold on the surface into pin position holes of an insulating base one by one, so that the outer wall of the pin body of the brass conductive pins with the nickel-plated gold on the surface and the hole wall of the pin position holes of the insulating base form interference fit, and a pin arranging connection assembly is obtained.
8. The method for manufacturing a double-sided PCB based on partial pin header connection according to claim 7, wherein the performing wave soldering on the pre-assembly body to obtain a double-sided PCB finished product comprises: sequentially performing wave soldering on the pre-assembly body according to the temperature of the preheating zone, the peak temperature of the reflow zone and the cooling rate to obtain a soldering body; And carrying out on-line detection on contact resistance and insulation resistance of each welding spot of the pin connection area of the welding body, and confirming that the soldering tin connection among the conductive pin body, the top-layer bonding pad and the bottom-layer bonding pad meets the electric conduction requirement, so as to obtain a double-sided PCB finished product.
9. The method for manufacturing a double-sided PCB based on local pin header connection according to claim 8, wherein the performing on-line detection of contact resistance and insulation resistance on each solder joint of the pin header connection region of the solder body, and confirming that the solder connection between the conductive pin body and the top and bottom pads satisfies the electrical conduction requirement, comprises: sequentially performing contact resistance detection on soldering tin connection points among each conductive pin body, a top-layer bonding pad and a bottom-layer bonding pad in the pin arrangement connection region of the welding body to obtain contact resistance values of each welding point; And based on the contact resistance value of each welding spot, performing insulation resistance detection on adjacent conductive pin bodies in the pin arrangement connection area of the welding body, and confirming that the solder connection between the conductive pin bodies and the top-layer bonding pad and the bottom-layer bonding pad meets the electric conduction requirement to obtain a double-sided PCB finished product of the top-layer and bottom-layer electric path by taking the conductive pin bodies as the pin arrangement connection area.
10. A double-sided PCB optimization structure based on partial pin-array connection, characterized in that it is manufactured by the double-sided PCB manufacturing method based on partial pin-array connection as claimed in any one of claims 1-9.

Description

Double-sided PCB (printed Circuit Board) optimization structure based on local pin header connection and manufacturing method thereof Technical Field The invention relates to the technical field of PCB manufacture, in particular to a double-sided PCB optimized structure based on local pin header connection and a manufacturing method thereof. Background The cost and reliability of the manufacturing process of the printed circuit board PCB as a core carrier of the electronic product directly affect the market competitiveness of consumer electronics. The double-sided PCB has a simple structure and wide application, and is a mainstream choice of medium-low-end electronic products for a long time. However, with the increasing demands for product cost management, the high cost structural issues inherent in conventional double-sided PCB manufacturing processes are increasingly pronounced, and a breakthrough from the process route level is needed. The traditional double-sided PCB adopts a metallized through hole PTH to realize interconnection of a top layer and a bottom layer, and the process needs to sequentially execute a plurality of high-cost procedures such as drilling, removing glue residues, electroless copper deposition, copper electroplating and the like on all interconnection nodes of the whole PCB. The drilling process takes a larger proportion of production period, the consumption of the copper electroplating material takes a higher proportion of material cost, and the chemical copper deposition process also can generate a large amount of heavy metal-containing wastewater, so that the treatment cost is further increased. When the density of the via holes is high, both the warpage risk of the board and the short circuit risk of the circuit are increased, and the overall production yield is restricted. The existing alternative schemes have obvious limitations that the jumper welding mode has high labor cost and poor consistency, the conductive adhesive connection scheme has unstable contact resistance, and the flexible circuit switching scheme additionally increases the cost. The prior art cannot effectively reduce the manufacturing cost and ensure the electrical reliability of the interlayer interconnection, so that a new double-sided PCB interconnection method is necessary to solve the above problems. Disclosure of Invention The invention provides a double-sided PCB optimized structure based on local pin header connection and a manufacturing method thereof, which divide a top layer and a bottom layer interconnection node of the double-sided PCB into a pin header connection area and a signal transmission area, and only the through holes in the signal transmission area are subjected to PTH metallization procedures, so that the number of the through holes which are required to undergo three high-cost procedures of gumming slag removal, electroless copper deposition and copper electroplating is reduced, the consumption of copper electroplating materials and the consumption of chemical liquid medicines are reduced, and meanwhile, the production period is shortened. In a first aspect, the present invention provides a method for manufacturing a double-sided PCB based on partial pin header connection, the method comprising: Carrying out partition circuit design on the double-sided PCB substrate to obtain a circuit layout of the double-sided PCB substrate; Drilling holes on the double-sided PCB substrate based on the circuit layout, and performing photoresist residue removal, electroless copper deposition and electrolytic copper plating treatment on the through holes in the signal transmission area only to obtain a target PCB substrate; pressing a brass conductive pin into a pin position hole of an insulating base to manufacture a pin arranging connection assembly, and inserting the pin arranging connection assembly into a mechanical through hole of the target PCB substrate to obtain a preassembly; and performing wave soldering on the preassembled body to obtain a double-sided PCB finished product. With reference to the first aspect, in a first implementation manner of the first aspect of the present invention, the performing a partition circuit design on a double-sided PCB substrate to obtain a circuit layout of the double-sided PCB substrate includes: performing array arrangement on the interconnection nodes of the top layer and the bottom layer of the pin header connecting region in the double-sided PCB substrate to obtain a pin header connecting region hole site layout; And based on the pin header connecting region hole site layout, the power line and the ground line are intensively routed to the pin header connecting region, the signal line is routed to the signal transmission region, and through hole sites for executing PTH metallization procedures are planned at each interconnection node in the signal transmission region, so that the circuit layout of the double-sided PCB substrate is obtained. With refer