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CN-122028352-A - Heat dissipation system, heat dissipation control method and electronic equipment

CN122028352ACN 122028352 ACN122028352 ACN 122028352ACN-122028352-A

Abstract

The application discloses a heat dissipation system, a heat dissipation control method and electronic equipment, and relates to the field of heat dissipation. The heat dissipation system comprises a first heat dissipation assembly, a second heat dissipation assembly and a control assembly, wherein the first heat dissipation assembly comprises a first flow passage and a first pump, the first flow passage is used for accommodating a first heat dissipation medium, the first pump is arranged on the first flow passage, the second heat dissipation assembly comprises a second flow passage, a second pump and an expansion valve, the second flow passage is used for accommodating a second heat dissipation medium, the second pump and the expansion valve are respectively arranged on the second flow passage, and the control assembly is respectively and electrically connected with the first heat dissipation assembly and the second heat dissipation assembly and is used for controlling the operation condition of at least one of the first heat dissipation assembly and the second heat dissipation assembly. The application can solve the problems of limited heat dissipation effect, single heat dissipation mode and the like of the current heat dissipation mode.

Inventors

  • JIANG QUAN

Assignees

  • 中兴通讯股份有限公司

Dates

Publication Date
20260512
Application Date
20241112

Claims (12)

  1. 1. A heat dissipation system, characterized by comprising a first heat dissipation assembly (10), a second heat dissipation assembly (20) and a control assembly (30); The first heat dissipation assembly (10) comprises a first flow passage (11) for accommodating a first heat dissipation medium and a first pump (12), and the first pump (12) is arranged in the first flow passage (11); The second heat dissipation assembly (20) comprises a second flow passage (21) for accommodating a second heat dissipation medium, a second pump (22) and an expansion valve (23), wherein the second pump (22) and the expansion valve (23) are respectively arranged on the second flow passage (21); The control assembly (30) is electrically connected with the first heat dissipation assembly (10) and the second heat dissipation assembly (20) respectively, and is used for controlling the operation condition of at least one of the first heat dissipation assembly (10) and the second heat dissipation assembly (20).
  2. 2. The heat dissipation system according to claim 1, wherein the heat dissipation system (01) further comprises a heat dissipation fan (70), the heat dissipation fan (70) is disposed corresponding to a local area of each of the first flow channel (11) and the second flow channel (21), and the heat dissipation fan (70) is electrically connected to the control assembly (30).
  3. 3. The heat dissipation system according to claim 2, characterized in that the heat dissipation system (01) is applied to an electronic device; The control component (30) is used for controlling the operation condition of at least one of the first pump (12), the second pump (22) and the cooling fan (70) according to the operation mode of the electronic equipment.
  4. 4. A heat dissipation system according to claim 3, wherein the control assembly (30) is adapted to control the operation of the first pump (12) in case the electronic device is in a first mode of operation; And/or the number of the groups of groups, The control assembly (30) controls the first pump (12) and the cooling fan (70) to operate respectively when the electronic equipment is in a second operation mode; And/or the number of the groups of groups, The control assembly (30) controls the second pump (22) and the radiator fan (70) to operate respectively when the electronic device is in a third operation mode or a fourth operation mode.
  5. 5. The heat dissipation system according to claim 2, characterized in that the heat dissipation system (01) is applied to an electronic device; The control component (30) is used for controlling the operation condition of at least one of the first pump (12), the second pump (22) and the cooling fan (70) according to the temperature of the electronic equipment.
  6. 6. The heat dissipation system according to claim 5, wherein the control assembly (30) is configured to control the first pump (12) to operate if the temperature of the electronic device is greater than a first temperature threshold and less than or equal to a second temperature threshold; And/or the number of the groups of groups, The control component (30) controls the first pump (12) and the cooling fan (70) to respectively operate when the temperature of the electronic equipment is greater than the second temperature threshold value and less than or equal to a third temperature threshold value; And/or the number of the groups of groups, The control assembly (30) controls the second pump (22) and the radiator fan (70) to operate respectively when the temperature of the electronic device is greater than the third temperature threshold.
  7. 7. The heat dissipation system according to claim 2, wherein the heat dissipation system (01) further comprises a housing (50), and at least portions of the first flow channel (11) and the second flow channel (21) are respectively disposed through the interior of the housing (50); The wall surface of the shell (50) is provided with a heat dissipation gel layer (60), and the heat dissipation fan (70) is connected with the heat dissipation gel layer (60).
  8. 8. The heat radiation system according to claim 1, wherein the expansion valve (23) includes a first pipe (231), a second pipe (232), and a third pipe (233) that are sequentially communicated, the first pipe (231) and the third pipe (233) being respectively communicated with the second flow passage (21); the inner diameter of the first pipe (231) and the inner diameter of the third pipe (233) are both larger than the inner diameter of the second pipe (232).
  9. 9. A heat dissipation control method, characterized by being applied to the heat dissipation system (01) according to any one of claims 2 to 7, the heat dissipation system (01) being applied to an electronic device; the heat dissipation control method comprises the following steps: controlling the operation of at least one of the first pump (12), the second pump (22) and the cooling fan (70) according to a charging mode or a discharging mode of the electronic device; And/or the number of the groups of groups, And controlling the operation condition of at least one of the first pump (12), the second pump (22) and the cooling fan (70) according to the temperature of at least one heating area of the electronic equipment.
  10. 10. An electronic device characterized by comprising a device body (02) and the heat dissipation system (01) according to any one of claims 1 to 8; the equipment main body (02) is provided with at least one heating area; at least partial areas of the first heat dissipation component (10) and the second heat dissipation component (20) of the heat dissipation system (01) are arranged corresponding to the at least one heating area.
  11. 11. The electronic device of claim 10, wherein the at least one heat-generating region comprises a motherboard heat source region (021) and a battery heat source region (022); at least a partial region of the first flow channel (11) passes through the main plate heat source region (021) and the battery heat source region (022), respectively; At least a partial region of the second flow passage (21) passes through the main plate heat source region (021) and the battery heat source region (022), respectively.
  12. 12. An electronic device is characterized by comprising a memory and a processor; the memory is used for storing a computer program; The processor is used for executing a computer program; wherein the computer program when executed by the processor implements the heat dissipation control method of claim 9.

Description

Heat dissipation system, heat dissipation control method and electronic equipment Technical Field The application belongs to the technical field of equipment heat dissipation, and particularly relates to a heat dissipation system, a heat dissipation control method and electronic equipment. Background Some electronic devices (such as mobile phones and tablet personal computers) in the related art mainly adopt modes of fan heat dissipation, heat dissipation plate heat dissipation and the like, and the modes are limited by factors such as stacking space and the like, so that the heat dissipation effect of the modes is limited, and the heat dissipation mode is single and cannot be better suitable for various working modes of the electronic devices. Disclosure of Invention The embodiment of the application aims to provide a heat dissipation system, a heat dissipation control method and electronic equipment, which can at least solve the problems of limited heat dissipation effect, single heat dissipation mode and the like of the current heat dissipation mode. In order to solve the technical problems, the embodiment of the application is realized as follows: The embodiment of the application provides a heat dissipation system, which comprises a first heat dissipation component, a second heat dissipation component and a control component; the first heat dissipation assembly comprises a first flow passage for accommodating a first heat dissipation medium and a first pump, and the first pump is arranged on the first flow passage; The second heat dissipation component comprises a second flow passage for accommodating a second heat dissipation medium, a second pump and an expansion valve, wherein the second pump and the expansion valve are respectively arranged in the second flow passage; the control assembly is electrically connected with the first heat dissipation assembly and the second heat dissipation assembly respectively and is used for controlling the operation condition of at least one of the first heat dissipation assembly and the second heat dissipation assembly. The embodiment of the application also provides a heat dissipation control method which is applied to the heat dissipation system, and the heat dissipation system is applied to the electronic equipment; the heat dissipation control method comprises the following steps: Controlling the running condition of at least one of the first pump, the second pump and the cooling fan according to the charging mode or the discharging mode of the electronic equipment; And/or the number of the groups of groups, And controlling the operation condition of at least one of the first pump, the second pump and the cooling fan according to the temperature of at least one heating area of the electronic equipment. The embodiment of the application also provides electronic equipment, which comprises an equipment main body and the heat dissipation system; the equipment main body is provided with at least one heating area; At least partial areas of the first heat dissipation component and the second heat dissipation component of the heat dissipation system are arranged corresponding to the at least one heating area. The embodiment of the application also provides electronic equipment, which comprises a memory and a processor; the memory is used for storing a computer program; The processor is used for executing a computer program; the computer program realizes the heat dissipation control method when being executed by the processor. In the embodiment of the application, under the driving action of the first pump, the first heat dissipation medium can flow in the first flow channel, under the driving action of the second pump, the second heat dissipation medium can flow in the second flow channel, and meanwhile, the second heat dissipation medium in the second flow channel can also pass through the pressurizing action of the expansion valve, in addition, the first heat dissipation component and the second heat dissipation component can be controlled by the control component, so that the operation condition of at least one of the first pump and the second pump can be controlled under the control action of the control component, the flow rate of the first heat dissipation medium in the first flow channel and/or the flow rate of the second heat dissipation medium in the second flow channel can be regulated, and the regulation of the absorption heat can be realized through the regulation of the flow rate, so that the purpose of controlling the heat dissipation efficiency is achieved. Therefore, when the heat dissipation system is applied to the electronic equipment, the heat dissipation mode of the heat dissipation system can be controlled according to different modes of the electronic equipment, so that the combination of the power consumption of the electronic equipment and the optimal heat dissipation performance is realized, the service life of the electronic equipment is prol