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CN-122028310-A - Back drilling position detection method, back drilling processing equipment and circuit board

CN122028310ACN 122028310 ACN122028310 ACN 122028310ACN-122028310-A

Abstract

The embodiment of the application discloses a back drilling processing method, back drilling processing equipment and a circuit board. According to the method, the first plane coordinate information of the structure to be backed-drilled at the target signal layer and the depth information required by backing the structure to be backed-drilled are detected from the circuit board on which the structure to be backed-drilled is processed, so that the position of a backing drill bit corresponding to the structure to be backed-drilled is optimized, the depth of backing drilling processing of the structure to be backed-drilled is accurately identified, the backing drill bit can be accurately controlled from the position of the backing drill bit corresponding to the structure to be backed-drilled, backing drilling processing is performed on the structure to be backed-drilled to form a backing drilled hole on the circuit board, the accurate position and depth of the backing drilled hole are ensured, the alignment deviation of the backing drilling processing near the target signal layer is reduced, the problem of inconsistent height of a stub caused by deviation of the structure to be backed-drilled is solved, the consistency of the height of the stub is improved, the signal transmission quality is further enhanced, and the strict requirement of high-speed communication application on electrical performance is met.

Inventors

  • XIE ZHANGXIONG
  • LIU HAO
  • TANG XUWEI

Assignees

  • 深圳市大族数控科技股份有限公司

Dates

Publication Date
20260512
Application Date
20260212

Claims (12)

  1. 1. A backdrilling position detection method, comprising: Detecting a circuit board with a structure to be backed-drilled to obtain backing-drilling position information of backing-drilling the circuit board, wherein the backing-drilling position information comprises first plane coordinate information of the backing-drilling structure at a target signal layer of the circuit board and depth information required by backing-drilling the structure to be backed-drilled; and the first plane coordinate information and the depth information are used for indicating the depth control back drilling, and back drilling holes are formed on the circuit board.
  2. 2. The backdrilling position detection method according to claim 1, wherein the detecting the circuit board with the structure to be backdrilled to obtain backdrilling position information for backdrilling the circuit board comprises: And scanning the circuit board by adopting an internal structure detection device to acquire the first plane coordinate information and the depth information.
  3. 3. The backdrilling position detection method of claim 2, wherein the scanning the circuit board with the internal structure detection device to obtain the first plane coordinate information and the depth information includes: Scanning the circuit board by adopting the internal structure detection device to obtain two-dimensional tomographic images of all layers in the circuit board; and determining the first plane coordinate information and the depth information according to the two-dimensional tomographic image.
  4. 4. The backdrilling position detection method of claim 3, wherein the determining the first plane coordinate information and the depth information from the two-dimensional tomographic image includes: Acquiring the first plane coordinate information according to the two-dimensional tomographic image at the target signal layer, and constructing a three-dimensional image of the circuit board according to the two-dimensional tomographic image of each layer inside the circuit board; And acquiring the depth information according to the two-dimensional tomographic image and the three-dimensional image, wherein the depth information comprises coordinates of the target signal layer in the depth direction of the circuit board.
  5. 5. The backdrilling position detection method of claim 4, wherein the first plane coordinate information includes a first geometric center of a cross section at an intersection of the structure to be backdrilled and the target signal layer, the first geometric center including a first transverse coordinate and a first longitudinal coordinate; the acquiring the first plane coordinate information according to the two-dimensional tomographic image at the target signal layer includes: determining the first geometric center and a second geometric center of a cross section at the intersection of the target structure on the circuit board and the target signal layer according to the two-dimensional tomographic image at the target signal layer; Acquiring a transverse moving distance and a longitudinal moving distance of the visual field range of the internal structure detection device from the second geometric center to the first geometric center in the horizontal direction of the circuit board; Determining that the first geometric center and the second geometric center are respectively in the visual field range of the internal structure detection device, and deviating from a first transverse offset distance, a first longitudinal offset distance, a second transverse offset distance and a second longitudinal offset distance of the visual field center of the internal structure detection device; based on the second geometric center, the first transverse coordinate is determined according to the transverse movement distance, the first transverse offset distance and the second transverse offset distance, and the first longitudinal coordinate is determined according to the longitudinal movement distance, the first longitudinal offset distance and the second longitudinal offset distance.
  6. 6. The backdrilling position detection method according to any one of claims 1 to 5, wherein after the detection of the circuit board on which the structure to be backdrilled is processed, the backdrilling position information for backdrilling the circuit board is obtained, further comprising: Responding to the back drilling hole formed on the circuit board, and scanning the circuit board by adopting an internal structure detection device to obtain a Stub value of the back drilling hole; and if the Stub value is greater than or equal to a preset threshold value, detecting first plane coordinate information of the structure to be backed-drilled at the target signal layer and depth information required by backing the structure to be backed-drilled from the circuit board on which the structure to be backed-drilled is processed, so as to indicate that backing drilling processing is performed on the structure to be backed-drilled again.
  7. 7. A back drilling method, comprising: The method comprises the steps of obtaining back drilling position information of back drilling on a circuit board with a structure to be back drilled, wherein the back drilling position information comprises first plane coordinate information of the back drilling structure at a target signal layer of the circuit board and depth information required by back drilling on the structure to be back drilled; and acquiring back drilling tool positions according to the first plane coordinate information and the depth information, and controlling a back drilling bit to start from the back drilling tool positions corresponding to the back drilling structure to be backed, and carrying out back drilling processing on the back drilling structure to be backed so as to form back drilling holes on the circuit board.
  8. 8. The method of claim 7, wherein the obtaining the back drilling tool position according to the first plane coordinate information and the depth information, controlling the back drilling bit to start from the back drilling tool position corresponding to the structure to be backed, and performing back drilling on the structure to be backed to form a back drilling hole on the circuit board, includes: acquiring second plane coordinate information of the structure to be backdrilled on the backdrilling tool face; Determining third plane coordinate information of a back drilling tool position corresponding to the structure to be backed-drilled according to the first plane coordinate information and the second plane coordinate information; Generating a processing program which can be identified by the back drilling device according to the third plane coordinate information and the depth information; And controlling the back drilling bit to start from the back drilling tool position according to the processing program, and performing back drilling processing on the structure to be back drilled so as to form back drilling holes on the circuit board.
  9. 9. The backdrilling method of claim 8, wherein the first planar coordinate information comprises a first geometric center of a cross-section where the structure to be backdrilled intersects the target signal layer, the first geometric center comprising a first lateral coordinate and a first longitudinal coordinate, the second planar coordinate information comprising a third geometric center of the structure to be backdrilled at the backdrilling tool face, the third geometric center comprising a second lateral coordinate and a second longitudinal coordinate; the determining, according to the first plane coordinate information and the second plane coordinate information, third plane coordinate information of a back drilling tool position corresponding to the structure to be back drilled includes: Determining a midpoint of a connecting line between the first geometric center and the third geometric center according to the first transverse coordinate, the second transverse coordinate, the first longitudinal coordinate and the second longitudinal coordinate, and a third transverse coordinate and a third longitudinal coordinate in the horizontal direction of the circuit board; and determining the third transverse coordinate and the third longitudinal coordinate as third plane coordinate information of the back drilling tool position corresponding to the structure to be backed.
  10. 10. The backdrilling method of claim 7, wherein the acquiring the backdrilling tool position according to the first plane coordinate information and the depth information, controlling the backdrilling bit to start from the backdrilling tool position corresponding to the structure to be backdrilled, and performing backdrilling on the structure to be backdrilled to form a backdrilled hole on the circuit board, comprises: Determining the first plane coordinate information as third plane coordinate information of a back drilling tool position corresponding to the structure to be backed-drilled; Generating a processing program which can be identified by the back drilling device according to the third plane coordinate information and the depth information; And controlling the back drilling bit to start from the back drilling tool position according to the processing program, and performing back drilling processing on the structure to be back drilled so as to form back drilling holes on the circuit board.
  11. 11. A back drilling processing device is characterized in that, the backdrilling processing device comprises: The internal structure detection device is configured to detect a circuit board processed with a structure to be backed-drilled to obtain backing-drilling position information for backing-drilling the circuit board, wherein the backing-drilling position information comprises first plane coordinate information of the backing-drilling structure at a target signal layer of the circuit board and depth information required by backing-drilling the structure to be backed-drilled; The back drilling device is configured to acquire the first plane coordinate information and the depth information, acquire back drilling tool positions according to the first plane coordinate information and the depth information, and control a back drilling bit to start from the back drilling tool positions corresponding to the back drilling structure to be backed-drilled, and back drill the back drilling structure to be backed-drilled so as to form back drilling holes on the circuit board.
  12. 12. A circuit board, wherein the circuit board is processed by the back drilling position detection method according to any one of claims 1 to 5 or the back drilling processing method according to any one of claims 6 to 10.

Description

Back drilling position detection method, back drilling processing equipment and circuit board Technical Field The application relates to the technical field of back drilling, in particular to a back drilling position detection method, a back drilling method, back drilling equipment and a circuit board. Background Along with the continuous promotion of the informatization industry, the speed of digital signal transmission is faster and faster, the frequency is higher and higher, and the performance requirement of the printed circuit board is continuously improved, wherein the back drilling processing directly relates to the integrity of signal transmission and the overall quality of the printed circuit board. In the conventional technology, a processing mode of proportional or Charge-Coupled Device (CCD) alignment is generally adopted to prevent and process the whole proportional expansion and contraction of the printed circuit board so as to solve the influence of the proportional expansion and contraction of the board. However, even if the initial alignment is accurate, the situation that the back drilling hole deviates from the central axis of the through hole in the deep region and the heights of the stub piles are inconsistent can still occur, so that the electrical performance of the printed circuit board is reduced, and the actual performance requirement of high-speed communication application cannot be met. Disclosure of Invention Based on the detection method, the back drilling processing equipment and the circuit board, which can improve the electrical performance of the circuit board, are provided. In a first aspect, the present application provides a method for detecting a back drilling position, including: Detecting a circuit board with a structure to be backed-drilled to obtain backing-drilling position information of backing-drilling the circuit board, wherein the backing-drilling position information comprises first plane coordinate information of the backing-drilling structure at a target signal layer of the circuit board and depth information required by backing-drilling the structure to be backed-drilled; the first plane coordinate information and the depth information are used for indicating the depth control back drilling, and the back drilling is formed on the circuit board. In an exemplary embodiment, detecting a circuit board with a structure to be backdrilled to obtain backdrilling position information of backdrilling the circuit board, including: And scanning the circuit board by adopting an internal structure detection device to acquire first plane coordinate information and depth information. In an exemplary embodiment, the internal structure detection device comprises a computed tomography device or a computer layered imaging device. In an exemplary embodiment, the scanning the circuit board with the internal structure detecting device to obtain the first plane coordinate information and the depth information includes: Scanning the circuit board by adopting an internal structure detection device to obtain two-dimensional tomographic images of all layers in the circuit board; and determining first plane coordinate information and depth information according to the two-dimensional tomographic image. In one exemplary embodiment, determining first plane coordinate information and depth information from a two-dimensional tomographic image includes: Acquiring first plane coordinate information according to the two-dimensional tomographic image at the target signal layer, and constructing a three-dimensional image of the circuit board according to the two-dimensional tomographic images of all layers inside the circuit board; And acquiring depth information according to the two-dimensional tomographic image and the three-dimensional image, wherein the depth information comprises coordinates of the target signal layer in the depth direction of the circuit board. In an exemplary embodiment, the first plane coordinate information includes a first geometric center of a cross section of the intersection of the structure to be backdrilled and the target signal layer, the first geometric center including a first transverse coordinate and a first longitudinal coordinate; acquiring first plane coordinate information according to a two-dimensional tomographic image at a target signal layer, including: Determining a first geometric center and a second geometric center of a cross section at the intersection of the target structure and the target signal layer on the circuit board according to the two-dimensional tomographic image at the target signal layer; Acquiring a transverse moving distance and a longitudinal moving distance of the visual field range of the internal structure detection device from the second geometric center to the first geometric center in the horizontal direction of the circuit board; determining a first transverse offset distance, a first longitudinal offset distance, a secon