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CN-122028306-A - Industrial control power supply thick copper printed circuit board surface treatment device and treatment method thereof

CN122028306ACN 122028306 ACN122028306 ACN 122028306ACN-122028306-A

Abstract

The invention relates to the field of circuit board surface treatment and discloses an industrial control power supply thick copper printed circuit board surface treatment device and a treatment method thereof, wherein the device comprises a conveying device, a tin spraying device is arranged on one side of the conveying device, and the tin spraying device is used for spraying tin to a printed circuit board on the conveying device; the conveying device is detachably fixed with a plurality of mounting seats, and the mounting seats are provided with clamping mechanisms. According to the invention, the clamping mechanism is arranged on the mounting seat, the circuit board to be subjected to tin spraying treatment is limited by the clamping mechanism, the effect of matching circuit boards with different specifications is realized, the tin spraying treatment is carried out on the circuit board with large specification which is inserted suddenly, the clamping limit condition can be realized only by replacing the clamp which is troublesome in the prior art, and the displacement assembly is additionally arranged on the basis of the mounting seat and used for expanding the limit distance between the two original limiting sleeves, so that the device is suitable for the requirement of suddenly increasing the circuit board with large specification, and is convenient and quick, and high in practical value.

Inventors

  • ZHONG HONG
  • LONG YUANGUI
  • LI PINGSHUN
  • FENG CHUN
  • ZHANG SHUJUAN

Assignees

  • 江西中络电子有限公司

Dates

Publication Date
20260512
Application Date
20230428

Claims (9)

  1. 1. The surface treatment device for the thick copper printed circuit board of the industrial control power supply comprises a conveying device (1), wherein a tin spraying device (2) is arranged on one side of the conveying device (1), and the tin spraying device (2) is used for spraying tin to the printed circuit board on the conveying device (1); The tin spraying device is characterized in that a plurality of mounting seats (3) are detachably fixed on the conveying device (1), a clamping mechanism (4) is arranged on each mounting seat (3), and the clamping mechanism (4) is used for clamping a circuit board to be sprayed with tin.
  2. 2. The surface treatment device for thick copper printed circuit boards of industrial control power supplies according to claim 1, characterized in that the clamping mechanism (4) comprises: A rear limiting plate (41), wherein the rear limiting plate (41) is fixed on the mounting seat (3); The side extrusion parts (42) are arranged in two and symmetrically distributed on the mounting seat (3); The limiting rods (43) are respectively fixedly arranged on one side surface of the side extrusion piece (42) deviating from the mounting seat (3); The limiting rod (43) penetrates through the corresponding limiting sleeve (44), the limiting rod (43) slides relatively on the limiting sleeve (44), the limiting sleeve (44) is mounted on the mounting seat (3), and a reset spring (45) is arranged between the limiting sleeve (44) and the side extrusion piece (42); One end of the traction rope (46) and one side of the limiting rod (43) penetrating through the limiting sleeve (44) are fixedly connected to a sliding piece (47), and the sliding piece (47) is slidably connected to a sliding rail groove (48) formed in the mounting seat (3); And a front limiting plate (49), wherein the front limiting plate (49) corresponds to the rear limiting plate (41) in position and is arranged on the side surface of the sliding piece (47) facing the rear limiting plate (41).
  3. 3. The surface treatment device for the industrial control power thick copper printed circuit board according to claim 2, wherein displacement assemblies (5) are arranged on two sides of the mounting seat (3), and the displacement assemblies (5) are used for adjusting the distance value between the two limiting sleeves (44).
  4. 4. A surface treatment device for thick copper printed circuit boards of industrial control power supply according to claim 3, characterized in that said displacement assembly (5) comprises: One end of the telescopic rod (51) is fixed on the side wall of the mounting seat (3), and the other end of the telescopic rod is fixedly connected with the mounting plate (52); The mounting plate (52), the mounting plate (52) is provided with a longitudinal chute (53), and the mounting plate (52) is flush with the upper surface of the mounting seat (3); The sliding block (54) is slidably arranged in the longitudinal sliding groove (53), and the sliding block (54) is fixedly arranged at the bottom of the limiting sleeve (44).
  5. 5. The surface treatment device for the industrial control power thick copper printed circuit board according to claim 4, wherein a bearing plate (55) is arranged on one side of the mounting plate (52) away from the mounting seat (3), a rope sleeve (56) is fixedly arranged on the bearing plate (55), and the rope sleeve (56) is of a two-way structure and is used for the passing of the traction rope (46).
  6. 6. The surface treatment device for the industrial control power thick copper printed circuit board according to claim 5, wherein the bottom of the longitudinal sliding groove (53) is arranged in a penetrating manner, the bottom end of the sliding block (54) extends out of the mounting plate (52) and is fixedly connected with the bearing plates (55), and two adjacent bearing plates (55) are arranged to be of corresponding inclined plane (57) structures.
  7. 7. The industrial control power thick copper printed circuit board surface treatment device according to claim 4, wherein notches (6) are symmetrically arranged on two sides of the mounting base (3), an auxiliary board body (7) is connected in the notches (6) in a sliding mode, the auxiliary board body (7) is fixedly connected with the side face of the mounting board (52) through a connecting rod (8), a plurality of protrusions (9) are arranged on the upper surface of the auxiliary board body (7), and the protrusions (9) are telescopic structures and are used for compensating differences between the upper surface of the auxiliary board body (7) and the surface of the mounting base (3).
  8. 8. The surface treatment device for the industrial control power thick copper printed circuit board according to claim 7, wherein the protrusion (9) comprises a semicircular arc head (91), the bottom end of the semicircular arc head (91) is of a planar structure, the protrusion is movably mounted in a groove (92) formed in the upper surface of the auxiliary board body (7), and a supporting spring (93) is connected between the groove (92) and the bottom end of the semicircular arc head (91).
  9. 9. The surface treatment method for the industrial control power supply thick copper printed circuit board is characterized by being suitable for the surface treatment device for the industrial control power supply thick copper printed circuit board, which is disclosed in any one of claims 1-8, and comprises the following specific steps: The method comprises the steps of S1, installing a circuit board on a clamping mechanism (4), pulling out a sliding part (47) outwards by one hand of an operator, namely driving a connected front limiting plate (49) to move outwards synchronously, enabling the sliding part (47) to act on traction ropes (46) connected with two sides, enabling the traction ropes (46) to drive the connected limiting rods (43) to slide away from each other, and expanding a space between two side extrusion pieces (42); S2, placing the circuit board to be processed on the mounting seat (3) by using the other hand, slowly loosening the sliding piece (47), and driving the side extrusion piece (42) to move close to each other by the reset spring (45) under the action of elasticity until the side extrusion piece is extruded to the two transverse ends of the circuit board to be processed, wherein the sliding piece (47) is pulled by the traction rope (46) to move inwards, and the front limiting plate (49) and the rear limiting plate (41) are matched to limit the circuit board to be processed longitudinally; s3, when the large-size circuit board is inserted, starting the displacement assembly (5), and expanding the space between the original two side extrusion parts (42) to accommodate the inserted large-size circuit board; s4, the conveying device (1) conveys the circuit board on the mounting seat (3) to the lower part of the tin spraying device (2) and stops operating, and after the tin spraying device (2) finishes tin spraying, the operation is continued.

Description

Industrial control power supply thick copper printed circuit board surface treatment device and treatment method thereof Technical Field The invention relates to the field of circuit board surface treatment, in particular to a surface treatment device and a surface treatment method for an industrial control power supply thick copper printed circuit board. Background The printed circuit board for industrial control power supply needs to plate a layer of copper foil on the epoxy resin substrate, and the copper foil is approximately four kinds of 18 mu m, 35 mu m, 55 mu m and 70 mu m. The surface treatment of the printed circuit board is generally classified into tin spraying, tin depositing, gold plating and osp. The tin spraying is widely used, is the most common surface treatment process in the circuit board row, has good solderability and can be used for most electronic products. Chinese patent CN202020837958.7 discloses a printed circuit board surface treatment's equipment, including the main part case, the inside of main part case is provided with the groove of spraying paint, the both sides of spraying paint the groove are provided with the collecting box, the inside of collecting box is provided with the collecting vat, the inside of collecting vat is fixed with the air exhauster. The technical scheme is that the limiting plate, the conveyor belt, the electric push rod and the spray head are arranged, the circuit board is placed on the conveyor belt, the limiting plate is used for limiting the circuit board, the circuit board is prevented from being deviated in the conveying process, however, the limiting blocks in the fixed state are required to be repeatedly replaced to adapt to the circuit boards with different specifications and sizes, the process is relatively complicated, the operation of operators is not facilitated, the spacing between the limiting blocks is determined, and under the condition that the circuit board is placed in the conveyor belt, the circuit board cannot be attached and matched, so that certain displacement of the circuit board can occur in the moving process, and the subsequent tin spraying and hot air leveling effects are affected. Disclosure of Invention The invention aims to provide a surface treatment device and a treatment method for a thick copper printed circuit board of an industrial control power supply, which solve the technical problems. The aim of the invention can be achieved by the following technical scheme: the surface treatment device for the thick copper printed circuit board of the industrial control power supply comprises a conveying device, wherein a tin spraying device is arranged on one side of the conveying device and is used for spraying tin to the printed circuit board on the conveying device; The conveying device is detachably fixed with a plurality of mounting seats, and the mounting seats are provided with clamping mechanisms used for clamping circuit boards to be sprayed with tin. And the circuit board to be subjected to tin spraying treatment is limited by using the clamping mechanism, so that the effect of matching circuit boards with different specifications is realized. As a further technical solution, the clamping mechanism includes: the rear limiting plate is fixed on the mounting seat; the side extrusion parts are arranged in two and symmetrically distributed on the mounting seat; The two limiting rods are respectively and fixedly arranged on one side surface of the side extrusion piece, which is away from the mounting seat; The limiting rod penetrates through the corresponding limiting sleeve, the limiting rod slides relatively on the limiting sleeve, the limiting sleeve is mounted on the mounting seat, and a reset spring is arranged between the limiting sleeve and the side extrusion piece; One end of the traction rope and one side of the limiting rod, which passes through the limiting sleeve, are fixedly connected to the sliding part, and the sliding part is in sliding connection with a sliding rail groove formed in the mounting seat; The front limiting plate corresponds to the rear limiting plate in position and is arranged on the side face, facing the rear limiting plate, of the sliding piece. Through the action of manually pulling the sliding piece, when the sliding piece is pulled outwards, the clamping of the circuit board is automatically released, and when the sliding piece is released, the clamping effect of the circuit board is automatically realized. As a further technical scheme, displacement assemblies are arranged on two sides of the mounting seat, and the displacement assemblies are used for adjusting the distance value between the two limiting sleeves. The limit distance between the two original limiting sleeves is enlarged, so that the requirement of increasing the specification circuit board suddenly is met, and the circuit board is convenient and quick. As a further technical solution, the displacement assembly includes