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CN-122028317-A - Design control method and system for local mirror image copper of power supply PCB of 5G base station

CN122028317ACN 122028317 ACN122028317 ACN 122028317ACN-122028317-A

Abstract

The invention relates to the technical field of printed circuit board manufacturing, in particular to a method and a system for controlling the design of local mirror image copper of a 5G base station power supply PCB, comprising the steps of obtaining a PCB original design file of the 5G base station power supply, and identifying a target area needing mirror image copper design according to preset screening conditions; and adopting a carrier plate as a support, attaching pure glue to the carrier plate, and pressing copper foil on the pure glue to form a substrate to be processed for manufacturing mirror image copper layers. According to the invention, the copper thickness at the local position is plated, so that the copper thickness at the local position can be 3 times higher than the copper thickness at the normal position, the high heat dissipation requirement of the local IGBT paster position is well solved, the copper thickness at other fine circuit positions is thin, the manufacture of etching circuits in the process is convenient, the short circuit rejection caused by the capsule and incomplete etching copper residues due to the too thick copper is reduced, and the cost waste caused by the thick copper arrangement is reduced.

Inventors

  • MA LONG

Assignees

  • 深圳中富电路股份有限公司

Dates

Publication Date
20260512
Application Date
20260316

Claims (10)

  1. 1. The design control method for the local mirror image copper of the 5G base station power supply PCB is characterized by comprising the following steps: Acquiring a PCB original design file of a 5G base station power supply, and identifying a target area needing mirror image copper design according to preset screening conditions; preprocessing the target area to obtain local mirror image copper graph data; a carrier plate is used as a support, pure glue is attached to the carrier plate, and copper foil is pressed on the pure glue to form a substrate to be processed for manufacturing mirror image copper layers; According to the local mirror image copper pattern data, a dry film is adhered to the surface of the substrate to be processed, and exposure and development are carried out to expose a copper plating area corresponding to the local mirror image copper pattern data; Performing pattern electroplating on the area to be plated with copper, and electroplating the copper layer to a preset target thickness through a multi-stage current control and pinch point rotation mechanism to form a local mirror image copper layer; Removing a dry film on the substrate to be processed, and performing para-position riveting and high-temperature pressing on the carrier plate with the local mirror image copper layer, the PCB inner core plate and the prepreg to enable the local mirror image copper layer to be embedded into a PCB medium layer to form a multi-layer PCB; and calling a preset drilling and milling groove control strategy matched with the local mirror image copper graph data, and executing jump drilling processing and metallized groove processing on the multilayer PCB through a special drilling belt and a special routing belt.
  2. 2. The method for controlling the design of the 5G base station power PCB partial mirror copper according to claim 1, wherein the preprocessing step includes: inwards retracting the unilateral edge of the target area by a preset process avoidance distance to obtain an inwards-retracted area, wherein the process avoidance distance is set to be 8mil; And detecting the sharp angle width of the contracted area, and if the sharp angle width is smaller than the preset minimum manufacturable width, removing the sharp angle area from the contracted area, wherein the minimum manufacturable width is set to be 20mil.
  3. 3. The method for controlling the design of the local mirror image copper of the 5G base station power supply PCB according to claim 1, further comprising, before attaching the pure glue to the carrier plate: designing typesetting structures of the carrier plate and the pure glue according to the typesetting size of the PCB, and presetting a positioning hole system on the carrier plate and the pure glue; The typesetting structure adopts a double-process-side design and comprises an outer process side for a pressing process and an inner process side for a subsequent process.
  4. 4. The design control method for the local mirror image copper of the 5G base station power supply PCB according to claim 3, wherein the design rule of the positioning hole system is that a positioning hole, a rivet hole, a hanging nail hole and a drilling fool-proof hole are designed in the pure glue area, the minimum distance from the positioning hole to the inner process side is controlled to be more than or equal to 8mm, and the drilling fool-proof hole is controlled to be 2mm away from the board side from four corners of the carrier board, so that the positioning hole is prevented from exceeding the pure glue area.
  5. 5. The method for controlling a 5G base station power PCB partial mirror copper design according to claim 4, wherein the dual process edge design meets the following dimensional control requirements: The width of the outer process edge of the PCB inner core plate is set to be more than or equal to 20mm; the width of the outer process edge of the carrier plate is set to be more than or equal to 30mm; the distance between the attaching region of the pure glue and the inner process edge is controlled to be more than or equal to 3mm, and the calculating formula of the cutting width of the attaching pure glue is as follows: ; Wherein, the In order to attach the cutting width of the pure glue, For the width of the outer process edge of the carrier plate, To locate the minimum distance of the hole to the inner process edge.
  6. 6. The method of claim 1, wherein the multi-stage current control and pinch-point rotation mechanism comprises plating four times with a small current by using a gantry plating line, and reversing the plating pinch-point position of the board edge once at the end of each plating cycle to control plating uniformity to less than 30um.
  7. 7. The method for controlling design of 5G base station power PCB partial mirror copper according to claim 1, wherein in the step of applying the dry film: The dry film adopts a double-sided repeated film pasting mode, the single-layer thickness of the dry film is 1.8mil, and the total number of film pasting layers is 2, so that the total dry film thickness is larger than the preset target thickness of the local mirror image copper layer.
  8. 8. The method for controlling the design of the 5G base station power PCB partial mirror copper according to claim 1, wherein the lamination process includes: Pre-pressing the pure rubber for 10s and pressing the plate for 20s at the temperature of 115 ℃; Performing hot melting riveting, namely fusing the inner core plate and the prepreg, and riveting the carrier plate and the inner core plate; the dielectric layer control requirement of the multilayer PCB is that the thickness of the dielectric layer of the partial mirror image copper layer from the secondary outer layer is more than 0.1mm.
  9. 9. The method for controlling the design of the local mirror image copper of the 5G base station power supply PCB according to claim 1, wherein the step of removing the dry film on the substrate to be processed adopts a multiple film stripping mode: The first film removing adjusts the film removing linear speed to the lowest and closes the drying section; the film is removed for the second time at a normal speed; and the high-pressure water washing section is closed in the film stripping process so as to prevent the copper foil from being damaged due to water flow impact.
  10. 10. A control system for 5G base station power PCB partial mirror copper design, which is adapted to the control method for 5G base station power PCB partial mirror copper design according to any one of claims 1 to 9, comprising: The area identification module is used for acquiring a PCB original design file of the 5G base station power supply and identifying a target area needing mirror image copper design according to preset screening conditions; the image processing module is used for preprocessing the target area to obtain local mirror image copper image data; The substrate preparation module is used for adopting a carrier plate as a support, attaching pure glue to the carrier plate, and laminating copper foil on the pure glue to form a substrate to be processed for manufacturing mirror image copper layers; The pattern transfer module is used for pasting a dry film on the surface of the substrate to be processed according to the local mirror image copper pattern data, and exposing and developing the dry film to expose a copper plating area corresponding to the local mirror image copper pattern data; The electroplating thickening module is used for carrying out pattern electroplating on the area to be plated with copper, and electroplating the copper layer to a preset target thickness through a multi-section current control and pinch point rotation mechanism to form a local mirror image copper layer; The film removing and pressing module is used for removing the dry film on the substrate to be processed, and carrying out para-position riveting and high-temperature pressing on the carrier plate with the local mirror image copper layer, the PCB inner core plate and the prepreg to enable the local mirror image copper layer to be embedded into the PCB medium layer to form a multi-layer PCB; and the drilling and milling processing module is used for calling a preset drilling and milling groove control strategy matched with the local mirror image copper graph data, and performing jump drilling processing and metallization groove processing on the multilayer PCB through a special drilling belt and a special milling belt.

Description

Design control method and system for local mirror image copper of power supply PCB of 5G base station Technical Field The invention relates to the technical field of printed circuit board manufacturing, in particular to a method and a system for controlling design of local mirror image copper of a 5G base station power supply PCB. Background With the commercial popularization of 5G communication technology, base station devices are evolving toward miniaturization, integration, and high power. The power density of the power module as a base station core component is significantly increased, resulting in a drastic increase in the heat flux density in a local area. If the heat cannot be timely led out, the stability and the service life of the operation of the base station are seriously affected. Therefore, how to realize high-current bearing and efficient heat dissipation in a limited PCB space becomes a core technical problem of the design of the 5G base station power supply PCB. In order to solve the problems of heat dissipation and current carrying, the conventional technical scheme generally adopts a design idea of increasing copper thickness by a full board, namely, a super-thick copper foil is directly used for manufacturing a circuit on the surface layer or the inner layer of a PCB, and the high heat conductivity and the high electric conductivity of copper are utilized, so that the heat loss of resistance is reduced and a heat dissipation channel is constructed by increasing the sectional area of the whole copper layer, thereby meeting the requirements of a power module on heat dissipation and current load. However, the conventional full-plate-thickness copper process has significant drawbacks and disadvantages in practical application, because the high heat and high frequency of the power module are concentrated only in the local area where the power device is located, and the full-plate-thickness copper scheme forces the non-critical area to use expensive thick copper materials, so that the raw material cost and weight of the PCB are greatly increased, and because the copper layer is too thick, the side etching effect is serious in the etching process, the circuit etching is not clean, the line width control precision is poor, even short circuit is caused, and the wiring density and the functional integration of the PCB are limited. Disclosure of Invention In order to achieve the purpose, the invention provides the following technical scheme that the design control method for the local mirror image copper of the 5G base station power supply PCB comprises the following steps: Acquiring a PCB original design file of a 5G base station power supply, and identifying a target area needing mirror image copper design according to preset screening conditions; preprocessing the target area to obtain local mirror image copper graph data; a carrier plate is used as a support, pure glue is attached to the carrier plate, and copper foil is pressed on the pure glue to form a substrate to be processed for manufacturing mirror image copper layers; According to the local mirror image copper pattern data, a dry film is adhered to the surface of the substrate to be processed, and exposure and development are carried out to expose a copper plating area corresponding to the local mirror image copper pattern data; Performing pattern electroplating on the area to be plated with copper, and electroplating the copper layer to a preset target thickness through a multi-stage current control and pinch point rotation mechanism to form a local mirror image copper layer; Removing a dry film on the substrate to be processed, and performing para-position riveting and high-temperature pressing on the carrier plate with the local mirror image copper layer, the PCB inner core plate and the prepreg to enable the local mirror image copper layer to be embedded into a PCB medium layer to form a multi-layer PCB; and calling a preset drilling and milling groove control strategy matched with the local mirror image copper graph data, and executing jump drilling processing and metallized groove processing on the multilayer PCB through a special drilling belt and a special routing belt. Preferably, the preprocessing step includes: inwards retracting the unilateral edge of the target area by a preset process avoidance distance to obtain an inwards-retracted area, wherein the process avoidance distance is set to be 8mil; And detecting the sharp angle width of the contracted area, and if the sharp angle width is smaller than the preset minimum manufacturable width, removing the sharp angle area from the contracted area, wherein the minimum manufacturable width is set to be 20mil. Preferably, before the pure glue is attached to the carrier plate, the method further comprises: designing typesetting structures of the carrier plate and the pure glue according to the typesetting size of the PCB, and presetting a positioning hole system on the carrier pl