CN-122028329-A - Circuit board thickness compensation method, circuit board SIP plastic packaging method and solder mask

CN122028329ACN 122028329 ACN122028329 ACN 122028329ACN-122028329-A

Abstract

The invention discloses a circuit board thickness compensation method, a circuit board SIP plastic packaging method and a solder mask plate. The circuit board thickness compensation method comprises the following steps of obtaining a laminated board, obtaining thickness data of an outer edge area and thickness data of a central area of the laminated board, obtaining thickness compensation data according to the edge thickness data of the laminated board and the thickness data of the central area of the laminated board, setting a thickness compensation solder mask layer on the outer edge area of the laminated board according to the thickness compensation data, and setting a finished solder mask layer on the surface of the laminated board to obtain the solder mask board. The thickness compensation method of the circuit board can avoid the problem of uneven thickness of the circuit board.

Inventors

YUE HAN
HAN XUECHUAN
DONG JIN
WANG JUCAI

Assignees

深南电路股份有限公司

Dates

Publication Date: 20260512
Application Date: 20260106

Claims (13)

1. A method of compensating for board thickness of a circuit board, comprising the operations of: Obtaining a laminated panel having an outer edge region and a central region; acquiring thickness data of an outer edge region of the laminated plate and thickness data of a central region of the laminated plate; Obtaining thickness compensation data according to the data of the edge thickness of the laminated plate and the thickness data of the central area of the laminated plate; Setting a thickness compensation solder mask layer at an outer edge region of the laminated plate according to the thickness compensation data; And arranging a finished solder mask layer on the surface of the laminated plate to obtain the solder mask plate.
2. The circuit board thickness compensation method according to claim 1, wherein the laminated board includes a plurality of circuit board sub-areas arranged in an array; an inner edge area for pressing the SIP plastic package mold is formed between two adjacent circuit board sub-areas in the central area; The outer edge area is formed by surrounding the outer edges of the circuit board sub-areas positioned at the edges, and is used for pressing the SIP plastic package die.
3. The circuit board thickness compensation method according to claim 2, wherein acquiring thickness data of an outer edge region of the laminated board comprises the operations of: Setting a plurality of edge thickness detection points in the outer edge area; acquiring thickness values of a plurality of edge thickness detection points; and taking the average value of the thickness values of a plurality of edge thickness detection points to obtain the thickness data of the outer edge area of the laminated plate.
4. A circuit board thickness compensation method according to claim 3, wherein acquiring thickness data of a central region of the laminated board comprises the operations of: Setting a plurality of center thickness detection points in the center region, wherein the plurality of center thickness detection points are positioned in the inner edge region; acquiring thickness values of a plurality of center thickness detection points; and taking the average value of the thickness values of a plurality of the central thickness detection points to obtain the thickness data of the central area of the laminated plate.
5. The circuit board thickness compensation method according to claim 1, wherein deriving thickness compensation data from the data of the edge thickness of the laminated board and the thickness data of the central area of the laminated board comprises the operations of: and carrying out difference on the data of the edge thickness of the laminated plate and the thickness data of the central area of the laminated plate to obtain the thickness compensation data.
6. The circuit board thickness compensation method according to claim 1, wherein the outer edge region includes a first outer edge region and a second outer edge region, the first outer edge region and the second outer edge region being provided on both sides in a thickness direction of the laminated substrate, respectively; The thickness compensation data comprises first thickness compensation data and second thickness compensation data, and the sum value of the first thickness compensation data and the second thickness compensation data is the thickness compensation data; providing a thickness-compensating solder resist layer on an outer edge region of the laminated board according to the thickness-compensating data includes the operations of: a first thickness compensation solder mask layer is arranged in the first outer edge area according to the first thickness compensation data, and the thickness of the first thickness compensation solder mask layer is equal to the first thickness compensation data; And setting a second thickness compensation solder mask layer in the second outer edge area according to the second thickness compensation data, wherein the thickness of the second thickness compensation solder mask layer is equal to the second thickness compensation data.
7. The circuit board thickness compensation method according to claim 6, wherein a first clearance is provided between the thickness compensation solder resist layer of the first outer edge region and an outer edge of the first outer edge region when the first thickness compensation solder resist layer is provided; And when the thickness compensation solder mask layer is arranged in the second outer edge area, a second clearance area is arranged between the second thickness compensation solder mask layer and the outer edge of the second outer edge area.
8. The circuit board thickness compensation method according to claim 7, wherein providing the first clearance area and the first clearance area comprises: Providing a solder resist ink in both the first outer edge region and the second outer edge region; Sequentially carrying out an exposure process and a development process on the solder resist ink rib of the first outer edge area, and obtaining the first thickness compensation solder resist layer and the first clearance area in the first outer edge area; Sequentially carrying out an exposure process and a development process on the solder resist ink ribs of the second outer edge area, and obtaining the second thickness compensation solder resist layer and the second clearance area in the second outer edge area; And drying the laminated plate.
9. The circuit board thickness compensation method according to claim 1, wherein providing a finished solder resist layer on the surface of the laminated board comprises the operations of: Arranging solder resist ink on two side surfaces of the laminated plate in the thickness direction; Sequentially exposing and developing the solder resist ink on the two sides of the laminated plate in the thickness direction; and drying the laminated plate to obtain the solder mask plate.
10. The method of compensating for circuit board thickness according to claim 2, further comprising, after obtaining the solder mask member, the operations of: And cutting the plurality of circuit board sub-areas of the solder mask plate along the inner edge area to obtain a plurality of independent sub-circuit boards, wherein at least part of edges of the sub-circuit boards are from the inner edge area and the outer edge area.
11. The SIP plastic packaging method for the circuit board is characterized by comprising the following operations: obtaining a solder mask plate by adopting the circuit board thickness compensation method as claimed in any one of claims 1 to 10; Cutting the solder mask plate to obtain a sub-circuit board; And performing SIP plastic package on the sub-circuit board.
12. The method of SIP molding a circuit board according to claim 11, wherein the sub-circuit board is SIP molded as follows: And (3) pressing and sealing the edges of the sub-circuit boards by using the SIP plastic packaging mold, injecting packaging glue between the SIP plastic packaging mold and the surfaces of the sub-circuit boards, and curing to form a packaging layer on the surfaces of the sub-circuit boards.
13. The solder mask plate is characterized by comprising a laminated plate, wherein a finished solder mask layer is arranged on two side surfaces of the laminated plate in the thickness direction, the laminated plate is provided with an outer edge area and a central area, the outer edge area is provided with a thickness compensation solder mask layer, and the thickness compensation solder mask layer is positioned between the finished solder mask layer and the laminated plate.

Description

Circuit board thickness compensation method, circuit board SIP plastic packaging method and solder mask Technical Field The invention relates to the technical field of circuit board processing, in particular to a circuit board thickness compensation method, a circuit board SIP plastic packaging method and a solder mask plate. Background The co-fabrication of PCBs (printed circuit boards) and SIP (system in package) is a key to the development of miniaturization and high density of electronic devices. In the processing of the multilayer PCB, the lamination process is a core link, PP (prepreg) resin is required to be melted by heating and pressurizing, and a lamination gap is filled to form a plate with uniform thickness, so that a foundation is laid for subsequent SIP plastic packaging. However, in actual production, the size of the PCB is often smaller than that of the laminate platform, and even if the laminate platform is filled with filler, gaps remain between the platform and the edge of the PCB. When in lamination, PP flows and overflows to the edge gap with lower pressure after being heated and melted, so that the resin amount of the outer edge area of the PCB is insufficient, the thickness of the cured PCB is obviously smaller than that of the central area, and the thickness difference of 'edge thin and center thick' is formed. The difference can directly influence the subsequent SIP plastic package, namely, the mold is designed according to the standard thickness of the PCB, the mold is not tightly attached to the PCB (namely, the mold is not tightly pressed), plastic packaging liquid is easy to overflow along a gap (namely, glue overflow) during injection, finally, the material waste and the pollution to components are caused, the yield of the SIP product is severely restricted, and the process becomes a key pain point. Therefore, the circuit board in the related art has the problems of uneven thickness and adverse effect on the subsequent SIP plastic package. Disclosure of Invention In order to solve the problems that the circuit board in the related art has uneven thickness and is unfavorable for subsequent SIP plastic packaging, the invention provides a circuit board thickness compensation method. The thickness compensation method of the circuit board comprises the following operations: Obtaining a laminated panel having an outer edge region and a central region; acquiring thickness data of an outer edge region of the laminated plate and thickness data of a central region of the laminated plate; Obtaining thickness compensation data according to the data of the edge thickness of the laminated plate and the thickness data of the central area of the laminated plate; Setting a thickness compensation solder mask layer at an outer edge region of the laminated plate according to the thickness compensation data; And arranging a finished solder mask layer on the surface of the laminated plate to obtain the solder mask plate. As described above, the problem of glue overflow in the lamination process of the outer edge region of the laminated plate in the related art also causes that the thickness of the outer edge region of the laminated plate is thinner than that of the central region, and therefore, the thickness compensation method of the circuit board in the embodiment of the invention can compensate the thickness of the outer edge region of the laminated plate by arranging the thickness compensation solder mask layer in the outer edge region of the laminated plate, so that the thickness rib of the outer edge region of the laminated plate is consistent with that of the central region, the thickness uniformity of the thickness of the subsequent circuit board is greatly improved, and in the subsequent SIP plastic packaging process, the SIP plastic packaging mold and the circuit board can be fully pressed together without pores, and the problem of glue overflow in the SIP plastic packaging process can be avoided. Meanwhile, the thickness of the outer edge area and the thickness of the central area can be detected before the thickness compensation solder mask layer is arranged on the outer edge area of the laminated plate, the thickness of the thickness compensation solder mask layer can be arranged according to the thickness of the outer edge area and the thickness of the central area, the accuracy of the thickness compensation solder mask layer can be further improved, and the uniformity of the thickness of the circuit board can also be further improved. Therefore, the thickness compensation method of the circuit board can avoid the problem of uneven thickness of the circuit board. In some embodiments, the laminate panel includes a plurality of circuit board sub-areas arranged in an array; an inner edge area for pressing the SIP plastic package mold is formed between two adjacent circuit board sub-areas in the central area; The outer edge area is formed by surrounding the outer edges of the circuit boar