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CN-122028311-A - Manufacturing method of pushback die-formed PCB and PCB

CN122028311ACN 122028311 ACN122028311 ACN 122028311ACN-122028311-A

Abstract

The invention belongs to the technical field of manufacturing of various circuit boards, and discloses a pushback die forming PCB manufacturing method and a PCB. The method comprises the steps of designing the whole imposition into imposition of a plurality of PCB small plates, separating a single PCB small plate from the whole imposition by punching, pushing the PCB small plate back into the whole imposition for the second time, and rapidly and efficiently removing the PCB small plate from the whole imposition by matching with a corresponding pneumatic plate removing device. Wave soldering is performed based on zero clearance between the PCB small plate and the whole imposition, and the solder does not go to the top of the PCB small plate during wave soldering. The invention solves the problems that the efficiency of taking out small PCB boards one by one is low, and the efficiency is affected by adding a board separating forming process to make up.

Inventors

  • ZHAO YOUQIANG
  • QIAN JIANGHUI
  • LIU ZAOLAN
  • ZENG FENG

Assignees

  • 博罗县鸿源华辉电子有限公司

Dates

Publication Date
20260512
Application Date
20260224

Claims (10)

  1. 1. A manufacturing method of pushback die-formed PCB is characterized by comprising the following steps: S1, designing the whole imposition into imposition of a plurality of PCB small plates; S2, during molding, the single PCB small plate is separated from the whole imposition in a punching way for the first time, and the PCB small plate is pushed back into the whole imposition for the second time; s3, during assembly, the PCB small plates are detached from the whole imposition by matching with corresponding pneumatic plate taking devices; s4, wave soldering is carried out based on zero clearance between the PCB small plate and the whole imposition, and solder does not go to the top of the PCB small plate during wave soldering.
  2. 2. The method for manufacturing a pushback die-formed PCB according to claim 1, wherein in step S2, in the first single-piece PCB and the whole imposition are separated by punching, the pushback die punches the PCB and the whole imposition by punching for the first time, but does not fall out, specifically comprising the steps of: S201, the elastic ejection system and the negative pressure adsorption are cooperatively controlled, a stepped buffer gasket is adopted, an elastic element is triggered when a punch descends to a critical position, partial blanking force is counteracted, and the PCB small plate is still embedded into a base material frame after being broken; s202, designing a variable cross-section blanking cutting edge; S203, carrying out blanking state in the process of punching and separating the PCB small plate and the whole imposition by utilizing a critical fracture energy control equation, an adsorption force-gravity balance equation and a blanking clearance optimization model through a dynamic pressure feedback system, embedding a piezoelectric sensor into a pushback die base, monitoring a blanking force-displacement curve in real time, and triggering sudden stop when the blanking force dip rate reaches 10 4 N/S.
  3. 3. The method for manufacturing a pushback die-formed PCB according to claim 2, wherein in step S202, the variable-section blanking edge design includes: the cutting edge of the punch adopts an asymmetric bevel angle and the bevel angle of the working end Non-working end The fracture stress distribution is controlled through the geometric structure, so that the separation surface is in a half-shearing state.
  4. 4. The method for manufacturing a pushback die-formed PCB according to claim 2, wherein in step S203, the critical fracture energy control equation is: In the formula, As the value of the critical fracture energy, The fracture toughness of the PCB material is 0.8-1.2MPa/m; in the form of a poisson's ratio, In order to cut out the starting radius, In order to cut out the termination radius, Is the thickness of the plate.
  5. 5. The method for manufacturing a pushback die-formed PCB according to claim 2, wherein in step S203, the adsorption-gravity balance equation is: In the formula, In order to obtain the value of the adsorption force, For the density of the small plate, the density of the small plate is equal to that of the small plate, In order to make the volume of the small plate, The acceleration of the gravity is that, Is the air damping coefficient of the air, and the air damping coefficient of the air is the air damping coefficient, Is the stamping acceleration.
  6. 6. The method for manufacturing a pushback die-formed PCB according to claim 2, wherein in step S203, the blanking gap optimization model is: In the formula, The optimal unilateral gap is formed by the unit of mm; for the thickness of the plate material, The tensile strength of the PCB is 100-150MPa; is the elastic modulus of the PCB substrate.
  7. 7. The method for manufacturing the pushback die-formed PCB according to claim 1, wherein in the step S2, the PCB small plate is pushed back into the whole imposition for the second time, and the method comprises the steps of pushing the PCB small plate back into the whole imposition for the second time by using the pushback die, having no gap and having a flat surface, and comprising the following specific steps: The method comprises the steps of 1, designing a dynamic pre-deformation die, presetting reverse curvature of 0.1-0.3mm on a pushback die contact surface, generating elastic deformation when a PCB small plate is pressed, and rebounding the plate to an absolute plane after the pressure is released; and 2, integrating a piezoelectric sensor array with the pushback die, monitoring the edge stress distribution of the PCB in real time, dynamically adjusting the pressure of each region through a pressure dynamic distribution model built in a multi-axis pressure feedback system, and automatically decompressing when the local stress is detected to be more than 80% of the yield strength of the plate.
  8. 8. The method for manufacturing a pushback molded PCB of claim 7, wherein in step 1, in the elastic deformation of the PCB panel when pressed, the formula of the elastic compensation is: In the formula, For the depth of the pre-deformation, Is the critical yield stress of the plate material, For the thickness of the plate material, Is the modulus of elasticity of the PCB substrate, Is a deformation correction coefficient.
  9. 9. The method for manufacturing a pushback die-formed PCB according to claim 8, wherein in step 2, the dynamic pressure distribution model is: In the formula, Is a region Is used for the pressure control of the pressure sensor, As a result of the initial pressure, For the bevel angle of the working end, For the sensor to detect the maximum deformation amount, Is a region The sensor detects the amount of deformation and, Is the deformation sensitivity coefficient of unit area.
  10. 10. A PCB board, which is manufactured by the manufacturing method of molding a PCB board using the pushback die set according to any one of claims 1 to 9.

Description

Manufacturing method of pushback die-formed PCB and PCB Technical Field The invention belongs to the technical field of manufacturing of various circuit boards, and particularly relates to a manufacturing method of pushback die-formed PCB and the PCB. Background In the prior art, the PCB has smaller size (length 10-50 mm) and has the processes of working plate cleaning, OSP, die stamping, overhauling, cleaning and packaging. Through the analysis, the problems and defects of the prior art are that when the size of the PCB is small, the single PCB is separated from the imposition, the small plate is cleaned, the OSP surface treatment and the packaging and placing efficiency are low, the single PCB is small in size and low in taking out efficiency one by one when the PCB is assembled, and if the imposition is carried out, the partition forming process is required to be added, and the efficiency is also influenced. Disclosure of Invention In order to overcome the problems in the related art, the embodiment of the invention discloses a manufacturing method of pushback die-formed PCB. In particular to a manufacturing method and a manufacturing method for molding a small-size PCB by using pushback die. The technical scheme is that the manufacturing method of the pushback die-formed PCB comprises the following steps: S1, designing the whole imposition into imposition of a plurality of PCB small plates; S2, during molding, the single PCB small plate is separated from the whole imposition in a punching way for the first time, and the PCB small plate is pushed back into the whole imposition for the second time; s3, during assembly, the PCB small plates are detached from the whole imposition by matching with corresponding pneumatic plate taking devices; s4, wave soldering is carried out based on zero clearance between the PCB small plate and the whole imposition, and solder does not go to the top of the PCB small plate during wave soldering. In the step S2, in the process of separating the first single PCB from the whole imposition, the pushback die punches the PCB from the whole imposition for the first time, but does not fall out, and the specific steps are as follows: S201, the elastic ejection system and the negative pressure adsorption are cooperatively controlled, a stepped buffer gasket is adopted, an elastic element is triggered when a punch descends to a critical position, partial blanking force is counteracted, and the PCB small plate is still embedded into a base material frame after being broken; s202, designing a variable cross-section blanking cutting edge; S203, carrying out blanking state in the process of punching and separating the PCB small plate and the whole imposition by utilizing a critical fracture energy control equation, an adsorption force-gravity balance equation and a blanking clearance optimization model through a dynamic pressure feedback system, embedding a piezoelectric sensor into a pushback die base, monitoring a blanking force-displacement curve in real time, and triggering sudden stop when the blanking force dip rate reaches 10 4 N/S. In step S202, the variable-section blanking edge design includes: the cutting edge of the punch adopts an asymmetric bevel angle and the bevel angle of the working end Non-working endThe fracture stress distribution is controlled through the geometric structure, so that the separation surface is in a half-shearing state. In step S203, the critical fracture energy control equation is: In the formula, As the value of the critical fracture energy,The fracture toughness of the PCB material is 0.8-1.2MPa/m; in the form of a poisson's ratio, In order to cut out the starting radius,In order to cut out the termination radius,Is the thickness of the plate. In step S203, the adsorption force-gravity balance equation is: In the formula, In order to obtain the value of the adsorption force,For the density of the small plate, the density of the small plate is equal to that of the small plate,In order to make the volume of the small plate,The acceleration of the gravity is that,Is the air damping coefficient of the air, and the air damping coefficient of the air is the air damping coefficient,Is the stamping acceleration. In step S203, the blanking interval optimization model is: In the formula, The optimal unilateral gap is formed by the unit of mm; for the thickness of the plate material, The tensile strength of the PCB is 100-150MPa; is the elastic modulus of the PCB substrate. In the step S2, the PCB small plate is pushed back into the whole imposition for the second time, comprising the steps of pushing the PCB small plate back into the whole imposition by using a pushback die for the second time, having no gap and having a flat surface, and specifically comprising the following steps: The method comprises the steps of 1, designing a dynamic pre-deformation die, presetting reverse curvature of 0.1-0.3mm on a pushback die contact surface, generating elastic defo