CN-122028324-A - Quick arranging method for PCB support pins of chip mounter

CN122028324ACN 122028324 ACN122028324 ACN 122028324ACN-122028324-A

Abstract

The invention discloses a quick placement method for PCB support pins of a chip mounter, which comprises the steps of providing a standardized off-line support pin placement platform and an on-line support pin placement platform with consistent coordinate systems, wherein the support surfaces of the off-line support pin placement platform and the on-line support pin placement platform are respectively provided with mounting holes in matrix arrangement and corresponding coordinate identifications, establishing and recording respective support pin placement coordinates for different types of PCBs on the on-line outer platform to form a coordinate database associated with PCB type numbers, calling the corresponding coordinates according to the PCB type numbers to be mounted, placing the support pins on the on-line platform according to the coordinates, and reproducing the placement of the support pins. The invention realizes the conversion of the arrangement of the supporting pins from relying on manual experience to standardization and data, greatly shortens the line changing time, improves the positioning precision and consistency, effectively avoids the interference of the supporting pins and elements, and remarkably improves the efficiency and the operation reliability of the SMT production line.

Inventors

LU SHAN
LIN LI
Lin Bingshuang
Lin Bingshu
GUO YANG

Assignees

冠捷电子科技(福建)有限公司

Dates

Publication Date: 20260512
Application Date: 20260213

Claims (5)

1. The quick arranging method for the PCB supporting pins of the chip mounter is characterized by comprising the following steps of: The method comprises the steps of S1, providing a standardized off-line support pin arrangement platform and at least one on-line support pin arrangement platform, wherein mounting holes which are arranged in a matrix form are formed in the support surfaces of the off-line support pin arrangement platform and the on-line support pin arrangement platform, and coordinate identifications which are in one-to-one correspondence with the mounting holes are formed in the support surfaces of the off-line support pin arrangement platform and the on-line support pin arrangement platform; S2, establishing and recording respective support pin arrangement coordinates for different types of PCB boards on an online outer support pin arrangement platform to form a support pin arrangement coordinate database associated with the PCB board type number; s3, according to the type of the PCB to be mounted, corresponding support pin arrangement coordinates are called from a support pin arrangement coordinate database; And S4, arranging supporting pins on the online supporting pin arranging platform according to the adjusted supporting pin arranging coordinates so as to reproduce the supporting pin arrangement of the PCB with the model.
2. The method of claim 1, wherein in step S2, the placement coordinates of the support pins are determined based on the component-free areas corresponding to the back surface of the PCB.
3. The method for rapidly arranging PCB support pins of a chip mounter according to claim 1, wherein in step S2, information of the arrangement coordinates of the support pins is input into an MES system to form a database of the arrangement coordinates of the support pins associated with the PCB type number.
4. The method for rapidly arranging PCB support pins of a chip mounter according to claim 3, wherein in step S3, corresponding support pin arrangement coordinates are automatically retrieved from a support pin arrangement coordinate database through an MES system.
5. The method for rapidly arranging the PCB supporting pins of the chip mounter according to claim 1, wherein the supporting pin arrangement coordinates established in the step S2 can be applied to rapid arrangement multiplexing of the PCB boards of the same model in different online supporting pin arrangement platforms or different production batches.

Description

Quick arranging method for PCB support pins of chip mounter Technical Field The invention relates to the technical field of chip mounters, in particular to a quick arrangement method for PCB support pins of a chip mounter. Background In an SMT (surface mount technology) production line, before component mounting is performed, a chip mounter needs to arrange supporting pins below a PCB (printed circuit board) to support the PCB and inhibit deformation of a board, so as to ensure mounting accuracy. The loose CM series chip mounter adopts a thickness detection mechanism, and has particularly strict requirements on the flatness of the PCB. If the PCB is deformed due to improper arrangement of the supporting pins, quality anomalies such as mounting offset and missing parts are very easy to cause. At present, the arrangement of PCB supporting pins of a CM series chip mounter in industry mainly depends on the following two traditional manual modes: The positioning type manual arrangement comprises the steps that an operator firstly places a PCB on a conveying track, visually observes an area without elements of the board surface, preliminarily determines the placement position of a supporting pin, then places the PCB on the preliminarily arranged supporting pin, and repeatedly confirms whether the top of the supporting pin is in contact with the elements on the back of the PCB or not in a manual touch mode. The method is highly dependent on experience and hand feeling of operators, and has low efficiency and human error. The template marking arrangement comprises the steps of covering a transparent acrylic plate on a PCB, marking arrangement points of supporting pins on the acrylic plate corresponding to the PCB non-element area by using a marking pen by an operator, placing the marked acrylic plate above a conveying track of a chip mounter as a template, and then installing the supporting pins one by one according to the marking points. Although the method is more visual than the former method, the procedure of manufacturing the template is increased, the template mark is easy to wear after being used for many times, and the problem of the decline of the positioning precision along with time is also caused. The prior art has the following significant defects: 1. The arrangement efficiency is low, and the line changing time is long. Whether manually placed with repeated heuristics or creating and collating templates, it takes a significant amount of time. Particularly in a production environment where product switching is frequent, the arrangement of the support pins becomes a bottleneck limiting the overall line changing efficiency. 2. The arrangement accuracy and consistency are difficult to ensure. Because the manual observation and operation are completely relied on, different people or the same person can have different arrangement results in different time periods, and standardization is difficult to realize, so that the stability of the mounting quality is affected. 3. Equipment and quality risks are easily induced. In production, the components above the lower board area of the PCB tend to be dense, and the safety area available for placement of the support pins is limited. The traditional method is extremely easy to cause judgment errors on the complex board type, and the supporting pins are propped against the elements on the back of the PCB, so that equipment faults such as a collision piece, a collision head and the like are caused, and the products are directly damaged. Therefore, a fast, precise, standardized and reusable arrangement method of PCB supporting pins is needed in the industry to overcome the defects of the prior art and improve the line replacement efficiency, mounting accuracy and operation reliability of the SMT production line. Disclosure of Invention The invention aims to provide a quick arrangement method for PCB support pins of a chip mounter. The technical scheme adopted by the invention is as follows: the quick arranging method of the PCB supporting pins of the chip mounter comprises the following steps: The method comprises the steps of S1, providing a standardized off-line support pin arrangement platform and at least one on-line support pin arrangement platform, wherein mounting holes which are arranged in a matrix form are formed in the support surfaces of the off-line support pin arrangement platform and the on-line support pin arrangement platform, and coordinate identifications which are in one-to-one correspondence with the mounting holes are formed in the support surfaces of the off-line support pin arrangement platform and the on-line support pin arrangement platform; S2, establishing and recording respective support pin arrangement coordinates for different types of PCB boards on an online outer support pin arrangement platform to form a support pin arrangement coordinate database associated with the PCB board type number; s3, according to the type of the PCB to be mou