CN-122028314-A - Method for manufacturing printed wiring board and printed wiring board

Abstract

The invention discloses a manufacturing method of a printed circuit board and the printed circuit board, wherein the manufacturing method of the printed circuit board comprises the steps of printing after special-shaped copper base is matched with a printing screen in a positioning way and obtaining a rough blank; the rough blank after printing is roughened and a roughened surface is formed on the surface, electroplating is carried out on the roughened surface and a seed layer is formed outside the roughened surface, thickening is carried out on the seed layer to form a printed copper surface, and a printed circuit board is obtained after dry film, exposure, development, etching and film removal are carried out on the printed copper surface. In the manufacturing process of the printed circuit board, the special-shaped copper base and the printing screen are suitable for positioning and fixing, so that the printing screen is printed, and the printed circuit board integrated with the special-shaped copper base can be produced. Meanwhile, the special-shaped copper base is integrated on the printed circuit board, so that the printed circuit board can realize finer structural design, and the usability of the printed circuit board is expanded, so that the market competitiveness is improved.

Inventors

• YUE HAN
• WANG JUCAI
• SUN DONGCHENG
• SHEN ZE

Assignees

• 深南电路股份有限公司

Dates

Publication Date

20260512

Application Date

20260302

Claims (10)

1. 1. A method of manufacturing a printed wiring board, comprising: Printing after the special-shaped copper base is matched with the printing screen in a positioning way to obtain a rough blank; coarsening the printed rough blank and forming a coarsened surface on the surface; Electroplating the roughened surface and forming a seed layer outside the roughened surface; Thickening the seed layer to form a printed copper surface; and (3) performing dry film, exposure, development, etching and film removal on the printed copper surface to obtain the printed circuit board.
2. 2. The method of manufacturing a printed wiring board according to claim 1, wherein before printing and obtaining a rough blank after positioning the profiled copper base and the printing screen, further comprising: The special-shaped copper base is provided with a first positioning part, the printing screen is provided with a second positioning part, and the printing screen starts to print after the first positioning part and the second positioning part are matched in a positioning way.
3. 3. The method of manufacturing a printed wiring board according to claim 1, wherein in the step of performing printing after the positioning and matching of the special copper base and the printing screen to obtain a blank, The printing thickness is A, and the thickness A satisfies the relation that A is more than or equal to 8um and less than or equal to 12um.
4. 4. The method of manufacturing a printed wiring board according to claim 1, wherein printing is performed after the profiled copper base is aligned with the printing screen to obtain a rough blank, and roughening is performed on the rough blank after the printing is completed and forming roughened surfaces on the surfaces thereof, further comprising: And cleaning the resin exceeding the printing thickness and forming a flat surface.
5. 5. The method of manufacturing a printed wiring board according to claim 1, wherein before printing and obtaining a rough blank after positioning the profiled copper base and the printing screen, further comprising: and manufacturing a printing screen based on the special-shaped copper base.
6. 6. The method of manufacturing a printed wiring board according to claim 5, further comprising, before said manufacturing a printing screen based on said profiled copper base: Etching and removing the film to obtain the special copper base.
7. 7. The method of manufacturing a printed wiring board according to claim 6, further comprising, before the etching and stripping to obtain the special-shaped copper base: the dry film is pressed and developed by exposure according to design to transfer the pattern to the dry film.
8. 8. The method of manufacturing a printed wiring board according to claim 7, wherein before said pressing the film and performing exposure development according to the design to transfer the pattern onto the dry film, further comprising: electroplating the substrate.
9. 9. The method of manufacturing a printed wiring board according to claim 8, wherein the step of electroplating the substrate further comprises: The electroplating comprises an electroplating layer and a surplus layer, wherein the surplus layer is arranged on the outer side of the electroplating layer, and the surplus layer compensates abrasion in the subsequent process.
10. 10. A printed wiring board, characterized in that the printed wiring board is printed and manufactured by the manufacturing method according to any one of claims 1 to 9.

Description

Method for manufacturing printed wiring board and printed wiring board Technical Field The present invention relates to the technical field, and in particular, to a method for manufacturing a printed circuit board and a printed circuit board. Background In the prior art, printed circuit boards often need to be designed specifically in consideration of customer design requirements during the manufacturing process. In the related art, the precision of the printed circuit board is insufficient, and a design scheme below 1mm cannot be realized, so that the design precision of the printed circuit board cannot meet the requirements of customers, and the market competitiveness is reduced. At the same time, the current customers have certain design requirements on the printed circuit board, so that it is necessary to provide a printed circuit board capable of integrating special copper base. Disclosure of Invention The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, an objective of the present invention is to provide a method for manufacturing a printed circuit board, which can integrate a special copper base into the printed circuit board to enable the printed circuit board to realize finer structural design, and the structural design of the printed circuit board can meet different customer demands to improve market competitiveness. Another object of the present invention is to provide a printed wiring board manufactured by the manufacturing method of the printed wiring board. The manufacturing method of the printed circuit board according to the embodiment of the invention comprises the following steps: Printing after the special-shaped copper base is matched with the printing screen in a positioning way to obtain a rough blank; coarsening the printed rough blank and forming a coarsened surface on the surface; Electroplating the roughened surface and forming a seed layer outside the roughened surface; Thickening the seed layer to form a printed copper surface; and (3) performing dry film, exposure, development, etching and film removal on the printed copper surface to obtain the printed circuit board. According to the manufacturing method of the printed circuit board, in the manufacturing process of the printed circuit board, the special-shaped copper base and the printing screen are suitable for positioning and fixing, so that the printing screen is printed, and the printed circuit board integrated with the special-shaped copper base can be manufactured. Meanwhile, the special-shaped copper base is integrated on the printed circuit board, so that the printed circuit board can realize finer structural design, and the usability of the printed circuit board is expanded, so that the market competitiveness is improved. In some embodiments, printing and obtaining the blank after the profiled copper base is aligned with the printing screen further comprises: The special-shaped copper base is provided with a first positioning part, the printing screen is provided with a second positioning part, and the printing screen starts to print after the first positioning part and the second positioning part are matched in a positioning way. In some embodiments, since the first positioning portion is arranged on the special-shaped copper base, and the second positioning portion is arranged on the printing screen, the first positioning portion can be matched with the second positioning portion, so that the limit matching process between the special-shaped copper base and the printing screen is simpler and more reliable, positioning processing can be performed according to design, the special-shaped copper base can be arranged at a proper position of the printing screen according to design, and the printing screen can be printed according to design in the subsequent printing and using process to produce the printed circuit board meeting the use requirement. In some embodiments, the special-shaped copper base is matched with the printing screen in a positioning way, and is printed and a rough blank is obtained, The printing thickness is A, and the thickness A satisfies the relation that A is more than or equal to 8um and less than or equal to 12um. In some embodiments, to ensure that the rough blank obtained after printing the screen has higher flatness to meet the production requirements in the subsequent process, the subsequent printed wiring board is adapted to provide a wider printing thickness during printing to meet the subsequent process requirements. Meanwhile, the printing thickness is not too thick, the surface of the rough blank is required to be leveled in the subsequent process, redundant printing materials can be cleaned, production materials can be wasted due to the too thick printing thickness, and the production cost is increased. Therefore, the printing thickness can be set between 8um and 12um, so that the printing thickness is suitable to meet the produc