CN-122028307-A - Circuit board processing control method and system applied to industrial Internet of things

Abstract

The invention provides a circuit board processing control method and system applied to the industrial Internet of things, relates to the field of the industrial Internet of things, and aims to obtain a real-time visual image set of a circuit board processing area by utilizing a multi-view visual acquisition device deployed in the industrial Internet of things, and execute visual feature extraction processing on the real-time visual image set to obtain circuit profile, welding spot pre-positioning and processing material posture features of the circuit board. And matching the characteristics with preset standard characteristics to generate visual characteristic deviation information, and deriving equipment dynamic adjustment parameters including machining head position, machining force and material supply angle adjustment parameters according to machining process requirements. And generating a processing control instruction guided by computer vision according to the dynamic adjustment parameters and transmitting the processing control instruction to corresponding equipment, simultaneously monitoring the processing vision state of the instruction after execution in real time through a vision acquisition device, continuously optimizing the subsequent control instruction based on feedback, realizing the dynamic control of the processing process of the circuit board, and improving the processing precision and quality.

Inventors

• ZHANG GUOHUA

Assignees

• 深圳市华富快捷电路有限公司

Dates

Publication Date

20260512

Application Date

20251225

Claims (10)

1. 1. The circuit board processing control method applied to the industrial Internet of things is characterized by comprising the following steps of: The method comprises the steps that a multi-view visual acquisition device deployed by an industrial Internet of things is used for acquiring a real-time visual image set of a circuit board processing area, wherein the real-time visual image set comprises an image of the circuit board to be processed, a circuit board state image in processing and a material supply gesture image; performing visual feature extraction processing on the real-time visual image set to obtain circuit contour features of a circuit board, welding spot preset features of the circuit board and processing material posture features; matching the circuit profile characteristics, the welding point preset characteristics and the processing material posture characteristics of the circuit board with preset circuit board processing visual standard characteristics to generate visual characteristic deviation information; based on the visual characteristic deviation information, combining the processing technology requirements of the circuit board, deriving dynamic adjustment parameters of processing equipment of the circuit board, wherein the dynamic adjustment parameters comprise equipment processing head position adjustment parameters, equipment processing force adjustment parameters and material supply angle adjustment parameters; Generating a circuit board processing control instruction guided by computer vision according to the dynamic adjustment parameters, transmitting the circuit board processing control instruction to corresponding circuit board processing equipment and a material supply device, monitoring the circuit board processing vision state after instruction execution in real time through a vision acquisition device, and continuously optimizing the subsequent control instruction based on vision state feedback to realize dynamic control of the circuit board processing process.
2. 2. The circuit board processing control method applied to the industrial internet of things according to claim 1, wherein in a circuit board processing scene of the industrial internet of things, a multi-view vision acquisition device is deployed around a processing station of circuit board processing equipment, and the multi-view vision acquisition device comprises a top nodding-down vision module, a side nodding-up vision module and a material supply end vision module; The multi-view vision acquisition device deployed through the industrial Internet of things acquires a real-time vision image set of a circuit board processing area, and comprises: aiming at the top nodding vision module, adjusting the shooting angle and focal length of the top nodding vision module to enable the shooting visual field to cover the complete range of the to-be-processed area of the circuit board, setting the shooting frame rate to keep synchronous with the processing beat of the circuit board processing equipment, and synchronously acquiring a frame of to-be-processed area image of the circuit board when each circuit unit is processed; Aiming at the side shooting vision module, adjusting the shooting angle and the light source intensity of the side shooting vision module to enable a shooting picture to effectively present the contact state of a processing head and a circuit board in the processing process of the circuit board, and setting a shooting trigger mechanism to automatically trigger shooting when the processing head starts the processing action to generate a circuit board state image in the processing process; aiming at the material supply end vision module, adjusting the shooting position and the image resolution of the material supply end vision module to enable the shot visual field covering material to be transmitted to the tail end area of the processing station, setting shooting intervals to be matched with the material transmission speed, and synchronously acquiring a frame of material supply gesture image when one processing material is transmitted; Constructing a visual image synchronous transmission mechanism, and transmitting image data acquired by a top nodding visual module, a side nodding visual module and a material supply end visual module to an image processing unit through a special communication link of the industrial Internet of things; And performing time stamp alignment processing on the image data transmitted to the image processing unit, classifying the circuit board to-be-processed area image, the circuit board state image and the material supply gesture image which are acquired at the same processing time into one group, and integrating the image data with multiple groups of time stamps aligned to form a real-time visual image set containing the circuit board to-be-processed area image, the circuit board state image and the material supply gesture image.
3. 3. The method for controlling circuit board processing applied to industrial internet of things according to claim 1, wherein the step of performing visual feature extraction processing on the real-time visual image set to obtain circuit board line profile features, circuit board welding spot pre-positioning features and processed material posture features comprises the steps of: Extracting an image of a circuit board to-be-processed area in a real-time visual image set, and executing image preprocessing operation on the image of the circuit board to-be-processed area to obtain a preprocessed image of the circuit board to-be-processed area, wherein the image preprocessing operation comprises gray conversion, gaussian filtering denoising and edge enhancement processing, so that the outline definition of a circuit board in the image of the circuit board to-be-processed area is enhanced; Performing image segmentation processing on the preprocessed circuit board to-be-processed area image, and separating a circuit board substrate area from a circuit pattern area by adopting a threshold segmentation algorithm to obtain a circuit pattern binarized image; In the circuit graph binarization image, a contour extraction algorithm is adopted to extract continuous edge pixel points of a circuit board, a coordinate sequence of the edge pixel points is calculated, geometric contour parameters of the circuit board are generated based on the coordinate sequence, the geometric contour parameters comprise circuit width, circuit spacing and circuit corner radian, and the circuit width, the circuit spacing and the circuit corner radian are integrated to form circuit contour features of the circuit board; Extracting a circuit board to-be-processed area image in the real-time visual image set, executing interest area extraction processing on the circuit board to-be-processed area image, and determining a welding spot prepositioning area in the circuit board to-be-processed area image based on a preset welding spot layout rule; Performing characteristic enhancement processing on the welding spot preset positioning area, enhancing texture characteristics of the welding spot preset positioning area by adopting a morphological expansion algorithm, and identifying characteristic corner points in the welding spot preset positioning area by using a Harris corner point detection algorithm; Calculating the distance and angle relation between characteristic corner points, and generating a spatial position parameter of a welding spot preset region, wherein the spatial position parameter comprises a welding spot center coordinate, welding spot distribution density and connection deviation of welding spots and circuits, and integrating the welding spot center coordinate, the welding spot distribution density and the connection deviation of the welding spots and the circuits to form a welding spot preset characteristic of the circuit board; Extracting a material supply gesture image in the real-time visual image set, executing gesture feature extraction processing on the material supply gesture image, and separating a processed material region and a background region in the material supply gesture image by adopting a background difference algorithm to obtain a processed material foreground image; Performing contour fitting processing on the foreground image of the processed material to generate an external rectangular frame of the processed material, calculating an included angle between the long axis direction of the external rectangular frame and a preset reference direction, and determining deflection angle parameters of the processed material; And acquiring the barycenter coordinates of the foreground image of the processing material by an image moment calculation method, comparing the deviation between the barycenter coordinates and the preset material supply reference coordinates, determining the position deviation parameters of the processing material, and integrating the deflection angle parameters and the position deviation parameters to form the attitude characteristics of the processing material.
4. 4. The method for controlling circuit board processing applied to industrial internet of things according to claim 3, wherein the performing image segmentation processing on the preprocessed circuit board to-be-processed area image, separating a circuit board substrate area and a circuit pattern area by using a threshold segmentation algorithm to obtain a circuit pattern binary image comprises: carrying out gray histogram statistics on the preprocessed circuit board to-be-processed area image, obtaining the distribution frequency of gray values in the circuit board to-be-processed area image, determining two peak areas of the gray value distribution, and respectively corresponding to the gray range of the circuit board substrate area and the gray range of the circuit pattern area; Calculating an optimal threshold value of image segmentation by adopting a maximum inter-class variance algorithm, wherein the optimal threshold value is a gray value for maximizing the inter-class variance of a substrate area and a circuit graph area; Comparing the gray value of each pixel in the preprocessed circuit board to-be-processed area image with an optimal threshold value, and if the gray value of the pixel is larger than the optimal threshold value, marking the pixel as a circuit pattern area pixel and assigning the pixel as a preset foreground pixel value; and performing noise removal processing on the marked circuit board to-be-processed area image, performing edge smoothing processing on the processed circuit board to-be-processed area image, and storing the circuit board to-be-processed area image as a circuit pattern binary image.
5. 5. The method for controlling circuit board processing applied to industrial internet of things according to claim 3, wherein the performing contour fitting processing on the foreground image of the processed material to generate an external rectangular frame of the processed material, calculating an included angle between a long axis direction of the external rectangular frame and a preset reference direction, and determining a deflection angle parameter of the processed material comprises: performing contour detection processing on the foreground image of the processed material, extracting an outer contour pixel point sequence of a foreground area of the processed material by adopting a chain code tracking algorithm, and recording coordinate information of each contour pixel point; Based on the outline pixel point sequence, generating a minimum circumscribed rectangular frame of the processed material by adopting a minimum circumscribed rectangular algorithm, wherein the minimum circumscribed rectangular frame is a rectangle which can completely surround a foreground area of the processed material and has the smallest area; Extracting four vertex coordinates of the minimum circumscribed rectangular frame, calculating the distance between adjacent vertexes, and determining the long side length and the short side length of the minimum circumscribed rectangular frame, wherein the side corresponding to the long side length is the long axis of the circumscribed rectangular frame; setting a preset reference direction in an image coordinate system, wherein the preset reference direction is a direction parallel to the feeding direction of the circuit board processing equipment, and recording the angle value of the preset reference direction; calculating an included angle between the long axis direction of the external rectangular frame and a preset reference direction, wherein the included angle is marked as a positive value if the long axis direction deflects clockwise relative to the preset reference direction, and is marked as a negative value if the long axis direction deflects anticlockwise relative to the preset reference direction; Performing precision calibration on the calculated included angle value, adopting a sub-pixel level edge detection algorithm to relocate the outline pixel point, correcting the vertex coordinates of the external rectangular frame, and then recalculating the included angle value to ensure that the precision of the deflection angle parameter meets the processing requirement of the circuit board; and determining the calibrated included angle value as a deflection angle parameter of the processed material.
6. 6. The method for controlling circuit board processing applied to industrial internet of things according to claim 1, wherein the matching the circuit board line profile feature, the circuit board welding spot preset feature and the processing material posture feature with preset circuit board processing vision standard features to generate vision feature deviation information comprises: the method comprises the steps of calling preset circuit board processing visual standard features, wherein the preset circuit board processing visual standard features comprise circuit board circuit profile standard features, circuit board welding spot preset standard features and processing material posture standard features; The circuit board welding point preset standard characteristic comprises a standard welding point center coordinate, a standard welding point distribution density and a standard welding point and circuit connection deviation, and the processed material posture standard characteristic comprises a standard material deflection angle and a standard material position deviation; Comparing the line width in the extracted line profile features of the circuit board with the standard line width in the standard line profile features of the circuit board, and calculating the difference value of the line width and the standard line width to obtain a line width deviation value; Comparing the line spacing in the extracted line profile features of the circuit board with the standard line spacing in the standard line profile features of the circuit board, and calculating the difference value between the line spacing and the standard line spacing to obtain a line spacing deviation value; Comparing the line corner radian in the extracted line profile characteristic of the circuit board with the standard line corner radian in the standard line profile characteristic of the circuit board, and calculating the difference value of the line corner radian and the standard line corner radian to obtain a line corner radian deviation value; comparing the central coordinates of the welding spots in the extracted welding spot preset features of the circuit board with the central coordinates of the standard welding spots in the welding spot preset standard features of the circuit board, and calculating the coordinate difference values of the central coordinates of the welding spots in the X-axis direction and the Y-axis direction to obtain a central coordinate deviation value of the welding spots; comparing the distribution density of the welding spots in the extracted welding spot pre-positioning characteristic of the circuit board with the distribution density of the standard welding spots in the welding spot pre-positioning standard characteristic of the circuit board, and calculating the difference value of the two to obtain a deviation value of the distribution density of the welding spots; comparing the welding spot and circuit connection deviation in the extracted welding spot preset characteristic of the circuit board with the standard welding spot and circuit connection deviation in the welding spot preset standard characteristic of the circuit board, and calculating the difference value of the welding spot and the circuit connection deviation to obtain a welding spot connection deviation value; comparing the material deflection angle in the extracted processed material posture characteristics with the standard material deflection angle in the processed material posture standard characteristics, and calculating the difference value of the two to obtain a material deflection angle deflection value; comparing the material position deviation in the extracted processed material posture characteristics with the standard material position deviation in the processed material posture standard characteristics, and calculating the deviation difference value of the two in the X-axis and Y-axis directions to obtain a material position deviation value; and integrating the line width deviation value, the line spacing deviation value, the line corner radian deviation value, the welding spot center coordinate deviation value, the welding spot distribution density deviation value, the welding spot connection deviation value, the material deflection angle deviation value and the material position deviation value to form visual characteristic deviation information.
7. 7. The circuit board processing control method applied to the industrial internet of things according to claim 1, wherein the deriving the dynamic adjustment parameters of the circuit board processing equipment based on the visual characteristic deviation information and in combination with the circuit board processing technology requirements comprises: The method comprises the steps of calling a circuit board processing technology requirement document, and extracting the accuracy requirement, the processing strength requirement and the material supply posture requirement aiming at circuit board processing from the circuit board processing technology requirement document; Aiming at a line width deviation value, a line spacing deviation value and a line corner radian deviation value in visual characteristic deviation information, analyzing the influence of the line width deviation value, the line spacing deviation value and the line corner radian deviation value on the processing precision of a circuit board, and determining the position parameter type of a processing head of equipment to be adjusted, wherein the position parameter type of the processing head of equipment comprises an X-axis position of the processing head, a Y-axis position of the processing head and a Z-axis position of the processing head; Calculating an X-axis position adjustment quantity of the processing head according to the physical line width deviation value, adjusting the processing head towards the X-axis negative direction if the physical line width deviation value is positive, wherein the adjustment quantity is positively correlated with the physical line width deviation value; Calculating Y-axis position adjustment quantity of the processing head according to the physical line space deviation value, adjusting the processing head towards the Y-axis negative direction if the physical line space deviation value is positive, wherein the adjustment quantity is positively correlated with the physical line space deviation value; Calculating Z-axis position adjustment quantity of the processing head according to the line corner radian deviation value, wherein if the line corner radian deviation value is a positive value, the processing head is required to be adjusted in the positive direction of the Z axis to reduce the processing depth, and the adjustment quantity is positively correlated with the line corner radian deviation value; integrating the X-axis position adjustment amount of the processing head, the Y-axis position adjustment amount of the processing head and the Z-axis position adjustment amount of the processing head to form a position adjustment parameter of the processing head of the equipment; Aiming at the welding spot center coordinate deviation value, the welding spot distribution density deviation value and the welding spot connection deviation value in the visual characteristic deviation information, analyzing the influence of the welding spot center coordinate deviation value, the welding spot distribution density deviation value and the welding spot connection deviation value on the welding spot processing quality, and determining the equipment processing force parameter type to be adjusted according to the processing force requirement in the processing technology requirement, wherein the equipment processing force parameter type comprises the processing head pressing force and the processing head residence time; Calculating a processing head down pressure degree adjustment quantity according to the physical welding spot center coordinate deviation value, if the physical welding spot center coordinate deviation value exceeds a preset welding spot coordinate deviation threshold value, increasing the processing head down pressure degree to ensure firm welding spot connection, wherein the adjustment quantity is positively correlated with the absolute value of the physical welding spot center coordinate deviation value, and if the physical welding spot center coordinate deviation value does not exceed the preset welding spot coordinate deviation threshold value, the processing head down pressure degree is maintained or reduced to avoid the damage of a circuit board substrate, and the adjustment quantity is negatively correlated with the absolute value of the physical welding spot center coordinate deviation value; calculating the stay time adjustment quantity of the processing head according to the distribution density deviation value of the welding spots, if the distribution density deviation value of the welding spots is positive, shortening the stay time of the processing head on each welding spot to improve the processing efficiency, and if the distribution density deviation value of the welding spots is negative, prolonging the stay time of the processing head on each welding spot to ensure the quality of the welding spots, wherein the stay time of the processing head on each welding spot is positive; Integrating the adjustment amount of the pressing force of the processing head and the adjustment amount of the residence time of the processing head to form the adjustment parameter of the processing force of the equipment; Analyzing the influence of the material deflection angle deviation value and the material position deviation value on the material supply gesture aiming at the material deflection angle deviation value and the material position deviation value in the visual characteristic deviation information, and determining the material supply angle parameter type to be adjusted according to the material supply gesture requirement in the processing technology requirement, wherein the material supply angle parameter type comprises a material conveying roller deflection angle and a material pushing device inclination angle; Calculating the deflection angle adjustment quantity of the material conveying roller according to the deflection angle deviation value of the material, and adjusting the material conveying roller to the anticlockwise direction if the deflection angle deviation value of the material is positive, wherein the adjustment quantity is in positive correlation with the deflection angle deviation value of the material; Calculating an inclination angle adjustment amount of the material pushing device according to the physical material position deviation value, wherein the material pushing device is required to be inclined towards the X-axis negative direction if the physical material position deviation value is a positive value, the adjustment amount is positively correlated with the X-axis deviation value, and the material pushing device is required to be inclined towards the Y-axis negative direction if the physical material position deviation value is a positive value; And integrating the deflection angle adjustment quantity of the material conveying roller and the inclination angle adjustment quantity of the material pushing device to form the material supply angle adjustment parameter.
8. 8. The method for controlling circuit board processing applied to industrial Internet of things according to claim 7, wherein the converting the circuit width deviation value from pixel unit to physical length unit based on the preset pixel equivalent conversion coefficient to obtain the physical circuit width deviation value, calculating the position adjustment quantity of the X axis of the processing head according to the physical circuit width deviation value, adjusting the processing head to the negative X axis direction if the physical circuit width deviation value is positive, wherein the adjustment quantity is positively correlated with the physical circuit width deviation value, adjusting the processing head to the positive X axis direction if the physical circuit width deviation value is negative, and positively correlated with the absolute value of the physical circuit width deviation value, comprises: the method comprises the steps of calling a position adjustment precision document of a processing head of circuit board processing equipment, and determining a minimum unit value of the position adjustment of an X axis of the processing head, so that the calculated adjustment amount is an integer multiple of the minimum unit value; Establishing a correlation model of the physical line width deviation value and the X-axis position adjustment amount of the processing head, wherein the correlation model takes the physical line width deviation value as input and takes the X-axis position adjustment amount of the processing head as output; if the width deviation value of the physical line is a positive value, substituting the width deviation value of the physical line into a correlation model, and determining an adjustment coefficient by the correlation model according to the size of the width deviation value of the physical line, wherein the larger the width deviation value of the physical line is, the larger the adjustment coefficient is, and the adjustment quantity is determined by the product relation of the width deviation value of the physical line and the adjustment coefficient; Performing precision calibration on the calculated adjustment quantity, if the adjustment quantity is not an integer multiple of the minimum unit value, rounding upwards or downwards, and enabling the reduced width deviation value of the adjusted physical line to be the largest by the rounded value; If the physical line width deviation value is a certain physical length unit value, the adjustment coefficient is a preset adjustment coefficient value, and the minimum unit value is a device coordinate value corresponding to a preset physical length unit, the adjustment quantity is determined by the product relation of the physical length unit value and the preset adjustment coefficient value, and if the result is an integer multiple of the minimum unit value, no rounding is needed; If the physical line width deviation value is a certain physical length unit value, the adjustment coefficient is a preset adjustment coefficient value, the minimum unit value is a device coordinate value corresponding to a preset physical length unit, and the calculated adjustment quantity is not an integer multiple of the minimum unit value, the adjustment is carried out upwards, so that the reduction amplitude of the adjusted physical line width deviation value is maximum; If the width deviation value of the physical line is a negative value, substituting the absolute value of the width deviation value of the physical line into the correlation model, wherein the calculation method is the same as the positive value deviation, and the adjustment direction is changed into the positive direction of the X axis; verifying the calibrated adjustment quantity, substituting the adjustment quantity into a line width deviation prediction formula, predicting an adjusted physical line width deviation value, and determining the adjustment quantity as a final X-axis position adjustment quantity of the processing head if the predicted and adjusted physical line width deviation value is within an allowable range of a process requirement; If the predicted and adjusted physical line width deviation value exceeds the allowable range of the process requirement, the adjustment coefficient is increased, and the adjustment quantity is recalculated until the predicted and adjusted physical line width deviation value meets the process requirement.
9. 9. The method for controlling circuit board processing applied to industrial internet of things according to claim 1, wherein generating the circuit board processing control command guided by computer vision according to the dynamic adjustment parameter, transmitting the circuit board processing control command to a corresponding circuit board processing device and a material supply device, monitoring the circuit board processing visual state after the command execution in real time through a visual acquisition device, continuously optimizing the subsequent control command based on visual state feedback, and realizing dynamic control of the circuit board processing process, comprises: analyzing the position adjustment parameters, the machining force adjustment parameters and the material supply angle adjustment parameters of the equipment in the dynamic adjustment parameters, and extracting the specific numerical value and the adjustment direction of each adjustment parameter in the position adjustment parameters, the machining force adjustment parameters and the material supply angle adjustment parameters of the equipment; Generating a processing head control instruction segment for the circuit board processing equipment, wherein the processing head control instruction segment comprises an equipment identifier, a processing head X-axis position adjustment value, a processing head Y-axis position adjustment value, a processing head Z-axis position adjustment value, a processing head downward pressure adjustment value and a processing head residence time adjustment value; Generating a material attitude control instruction segment for the material supply device, wherein the material attitude control instruction segment comprises a device identifier, a material conveying roller deflection angle adjustment value and a material pushing device inclination angle adjustment value; Synchronously integrating the processing head control instruction segment and the material posture control instruction segment according to the execution time, so that the processing head adjustment and the material posture adjustment are executed in the same processing beat, and a circuit board processing control instruction guided by computer vision is formed; The method comprises the steps of converting a communication protocol of the industrial Internet of things on a circuit board processing control instruction, transmitting the converted circuit board processing control instruction to corresponding circuit board processing equipment and a material supply device, enabling the circuit board processing equipment and the material supply device to execute corresponding operation according to adjustment parameters in the circuit board processing control instruction after receiving the circuit board processing control instruction, and simultaneously acquiring a circuit board processing visual state image after instruction execution in real time by a multi-view visual acquisition device deployed by the industrial Internet of things; performing real-time visual feature extraction on the acquired circuit board processing visual state image to obtain circuit board line profile features after instruction execution, circuit board welding spot preset features after instruction execution and processing material posture features after instruction execution; Comparing the line profile characteristics of the circuit board after the instruction execution, the welding point preset characteristics of the circuit board after the instruction execution and the processing material posture characteristics after the instruction execution with preset circuit board processing visual standard characteristics, and calculating new visual characteristic deviation information; If the line width deviation value, the line spacing deviation value, the line corner radian deviation value, the welding spot center coordinate deviation value, the welding spot distribution density deviation value, the welding spot connection deviation value, the material deflection angle deviation value and the material position deviation value in the new visual characteristic deviation information are all within the allowable range of the process requirement, the subsequent line board processing control instruction is kept unchanged; If the new visual characteristic deviation information has deviation values exceeding the allowable range, dynamic adjustment parameters are deduced again based on the deviation values exceeding the allowable range in the new visual characteristic deviation information, and an optimized circuit board processing control instruction is generated; And transmitting the optimized circuit board processing control instruction to corresponding circuit board processing equipment and a material supply device, repeating the steps of visual monitoring, feature comparison, deviation calculation and instruction optimization, and continuously and dynamically adjusting the circuit board processing process.
10. 10. Be applied to industry thing networking's circuit board processing control system, characterized by comprising: A processor; a machine-readable storage medium storing machine-executable instructions for the processor; wherein the processor is configured to execute the circuit board processing control method applied to the industrial internet of things of any one of claims 1 to 9 via execution of the machine executable instructions.

Description

Circuit board processing control method and system applied to industrial Internet of things Technical Field The invention relates to the technical field of industrial Internet of things, in particular to a circuit board processing control method and system applied to the industrial Internet of things. Background Currently, the circuit board processing industry is advancing towards intellectualization and high precision. The circuit board is used as a key component of electronic equipment, and the processing quality of the circuit board directly influences the performance and reliability of electronic products. The conventional circuit board processing control method has a plurality of limitations. On the one hand, manual detection and empirical judgment are mainly relied on to adjust the processing equipment and the material supply device. The manual detection is not only low in efficiency, but also is easily affected by subjective factors, so that the detection result is inaccurate, and fine deviation in the circuit board processing process can not be found in time. For example, in detecting the line profile and the solder joint position of the circuit board, the manual vision may not accurately recognize a minute dimensional deviation or positional deviation, thereby affecting the processing quality of the circuit board. On the other hand, although the existing automatic processing control method improves the processing efficiency to a certain extent, a real-time and accurate visual feedback mechanism is often lacking, and the method generally processes according to preset fixed parameters and is difficult to dynamically adjust according to the actual state in the processing process of the circuit board. When the gesture of the processed material changes or the processing equipment has small deviation, the response cannot be timely made, so that the processed circuit board has quality problems such as circuit short circuit, welding spot cold joint and the like, the defective rate of products is increased, and the production cost is increased. Disclosure of Invention In view of the above-mentioned problems, in combination with the first aspect of the present invention, an embodiment of the present invention provides a circuit board processing control method applied to industrial internet of things, where the method includes: The method comprises the steps that a multi-view visual acquisition device deployed by an industrial Internet of things is used for acquiring a real-time visual image set of a circuit board processing area, wherein the real-time visual image set comprises an image of the circuit board to be processed, a circuit board state image in processing and a material supply gesture image; performing visual feature extraction processing on the real-time visual image set to obtain circuit contour features of a circuit board, welding spot preset features of the circuit board and processing material posture features; matching the circuit profile characteristics, the welding point preset characteristics and the processing material posture characteristics of the circuit board with preset circuit board processing visual standard characteristics to generate visual characteristic deviation information; based on the visual characteristic deviation information, combining the processing technology requirements of the circuit board, deriving dynamic adjustment parameters of processing equipment of the circuit board, wherein the dynamic adjustment parameters comprise equipment processing head position adjustment parameters, equipment processing force adjustment parameters and material supply angle adjustment parameters; Generating a circuit board processing control instruction guided by computer vision according to the dynamic adjustment parameters, transmitting the circuit board processing control instruction to corresponding circuit board processing equipment and a material supply device, monitoring the circuit board processing vision state after instruction execution in real time through a vision acquisition device, and continuously optimizing the subsequent control instruction based on vision state feedback to realize dynamic control of the circuit board processing process. In still another aspect, an embodiment of the present invention further provides a circuit board processing control system applied to an industrial internet of things, which is characterized by including: The circuit board processing control method comprises the steps of enabling a processor to execute a circuit board processing control method applied to the industrial Internet of things, and enabling the processor to execute the circuit board processing control method applied to the industrial Internet of things by executing machine executable instructions. In still another aspect, an embodiment of the present invention further provides a computer program product, where the computer program product includes machine executable instruct