CN-122028303-A - Flexible circuit board and display module

CN122028303ACN 122028303 ACN122028303 ACN 122028303ACN-122028303-A

Abstract

The flexible circuit board comprises a first side, a second side, a first wiring layer, a second wiring layer, a first grounding terminal, a second grounding terminal and a first transfer conducting layer, wherein the first side and the second side are opposite, the flexible circuit board further comprises the first wiring layer and the second wiring layer, the first wiring layer is arranged close to the first side, the first wiring layer comprises the first grounding terminal, the second wiring layer is arranged close to the second side, the second wiring layer comprises the second grounding terminal, the first transfer conducting layer is located on one side, far away from the second wiring layer, of the first wiring layer, the first transfer conducting layer is electrically connected with the first grounding terminal, the first grounding terminal is located in orthographic projection of the first transfer conducting layer on the first wiring layer, and/or the second transfer conducting layer is located on one side, far away from the first wiring layer, of the second wiring layer, the second transfer conducting layer is electrically connected with the second grounding terminal, and the second grounding terminal is located in orthographic projection of the second transfer conducting layer on the second wiring layer.

Inventors

CHEN WEI
YAO MENGLIANG
WANG KANG
ZHANG YI
GONG WEI
BI DANYANG
YANG HAOTIAN
LU BAOFU

Assignees

京东方科技集团股份有限公司
重庆京东方显示技术有限公司

Dates

Publication Date: 20260512
Application Date: 20260330

Claims (12)

1. A flexible circuit board, wherein the flexible circuit board includes opposing first and second sides, the flexible circuit board further comprising: the first wiring layer is arranged close to the first side and comprises a first grounding terminal; the second wiring layer is arranged close to the second side and comprises a second grounding terminal; Wherein the flexible circuit board further comprises a first transfer conductive layer positioned at one side of the first wiring layer far away from the second wiring layer, the first transfer conductive layer is electrically connected with the first grounding terminal, the first grounding terminal is positioned in the orthographic projection of the first transfer conductive layer on the first wiring layer, and/or, The second transfer conducting layer is positioned on one side, far away from the first wiring layer, of the second wiring layer, the second transfer conducting layer is electrically connected with the second grounding terminal, and the second grounding terminal is positioned in orthographic projection of the second transfer conducting layer on the second wiring layer.
2. The flexible circuit board of claim 1, wherein the flexible circuit board comprises a first interposer layer and a second interposer layer, the flexible circuit board further comprising a first via and a second via, the first interposer layer electrically connected to the first ground terminal through the first via, the second interposer layer electrically connected to the second ground terminal through the second via.
3. The flexible circuit board of claim 2, wherein the flexible circuit board further comprises: The first wiring layer is positioned on one side of the first substrate far away from the second wiring layer; the third wiring layer is positioned on one side of the first substrate, which is close to the second wiring layer; The second substrate is positioned at one side of the second substrate far away from the first wiring layer; the fourth wiring layer is positioned on one side of the second substrate close to the first wiring layer; a third substrate, the first transfer conductive layer is positioned on one side of the third substrate far from the first wiring layer, and The second transfer conductive layer is positioned on one side of the fourth substrate far away from the second wiring layer; The first via penetrates through the third substrate, and the second via penetrates through the fourth substrate.
4. The flexible circuit board of claim 3, further comprising a first cover layer and a second cover layer, wherein the first cover layer is positioned on a side of the third substrate adjacent to the first trace layer, and the second cover layer is positioned on a side of the fourth substrate adjacent to the second trace layer; the first via also penetrates the first cover layer, the second via also penetrates the second cover layer, and The front projection of the first wiring layer on the first substrate is at least partially overlapped with the front projection of the first covering layer on the first substrate, and the front projection of the second wiring layer on the first substrate is at least partially overlapped with the front projection of the second covering layer on the first substrate.
5. The flexible circuit board of claim 3, further comprising a third double sided adhesive layer and a fourth double sided adhesive layer, wherein a side of the third substrate remote from the first transfer conductive layer is bonded to a side of the first trace layer remote from the first substrate through the third double sided adhesive layer, and a side of the fourth substrate remote from the second transfer conductive layer is bonded to a side of the second trace layer remote from the second substrate through the fourth double sided adhesive layer.
6. The flexible circuit board of claim 2, further comprising a fifth substrate and a sixth substrate, The first wiring layer is positioned on one side of the fifth substrate close to the second wiring layer, and the first transfer conductive layer is positioned on one side of the fifth substrate far away from the second wiring layer; the second wiring layer is positioned at one side of the sixth substrate close to the first wiring layer, the second transfer conductive layer is positioned at one side of the sixth substrate far from the first wiring layer, and The first via penetrates through the fifth substrate, and the second via penetrates through the sixth substrate.
7. The flexible circuit board of claim 6, further comprising a third coverlay and a fourth coverlay, wherein the third coverlay is positioned on a side of the fifth substrate remote from the first routing layer, the fourth coverlay is positioned on a side of the sixth substrate remote from the second routing layer, and The front projection of the third covering layer on the fifth substrate is spaced from the front projection of the first switching conductive layer on the fifth substrate, and the front projection of the fourth covering layer on the sixth substrate is spaced from the front projection of the second switching conductive layer on the sixth substrate.
8. The flexible circuit board of claim 7, further comprising a first conductive adhesive layer on a side of the first transfer conductive layer remote from the first trace layer, the first conductive adhesive layer electrically connected to the first transfer conductive layer.
9. The flexible circuit board of any of claims 2-8, further comprising a first shield layer and a second shield layer, wherein the first shield layer is positioned on a side of the first trace layer that is remote from the second trace layer, wherein the orthographic projection of the first shield layer on the first trace layer is spaced from the orthographic projection of the first diverting conductive layer on the first trace layer, wherein the second shield layer is positioned on a side of the second trace layer that is remote from the first trace layer, and wherein The orthographic projection of the second shielding layer on the second wiring layer and the orthographic projection of the second transfer conducting layer on the second wiring layer are arranged at intervals, or the second shielding layer comprises the second transfer conducting layer.
10. The flexible circuit board of claim 9, further comprising a second conductive adhesive layer and an insulating adhesive layer, The second conductive bonding layer is positioned at one side of the second transfer conductive layer far away from the second wiring layer, the second conductive bonding layer is electrically connected with the second transfer conductive layer, and the orthographic projection of the second conductive bonding layer on the second wiring layer is positioned in the orthographic projection of the second transfer conductive layer on the second wiring layer; the insulating adhesive layer is positioned at one side of the second wiring layer far away from the first wiring layer, the orthographic projection of the insulating adhesive layer on the second wiring layer and the orthographic projection of the second conductive adhesive layer on the second wiring layer are arranged at intervals, and The surface of the insulating bonding layer, which is far away from the second wiring layer, is coplanar with the surface of the second conductive bonding layer, which is far away from the second wiring layer.
11. The flexible circuit board of claim 9 further comprising a second conductive adhesive layer on a side of the second interposer conductive layer remote from the second trace layer, the second conductive adhesive layer electrically connected to the second interposer conductive layer, and The orthographic projection of the second transfer conductive layer on the second wiring layer is positioned in the orthographic projection of the second conductive bonding layer on the second wiring layer, and the orthographic projection of the second conductive bonding layer on the second wiring layer and the orthographic projection of the second shielding layer on the second wiring layer are at least partially overlapped.
12. A display module, characterized in that the display module comprises: The flexible circuit board according to any one of claims 1-11; The display panel comprises a first plane part, a bending part and a second plane part, wherein the bending part is connected with the first plane part and the second plane part, and the second plane part is electrically connected with the flexible circuit board; a polarizing layer located on a side of the first planar portion away from the second planar portion; the driving chip is positioned at one side of the second plane part far away from the first plane part; A first supporting layer positioned on one side of the first plane part close to the second plane part; The heat dissipation layer is positioned on one side of the first supporting layer, close to the second plane part, and comprises a third grounding terminal which is electrically connected with the second grounding terminal; a second supporting layer positioned on one side of the second plane part near the first plane part; The first bonding layer is bonded with one side of the heat dissipation layer away from the first supporting layer and one side of the second supporting layer away from the second plane part respectively; a protective layer disposed at one side of the bending part away from the first adhesive layer, one end of the protective layer contacting the polarizing layer, and one end of the protective layer away from the polarizing layer being spaced apart from the driving chip, and And the electromagnetic shielding bonding layer is respectively bonded with one end of the protective layer, which is far away from the polarizing layer, and one end of the flexible circuit board, which is close to the driving chip, and comprises a fourth grounding terminal, and the fourth grounding terminal is electrically connected with the first grounding terminal.

Description

Flexible circuit board and display module Technical Field The disclosure relates to the field of display technology, and in particular relates to a flexible circuit board and a display module. Background In an Organic Light-Emitting Diode (OLED) display module, a miniaturized flexible circuit board (Flexible Printed Circuit, FPC) is used to save space for the whole machine. However, after the area of the FPC is reduced, the area of the ground exposed copper regions at the top and bottom thereof is reduced due to the limitation of the wiring space. The grounding impedance between the FPC and the electromagnetic shielding bonding layer and between the FPC and the grounding impedance between the FPC and the electromagnetic shielding bonding layer are increased, and the failure risk of electrostatic discharge (Electrostatic Discharge, abbreviated as ESD) of the OLED display module is obviously increased. The above information disclosed in this section is only for understanding the background of the inventive concept of the present disclosure, and thus, the above information may contain information that does not constitute prior art. Disclosure of Invention In one aspect, a flexible circuit board is provided, the flexible circuit board comprises a first side and a second side which are opposite, the flexible circuit board further comprises a first wiring layer and a second wiring layer, the first wiring layer is arranged close to the first side, the first wiring layer comprises a first grounding terminal, the second wiring layer is arranged close to the second side, the second wiring layer comprises a second grounding terminal, the flexible circuit board further comprises a first transfer conducting layer which is located on one side, away from the second wiring layer, of the first wiring layer, the first transfer conducting layer is electrically connected with the first grounding terminal, the first grounding terminal is located in the orthographic projection of the first transfer conducting layer on the first wiring layer, and/or a second transfer conducting layer which is located on one side, away from the first wiring layer, of the second wiring layer, the second transfer conducting layer and the second grounding terminal are located in the orthographic projection of the second wiring layer. According to some exemplary embodiments, the flexible circuit board includes a first interposer layer and a second interposer layer, the flexible circuit board further includes a first via through which the first interposer layer is electrically connected to the first ground terminal and a second via through which the second interposer layer is electrically connected to the second ground terminal. According to some exemplary embodiments, the flexible circuit board further comprises a first substrate, a third wiring layer, a second substrate, a fourth wiring layer, a third substrate and a fourth substrate, wherein the first wiring layer is located on one side of the first substrate away from the second wiring layer, the third wiring layer is located on one side of the first substrate close to the second wiring layer, the second wiring layer is located on one side of the second substrate away from the first wiring layer, the fourth wiring layer is located on one side of the second substrate close to the first wiring layer, the first transfer conductive layer is located on one side of the third substrate away from the first wiring layer, the second transfer conductive layer is located on one side of the fourth substrate away from the second wiring layer, wherein the first through hole penetrates the third substrate, and the second through hole penetrates the fourth substrate. According to some exemplary embodiments, the flexible circuit board further comprises a first cover layer and a second cover layer, wherein the first cover layer is located on one side of the third substrate close to the first wiring layer, the second cover layer is located on one side of the fourth substrate close to the second wiring layer, the first via further penetrates through the first cover layer, the second via further penetrates through the second cover layer, the front projection of the first wiring layer on the first substrate at least partially overlaps with the front projection of the first cover layer on the first substrate, and the front projection of the second wiring layer on the first substrate at least partially overlaps with the front projection of the second cover layer on the first substrate. According to some exemplary embodiments, the flexible circuit board further includes a third double-sided adhesive layer and a fourth double-sided adhesive layer, wherein a side of the third substrate away from the first transfer conductive layer is bonded to a side of the first routing layer away from the first substrate through the third double-sided adhesive layer, and a side of the fourth substrate away from the second transfer conductiv