CN-122028305-A - Circuit board assembly, electronic equipment and manufacturing method of circuit board assembly

Abstract

The embodiment of the application provides a circuit board assembly, electronic equipment and a manufacturing method of the circuit board assembly, wherein the circuit board assembly comprises frame plates and at least two circuit boards, the frame plates and all the circuit boards are stacked, each frame plate is positioned between the two circuit boards, each frame plate is connected with two adjacent circuit boards through solder, a filling gap is formed between each frame plate and each adjacent circuit board, a flow channel is formed in each frame plate, the filling gap between each frame plate and the two adjacent circuit boards is communicated through the flow channel to form a filling flow channel, at least one injection opening is formed in the circuit board assembly, the injection opening is used for flowing filling materials, each filling flow channel can be communicated with at least one injection opening, and therefore the solder between each frame plate and the two adjacent circuit boards can be wrapped by the filling materials.

Inventors

• GUO JIANQIANG
• WANG XIAOYAN
• SHI PENGFEI
• YANG FAN

Assignees

• 荣耀终端股份有限公司

Dates

Publication Date

20260512

Application Date

20220517

Claims (20)

1. 1. A circuit board assembly, comprising a frame plate and at least two circuit boards, wherein the frame plate and all the circuit boards are stacked, and each frame plate is positioned between two circuit boards; Each frame plate is connected with two adjacent circuit boards through solder, a filling gap is formed between each frame plate and the two adjacent circuit boards, a flow channel is formed in each frame plate, the filling gap between each frame plate and one adjacent circuit board is communicated with the filling gap between the frame plate and the other adjacent circuit board through the flow channel, and a filling flow channel is formed; the circuit board assembly is provided with at least one injection port, the injection port is used for injecting flowable filling materials, and the circuit board assembly is configured so that each filling runner can be communicated with at least one injection port, and therefore the solder between each frame plate and two adjacent circuit boards can be wrapped by the filling materials.
2. 2. The circuit board assembly of claim 1, wherein when one of said frame plates is provided and two of said circuit boards are provided, said circuit board assembly has one of said fill runners and either of said two circuit boards is provided with said injection port.
3. 3. The circuit board assembly of claim 2, wherein the injection port is directly opposite the inflow port of the flow channel and/or wherein the injection port is offset from the inflow port of the flow channel and wherein the opening area of the injection port is greater than the opening area of the inflow port of the flow channel.
4. 4. The circuit board assembly of claim 2, wherein a centerline of the flow channel is perpendicular to the circuit board.
5. 5. The circuit board assembly according to any one of claims 2-4, wherein one of the two circuit boards is provided with the injection port and the other has a connection surface facing the frame plate, the connection surface being formed with a barrier dividing the connection surface into a fillable region and a non-filled region, an orthographic projection of the flow channel at the connection surface falling within the fillable region, the barrier being configured to prevent the filler material flowing into the fillable region from flowing into the non-filled region.
6. 6. The circuit board assembly according to claim 5, wherein the barrier is an annular dam provided protruding from the connection surface, and a height of the annular dam in a thickness direction of the circuit board is not smaller than a distance between the connection surface and a face of the frame plate facing the connection surface.
7. 7. The circuit board assembly of claim 6, wherein the height of the annular dam is equal to the distance between the connection surface and the side of the frame plate facing the connection surface in the thickness direction of the circuit board, and the annular dam is located between the frame plate and one of the circuit boards.
8. 8. The circuit board assembly of claim 6 or 7, wherein the annular dam is made of rubber, plastic or metal.
9. 9. The circuit board assembly of claim 5, wherein the barrier is a separation groove formed in the connection surface, the separation groove being annular.
10. 10. The circuit board assembly of claim 1, wherein when one of said frame plates is provided and two of said circuit boards are provided, said circuit board assembly has one of said fill flow passages, and said frame plates are provided with injection ports on their outer sides, said injection ports communicating with said flow passages on said frame plates.
11. 11. The circuit board assembly of claim 10, wherein a centerline of the injection port is perpendicular to a centerline of the flow channel.
12. 12. The circuit board assembly of claim 10 or 11, wherein an annular dam is disposed between the frame plate and both of the circuit boards, each of the annular dams surrounding the filling gap between the frame plate and an adjacent circuit board.
13. 13. The circuit board assembly of claim 1, wherein when there are more than three of said circuit boards and more than three of said frame boards, said circuit board assembly has a plurality of said fill flow passages, wherein one of said circuit boards is a bottom circuit board, wherein another of said circuit boards is a top circuit board, and wherein the remaining circuit boards are intermediate circuit boards, and wherein all of said intermediate circuit boards are located between said bottom circuit board and said top circuit board.
14. 14. The circuit board assembly of claim 13, wherein any two adjacent said fill flow channels are in communication; The bottom layer circuit board is provided with the injection port, or the top layer circuit board is provided with the injection port, or the outer side surface of at least one frame board is provided with the injection port.
15. 15. The circuit board assembly according to any one of claims 1-14, wherein a first recess is provided in a side of any one of said frame plates facing an adjacent one of said circuit boards, said first recess being in communication with said filling gap between the frame plate and the adjacent circuit board.
16. 16. A circuit board assembly according to any one of claims 1-15, wherein a second recess is provided in a side of any one of said circuit boards facing the associated frame plate, said second recess being in communication with said filling gap between the circuit board and the adjacent frame plate.
17. 17. The circuit board assembly according to any one of claims 1 to 16, wherein a distance between each of the frame plates and the adjacent circuit board is 40 μm or more and 100 μm or less in a thickness direction of the circuit board.
18. 18. The circuit board assembly according to any one of claims 1-17, wherein the circuit board comprises a radio frequency board and/or the circuit board comprises an application processor board.
19. 19. An electronic device comprising a housing and the circuit board assembly of any one of claims 1-18 disposed inside the housing.
20. 20. A method of making a circuit board assembly, the method comprising: Providing a frame plate, wherein a flow channel is arranged on the frame plate; providing two circuit boards, wherein at least one injection port is arranged on one circuit board; The frame plate is arranged between the two circuit boards and is connected with the two circuit boards through solder, filling gaps between the frame plate and the two circuit boards are communicated through the flow channels to form filling flow channels, and the filling flow channels are communicated with the injection openings to obtain a circuit board assembly; a flowable filling material is injected into the injection port, the filling material being injected into the filling gap along the filling flow channel so that the solder between the frame plate and the two circuit boards can be wrapped by the filling material.

Description

Circuit board assembly, electronic equipment and manufacturing method of circuit board assembly The present application is a divisional application, the application number of which is 202210535977.8, the application date of which is 2022, 05, 17, and the entire contents of which are incorporated herein by reference. Technical Field The present application relates to the field of electronic devices, and in particular, to a circuit board assembly, an electronic device, and a method for manufacturing a circuit board assembly. Background As electronic devices require more and more functions to be implemented, more and more electronic components are disposed inside the electronic devices. In order to be able to meet the light and thin requirements of electronic equipment, the electronic equipment may include a circuit board assembly (printed circuit boardassembly, PCBA) including at least one frame plate and two circuit boards, the two opposite sides of the frame plate being provided with bonding pads, the two circuit boards being respectively bonded to the bonding pads of the opposite sides of the frame plate, so that the two circuit boards are stacked and each circuit board is usable for fixing an electronic component. And, an underfill (unref ill) process may be used to fill the solder area between the circuit board and the frame plate with glue to ensure reliable connection of the circuit board to the frame plate. However, in the above manner, the assembly process of the circuit board assembly is complicated. The reason why the assembly process of the circuit board assembly is complicated is that, because the distance between the bonding pad and the edge of the frame board is small, when glue is filled, the bonding pad on one side of one circuit board and the frame board is usually welded, the glue head of the glue dispenser is used for extending into the frame board and dropping the glue near the welding area on the side, the glue flows to the welding area, then the connected circuit board and the frame board are placed into an oven to solidify the glue, then the other circuit board is covered on the other side of the frame board, the bonding pad on the other side of the other circuit board and the frame board is welded, then the welding position of the other circuit board and the frame board is glued, and then the glue is dried by the oven. Therefore, in the assembly process, the glue filling between the frame plate and the two circuit boards cannot be completed in one procedure, and the procedures are more. Disclosure of Invention The embodiment of the application provides a circuit board assembly, electronic equipment and a manufacturing method of the circuit board assembly, and aims to solve the technical problem that in the prior art, when the circuit board assembly is assembled, filling materials cannot be filled between a frame plate and two circuit boards by one procedure, so that the assembly process of the circuit board assembly is complex. In a first aspect, an embodiment of the present application provides a circuit board assembly, including a frame board and at least two circuit boards, wherein each frame board is provided with a flow channel, each frame board is located between two circuit boards, and the frame boards are stacked with all the circuit boards; Each frame plate is connected with two adjacent circuit boards through solder, filling gaps are formed between each frame plate and the two adjacent circuit boards, and the filling gaps between each frame plate and the two adjacent circuit boards are communicated through flow channels and form filling flow channels; The circuit board assembly is provided with at least one injection port for injecting flowable filling material, and each filling runner can be communicated with the at least one injection port, so that the solder between each frame plate and two adjacent circuit boards can be wrapped by the filling material. According to the circuit board assembly provided by the embodiment of the application, the flow channels are arranged on the frame plate, the filling gaps between the frame plate and the two adjacent circuit boards are communicated through the flow channels to form the filling flow channels, the circuit board assembly is provided with the injection ports, and each filling flow channel can be communicated with at least one injection port. In this way, when the circuit board assembly is assembled, the filling material injected into the injection port can flow along the filling runner to the filling gap between each frame plate and the adjacent two circuit boards, so that the solder between the frame plate and any one of the adjacent circuit boards can be wrapped by the filling material. Compared with the related art, the filling material can be injected into the filling gap between the frame plate and the circuit board by using one filling process, the assembling process is reduced, and the assembling process of the circuit