CN-122028315-A - Circuit board and marking point etching compensation method thereof

CN122028315ACN 122028315 ACN122028315 ACN 122028315ACN-122028315-A

Abstract

The application discloses a circuit board and a marking point etching compensation method of the circuit board, wherein the circuit board comprises a substrate, a plurality of holes are formed in the substrate, and a plurality of distinguishing marking points are marked on the substrate; the distinguishing mark points at the edge positions of the holes are provided with a first compensating structure and a second compensating structure. Through the mode, the shape of the marked point on the circuit board is not deformed after the circuit board is etched, so that the rejection rate of the circuit board is reduced.

Inventors

ZHANG MIN
PENG JINQIANG
HAN PENG
WANG YINPENG

Assignees

广州广芯封装基板有限公司

Dates

Publication Date: 20260512
Application Date: 20260325

Claims (10)

1. The circuit board is characterized by comprising a substrate, wherein a plurality of holes are formed in the substrate, and a plurality of distinguishing mark points are marked on the substrate; the distinguishing mark points marked at the edge positions of the holes are provided with a first compensation structure and a second compensation structure.
2. The circuit board of claim 1, wherein the first compensation structure and the second compensation structure do not overlap each other.
3. The circuit board of claim 1, wherein the distinguishing mark points are T-shaped structures.
4. The circuit board of claim 1 or 2, wherein the first compensation structure is a right triangle in cross section, the right triangle has a short right angle side width of 0.8 times the preset width, and the right triangle has a long right angle side length of a first preset length.
5. The circuit board of claim 1 or 2, wherein the second compensation structure has a right triangle cross section, the right triangle short leg width is 1.5 times the preset width, and the right triangle long leg length is a second preset length.
6. The method for compensating the mark point etching of the circuit board is characterized by comprising the following steps of: In response to detecting that a distinguishing mark point of the circuit board is positioned at the edge position of a hole of the circuit board, performing first deviation compensation on the periphery of the distinguishing mark point to form a first compensation structure; performing second deviation compensation on the periphery of the distinguishing mark point based on the first compensation structure to form a second compensation structure; The distinguishing mark points are T-shaped structures and comprise horizontal structures and vertical structures perpendicular to the horizontal structures.
7. The method of claim 6, wherein in response to detecting that the distinguishing mark point of the circuit board is located at an edge position of the hole of the circuit board, performing a first offset compensation on a periphery of the distinguishing mark point, and before the step of forming the first compensation structure, further comprising: and forming a basic compensation layer with a preset width which is 1 time on the outer surface of the distinguishing mark point.
8. The method of claim 6, wherein the step of forming a first compensation structure in response to detecting that the distinguishing mark point of the circuit board is located at an edge position of the hole of the circuit board, performing first offset compensation on a periphery of the distinguishing mark point, comprises: Respectively performing first deviation compensation on two ends of the upper surface edge of the distinguishing mark point horizontal structure to form two first compensation structures; respectively performing first deviation compensation on two ends of the lower surface edge of the distinguishing mark point horizontal structure to form two first compensation structures; and respectively performing first deviation compensation on the left side surface edge and the right side surface edge of the distinguishing mark point vertical structure to form two first compensation structures.
9. The method of claim 8, wherein the first compensation structure has a right triangle cross section, a long right angle side with a first predetermined length, a short right angle side with a width of 0.8 times the predetermined width, and the long right angle side is tightly attached to the surface edge of the distinguishing mark point, and the short right angle side is flush with the end face of the distinguishing mark point.
10. The method of claim 6, wherein the step of forming a second compensation structure by performing a second offset compensation on the periphery of the differentiated mark point based on the first compensation structure comprises: Respectively performing second deviation compensation on the left side surface edge and the right side surface edge of the distinguishing mark point vertical structure to form two second compensation structures; The cross section of the second compensation structure is a right triangle, the length of the long right-angle side is a second preset length, the width of the short right-angle side is 1.5 times of the preset width, the long right-angle side is clung to the left side surface edge and the right side surface of the distinguishing mark point, the short right-angle side is flush with the end face of the perpendicular structure of the distinguishing mark point, and the second compensation structure and the first compensation structure are not overlapped with each other.

Description

Circuit board and marking point etching compensation method thereof Technical Field The application relates to the technical field of circuit board processing and manufacturing, in particular to a circuit board and a marked point etching compensation method of the circuit board. Background With the continuous development of electronic devices in high performance, high density and miniaturization, the requirements on wiring precision and alignment accuracy of integrated circuit package substrates are increasingly increasing. In the process of manufacturing the substrate, marking points are usually arranged on the substrate and used as accurate alignment references for subsequent processes of exposure, drilling, lamination, mounting and the like, and the method can also be used for detection and quality control. T-shaped mark points are widely applied to high-precision packaging substrates because of good symmetry and identification stability. In package substrate manufacturing processes, pattern transfer is typically accomplished by an acidic etching process, in which the copper layer not protected by the photoresist is etched away by an acidic chemical solution. When holes for mechanical fixing or process requirements exist in the etched area, the acidic chemical solution continuously flows away from the inside of the side holes, so that the acidic chemical solution near the holes has good exchange effect and strong activity, and the etching rate of copper surfaces of the hole side areas is obviously higher than that of non-hole side areas far away from the holes, so that mark points near the holes are excessively bitten to generate size reduction and shape distortion (such as rounding of tail ends of T-shaped mark points, missing edges and corners and the like). The reduced size deformation of the mark points can seriously reduce the image recognition precision of the mark points, thereby causing alignment deviation of subsequent procedures and finally causing the reduction of the yield of products and even scrapping. Currently, for the problem of reduced and deformed size of the mark points, uniform replenishment is adopted to lengthen or widen the whole mark points on the package substrate in equal proportion during Computer-aided manufacturing (Computer-Aided Manufacturing, CAM). The problem that the compensation quantity of the mark points at the edge of the hole cannot completely offset the excessive erosion quantity to deform, so that the rejection rate of the product is improved is solved. Disclosure of Invention The application provides a circuit board and a method for compensating the marking point etching of the circuit board, which are used for solving the problem of deformation of the circuit board after the marking point etching and reducing the rejection rate of the circuit board. In order to solve the technical problems, the application provides a circuit board and a marking point etching compensation method of the circuit board, wherein the circuit board comprises a substrate, a plurality of holes are formed in the substrate, and a plurality of distinguishing marking points are marked on the substrate; the distinguishing mark points marked on the edge positions of the holes are provided with a first compensation structure and a second compensation structure. Wherein the first compensation structure and the second compensation structure are not overlapped with each other. Wherein, the distinguishing mark point is of a T-shaped structure. The cross section of the first compensation structure is a right triangle, the width of the short right angle side of the right triangle is 0.8 time of the preset width, and the length of the long right angle side of the right triangle is a first preset length. The cross section of the second compensation structure is a right triangle, the width of the short right angle side of the right triangle is 1.5 times of the preset width, and the length of the long right angle side of the right triangle is a second preset length. In order to solve the technical problems, the application provides a method for compensating the mark point etching of a circuit board, which comprises the steps of responding to the detection that a distinguishing mark point of the circuit board is positioned at the edge position of a hole of the circuit board, performing first deviation compensation on the periphery of the distinguishing mark point to form a first compensation structure, performing second deviation compensation on the periphery of the distinguishing mark point based on the first compensation structure to form a second compensation structure, wherein the distinguishing mark point is in a T-shaped structure and comprises a horizontal structure and a vertical structure perpendicular to the horizontal structure. And before the step of forming the first compensation structure, forming a basic compensation layer with 1 time of preset width on the outer surface of the distinguish