CN-122028323-A - Circuit board and packaging method thereof

Abstract

The application belongs to the technical field of integrated circuit packaging, and particularly discloses a circuit board and a packaging method thereof, wherein the packaging method of the circuit board comprises the steps of providing a core board, wherein the core board comprises a metal layer and an insulating layer arranged on at least one surface of the metal layer; the power device is embedded in the cavity, and the cavity is filled with a dielectric material to form a filling layer so as to fix the power device. According to the packaging method of the circuit board, the metal layer is used as a carrier instead of the existing organic layer, so that the use of a temporary carrier is avoided while an ultrathin substrate is formed, and further the damage to the substrate material caused by peeling the temporary carrier by adopting mechanical external force is avoided, the operation steps are simplified, the substrate material is protected, and the use cost is reduced.

Inventors

• MAO PAN
• WU FENGWU
• HU KAI

Assignees

• 深南电路股份有限公司

Dates

Publication Date

20260512

Application Date

20260304

Claims (10)

1. 1. A method of packaging a circuit board, comprising: providing a core plate, wherein the core plate comprises a metal layer and an insulating layer arranged on at least one surface of the metal layer; A cavity is formed in the core plate, and penetrates through the metal layer and the insulating layer; embedding a power device in the cavity; And filling the cavity with a dielectric material to form a filling layer so as to fix the power device.
2. 2. The packaging method of claim 1, wherein the providing a core board comprises: Providing a metal layer, and carrying out browning treatment on the metal layer to form a browning film on the surface of the metal layer; And the insulating layers are arranged on two sides of the metal layer, and the insulating layers are combined with the brown oxide film.
3. 3. The packaging method according to claim 1 or 2, wherein the thickness t1 of the insulating layer is less than or equal to 30 μm.
4. 4. The packaging method of claim 2, wherein the cavity comprises a first cavity for embedding the power device and a dicing street, The core plate is provided with a cavity, the cavity penetrates through the metal layer and the insulating layer, and the core plate comprises: determining a first cavity position to be opened on the core plate; according to the position of the first cavity to be opened, first openings are formed in the insulating layers on the two sides of the metal layer; And according to the position of the first opening, a first slot is arranged on the metal layer, and the first slot is communicated with the first opening and forms the first cavity.
5. 5. The method of packaging of claim 4, wherein the first opening is formed by firing away the insulating layer using a laser drill and the first trench is formed by etching the metal layer using an etchant.
6. 6. The method of packaging of claim 4, wherein the core board is provided with a cavity, the cavity penetrating through the metal layer and the insulating layer, further comprising: determining the position of a cutting channel to be opened on the core plate; According to the position of the cutting channel to be opened, a second opening is arranged on the insulating layer on one side of the metal layer; And a second slot is arranged on the metal layer according to the position of the second opening, and the second slot is communicated with the second opening and forms the cutting channel.
7. 7. The method of claim 1, wherein filling the cavity with a dielectric material forms a filler layer, and further comprising bonding the power device to the metal layer with tape prior to securing the power device.
8. 8. The method of packaging according to claim 1, the packaging method is characterized by further comprising the following steps: And carrying out fan-out processing on the power device.
9. 9. A circuit board manufactured by the packaging method according to any one of claims 1 to 8, wherein the circuit board comprises a core board, the core board comprises a metal layer and an insulating layer arranged on at least one surface of the metal layer, a cavity is arranged on the core board, the cavity penetrates through the metal layer and the insulating layer, and a power device is embedded in the cavity.
10. 10. The circuit board of claim 9, wherein the core board is provided with a filler layer filled in the cavity to secure the power device.

Description

Circuit board and packaging method thereof Technical Field The application relates to the technical field of integrated circuit packaging, in particular to a circuit board and a packaging method thereof. Background With the rapid development of AI, 5G, electric vehicles and portable mobile devices, miniaturized, light and thin package technologies with high integration are becoming the main development direction. In the conventional form, it has been difficult for the ECP (embedded chip package) technology to meet the application requirements, and further reduction in thickness of the package body is required. In the related art, an ETS process is generally used to reduce the thickness of the package. The ETS process is a coreless package substrate process, in which a dielectric layer and a circuit layer are manufactured layer by layer on a temporary carrier by a lamination method, and after all the circuit layers are manufactured, the temporary carrier is peeled off, so that an ultrathin substrate is formed. However, the temporary carrier needs to be separated by a board separator, and the temporary carrier is easy to pull materials to damage the structure during separation, so that the yield is reduced, and meanwhile, the temporary carrier is a disposable consumption material, so that the use cost is high. For this reason, there is a need in the art for a circuit board and a packaging method thereof to solve the above-mentioned problems. Disclosure of Invention The present application aims to solve at least one of the technical problems in the related art to some extent. Therefore, the embodiment of the application provides the circuit board and the packaging method thereof, wherein the metal layer is used for replacing the existing organic layer and is used as the carrier, so that the use of a temporary carrier is avoided while the ultrathin substrate is formed, and further the damage to the substrate material caused by peeling the temporary carrier by adopting mechanical external force is avoided, the operation steps are simplified, the substrate material is protected, and the use cost is reduced. The packaging method of the circuit board provided by the embodiment of the application comprises the following steps: providing a core plate, wherein the core plate comprises a metal layer and an insulating layer arranged on at least one surface of the metal layer; A cavity is formed in the core plate, and penetrates through the metal layer and the insulating layer; embedding a power device in the cavity; And filling the cavity with a dielectric material to form a filling layer so as to fix the power device. In some embodiments, the providing a core plate includes: Providing a metal layer, and carrying out browning treatment on the metal layer to form a browning film on the surface of the metal layer; And the insulating layers are arranged on two sides of the metal layer, and the insulating layers are combined with the brown oxide film. In some embodiments, the insulating layer has a thickness t 1. Ltoreq.30 μm. In some embodiments, the cavity includes a first cavity for embedding a power device, The core plate is provided with a cavity, the cavity penetrates through the metal layer and the insulating layer, and the core plate comprises: determining a first cavity position to be opened on the core plate; according to the position of the first cavity to be opened, first openings are formed in the insulating layers on the two sides of the metal layer; And according to the position of the first opening, a first slot is arranged on the metal layer, and the first slot is communicated with the first opening and forms the first cavity. In some embodiments, the first opening is formed by firing away the insulating layer using a laser drill and the first trench is formed by etching the metal layer using an etching solution. In some embodiments, the core plate is provided with a cavity, the cavity penetrates through the metal layer and the insulating layer, and the method further comprises: determining the position of a cutting channel to be opened on the core plate; According to the position of the cutting channel to be opened, a second opening is arranged on the insulating layer on one side of the metal layer; And a second slot is arranged on the metal layer according to the position of the second opening, and the second slot is communicated with the second opening and forms the cutting channel. In some embodiments, before filling the cavity with a dielectric material to form a filling layer to fix the power device, the method further comprises bonding the power device with the metal layer with an adhesive tape. In some embodiments, the packaging method further comprises: And carrying out fan-out processing on the power device. The circuit board provided by the embodiment of the application is manufactured by the packaging method in any embodiment, and comprises a core board, wherein the core board comprises a metal