CN-122028322-A - PCB manufacturing method, PCB processing system and PCB

CN122028322ACN 122028322 ACN122028322 ACN 122028322ACN-122028322-A

Abstract

The application relates to the technical field of printed circuit boards and discloses a manufacturing method of a PCB, a processing system of the PCB and the PCB, wherein the manufacturing method of the PCB comprises the steps of providing a substrate, wherein the substrate comprises a first conductive layer, a second conductive layer and an insulating layer; the method comprises the steps of ablating a first conductive layer and an insulating layer by using a laser to obtain a first opening hole formed in the first conductive layer and a connecting opening hole formed in the insulating layer, enabling an inner hole wall of the connecting opening hole to form a conductive carbon net, arranging a conductive material in the connecting opening hole, doping part of the conductive material into the conductive carbon net to form a conductive network, and electroplating a substrate through the conductive network to obtain an electroplated layer covering the conductive network. The PCB manufacturing method, the PCB processing system and the PCB are used for solving the problems that in the prior art, hole metallization is completed by adopting a wet method combining a black hole process and electroless copper plating, and pollution in the production process is large.

Inventors

LIANG JIAXUAN
MO QIBIAO
LU WENBIN
XIE GUI
SHE RONG

Assignees

深圳市大族数控科技股份有限公司

Dates

Publication Date: 20260512
Application Date: 20260319

Claims (12)

1. A method of manufacturing a PCB, comprising: Providing a substrate, wherein the substrate comprises a first conductive layer and a second conductive layer which are stacked, and an insulating layer positioned between the first conductive layer and the second conductive layer; Ablating the first conductive layer and the insulating layer by using a laser to obtain a first opening formed in the first conductive layer and a connecting opening formed in the insulating layer, and enabling an inner hole wall of the connecting opening to form a conductive carbon net, wherein the first opening is communicated with the connecting opening; Arranging a conductive material in the connecting opening hole, wherein part of the conductive material is doped into the conductive carbon net to form a conductive network, and the first conductive layer and the second conductive layer are connected with the conductive network; And electroplating the substrate through the conductive network to obtain an electroplated layer covering the conductive network.
2. The method of claim 1, wherein a carbon-containing gas is introduced into the first opening hole when the first conductive layer and the insulating layer are ablated by a laser.
3. The method of claim 2, wherein the carbon-containing gas is CH 4 or C 2 H 2 .
4. The method of manufacturing a PCB according to claim 1, wherein an anti-oxidation gas is introduced into the first opening hole when the first conductive layer and the insulating layer are ablated by a laser.
5. The method of manufacturing a PCB according to claim 4, wherein the anti-oxidation gas is an inert gas and/or a reducing reactive gas.
6. The method of claim 1, wherein the laser is a carbon dioxide laser, an ultraviolet laser, a blue laser, a green laser, or a near infrared laser.
7. The method of any one of claims 1 to 6, wherein a conductive material is disposed in the connection opening by means of plasma sputtering or high-energy ion beam.
8. The method according to claim 7, wherein the conductive material is disposed in the connection opening hole by means of plasma sputtering, and the vacuum degree of the vacuum chamber is less than or equal to 5 x 10 -4 Pa, the working gas is Ar and/or N 2 , the working gas pressure is 0.3Pa-2Pa, and the sputtering power is 60W-150W during the plasma sputtering.
9. The method according to claim 7, wherein the conductive material is disposed in the connection opening by means of a high-energy ion beam, wherein the vacuum degree of the vacuum chamber is less than or equal to 1 x 10 -3 Pa, the working air pressure is 0.1Pa to 0.5Pa, the implantation energy is 400eV to 700eV, and the pulse frequency is 100Hz to 300Hz.
10. The method of any one of claims 1 to 6, wherein the conductive material is one or more of gold, copper, iron, silver, nickel, nitrogen, phosphorus, and carbon.
11. A processing system of a PCB, characterized in that the processing system of a PCB is adapted to perform the method of manufacturing a PCB according to any one of claims 1 to 10.
12. A PCB, characterized in that it is manufactured by the method of manufacturing a PCB according to any one of claims 1 to 10.

Description

PCB manufacturing method, PCB processing system and PCB Technical Field The application relates to the technical field of printed circuit boards, in particular to a manufacturing method of a PCB, a processing system of the PCB and the PCB. Background The PCB (Printed Circuit Board ) is used in a wide variety of fields as a carrier for electrically interconnecting important electronic components. In the process of manufacturing the PCB, metallized holes are required to be provided to connect different conductive layers, and the metallization manufacturing process generally includes processing blind holes or through holes first, and then performing hole metallization treatment on the blind holes or through holes. In the related art, hole metallization is generally finished by adopting a wet method combining a black hole process and electroless copper plating, and the pollution in the production process is large. Disclosure of Invention The application provides a manufacturing method of a PCB, a processing system of the PCB and the PCB, which are used for solving the problems that in the prior art, a black hole process and a wet method matched with chemical copper plating are adopted to finish hole metallization and the pollution in the production process is large. In a first aspect, an embodiment of the present application provides a method for manufacturing a PCB, including: Providing a substrate, wherein the substrate comprises a first conductive layer and a second conductive layer which are stacked, and an insulating layer positioned between the first conductive layer and the second conductive layer; Ablating the first conductive layer and the insulating layer by using a laser to obtain a first opening formed in the first conductive layer and a connecting opening formed in the insulating layer, and enabling an inner hole wall of the connecting opening to form a conductive carbon net, wherein the first opening is communicated with the connecting opening; Arranging a conductive material in the connecting opening hole, wherein part of the conductive material is doped into the conductive carbon net to form a conductive network, and the first conductive layer and the second conductive layer are connected with the conductive network; And electroplating the substrate through the conductive network to obtain an electroplated layer covering the conductive network. In some of these embodiments, the carbon-containing gas is introduced into the first opening hole while ablating the first conductive layer and the insulating layer using a laser. In some of these embodiments, the carbon-containing gas is CH 4 or C 2H2. In some embodiments, the first conductive layer and the insulating layer are ablated using a laser, and an anti-oxidation gas is introduced into the first opening. In some of these embodiments, the anti-oxidant gas is an inert gas and/or a reducing reactive gas. In some of these embodiments, the laser is a carbon dioxide laser, an ultraviolet laser, a blue laser, a green laser, or a near infrared laser. In some of these embodiments, the conductive material is disposed within the connected opening by means of plasma sputtering or by means of a high energy ion beam. In some embodiments, the conductive material is disposed in the connection opening hole by means of plasma sputtering, and in the process of plasma sputtering, the vacuum degree of the vacuum chamber is less than or equal to 5×10 -4 Pa, the working gas is Ar and/or N 2, the working gas pressure is 0.3Pa-2Pa, and the sputtering power is 60W-150W. In some embodiments, the conductive material is disposed in the connection opening hole by means of a high-energy ion beam, wherein the vacuum degree of the vacuum chamber is less than or equal to 1×10 -3 Pa, the working air pressure is 0.1Pa-0.5Pa, the implantation energy is 400eV-700eV, and the pulse frequency is 100Hz-300Hz. In some embodiments, the conductive material is one or more of gold, copper, iron, silver, nickel, nitrogen, phosphorus, and carbon. In a second aspect, an embodiment of the present application provides a processing system of a PCB, for performing the method for manufacturing a PCB according to the first aspect. In a third aspect, an embodiment of the present application provides a PCB manufactured by the method for manufacturing a PCB according to the first aspect. The manufacturing method of the PCB has the advantages that the first conducting layer and the insulating layer are ablated by the laser to obtain the first open hole formed in the first conducting layer and the connecting open hole formed in the insulating layer, the inner hole wall of the connecting open hole forms the conducting carbon net, the first open hole is communicated with the connecting open hole, then the conducting material is arranged in the connecting open hole, part of the conducting material is doped into the conducting carbon net to form the conducting network, the first conducting layer and the secon