CN-122028353-A - Cooling plate heat dissipation device

Abstract

The application discloses a cold plate heat dissipation device which comprises a temperature equalization plate, a cooling cavity, a flow inlet, a flow outlet and a jet flow module. The temperature equalization plate comprises a top and a bottom which are opposite to each other in a first direction. The bottom is thermally coupled to the heat-generating source and the top is thermally coupled to the plurality of heat-dissipating fins. The cooling chamber is arranged at the top of the temperature equalizing plate. The plurality of heat dissipation fins are accommodated in the cooling cavity. The inlet and the outlet are respectively communicated with the cooling cavity. The cooling liquid enters the cooling cavity from the inflow port, exchanges heat with the plurality of cooling fins and is discharged through the outflow port. The jet flow module comprises a through hole which is arranged between the inflow opening and the cooling cavity. The through openings comprise opening total areas smaller than the opening total area of the inflow opening. When the cooling liquid flows through the through holes, impact flow is generated to face the plurality of radiating fins so as to radiate the temperature equalizing plate.

Inventors

• CAI MINGKUN
• CHEN YINGYUAN
• JIAN SHIKAI
• LI MINGZONG

Assignees

• 台达电子工业股份有限公司

Dates

Publication Date

20260512

Application Date

20250226

Priority Date

20241111

Claims (20)

1. 1. A cold plate heat sink, comprising: a temperature equalizing plate comprising a top and a bottom, wherein the top and the bottom are opposite to each other in a first direction, the bottom is thermally coupled to a heat source, and the top is thermally coupled to a plurality of heat dissipating fins; The cooling cavity is arranged at the top of the temperature equalizing plate, and the plurality of radiating fins are accommodated in the cooling cavity; an inlet and an outlet respectively connected to the cooling cavity, wherein a cooling liquid enters the cooling cavity through the inlet and is discharged through the outlet after heat exchange between the cooling cavity and the plurality of heat dissipation fins The jet flow module comprises at least one through hole which is arranged between the inflow hole and the cooling cavity, wherein the at least one through hole comprises a total area of the through holes, the total area of the through holes is smaller than a total area of an opening of the inflow hole, and at least one impact flow is generated when the cooling liquid flows through the at least one through hole and faces the plurality of cooling fins so as to dissipate heat of the temperature equalizing plate.
2. 2. The cold plate heat sink of claim 1, wherein the at least one opening of the jet module is spatially opposite to the heat source, and the at least one opening of the jet module in the first direction is included in a projection range of the heat source.
3. 3. The cold plate heat sink of claim 1, wherein the heat source comprises at least one pair of heat sources arranged along a second direction and thermally coupled to the bottom of the cold plate, wherein the second direction is perpendicular to the first direction.
4. 4. The cold plate heat sink of claim 1, further comprising a spacer plate stacked along the first direction between the top of the temperature equalization plate and the inflow port, wherein the jet module is disposed on the spacer plate.
5. 5. The cold plate heat sink of claim 4, wherein the at least one opening is offset from the inlet in a direction of the first direction.
6. 6. The heat sink of claim 4, wherein the at least one opening comprises at least one pair of openings arranged along a second direction and symmetrically disposed on opposite sides of the inlet, wherein the second direction is perpendicular to the first direction.
7. 7. The cold plate heat sink of claim 4, wherein the at least one opening comprises at least one pair of circular holes, one on each side of the inlet.
8. 8. The cold plate heat sink of claim 4, wherein the at least one opening comprises at least one pair of elongated holes extending in a second direction, one on each of opposite sides of the inlet, wherein the second direction is perpendicular to the first direction.
9. 9. The cold plate heat sink of claim 4, wherein the at least one opening is a circular hole or an elongated hole extending in a second direction, wherein the second direction is perpendicular to the first direction.
10. 10. The cold plate heat sink of claim 4, wherein a total area of an opening of the outflow opening is greater than a total area of the at least one opening.
11. 11. The cold plate heat sink of claim 4, wherein a buffer chamber is formed between the baffle plate and the inlet, the outlet comprising at least one pair of outlets located on opposite sides of the buffer chamber.
12. 12. The cold plate heat sink of claim 1, wherein the at least one through opening is integrally formed with and correspondingly connected to the inlet.
13. 13. The cold plate heat sink of claim 12, wherein the inlet is connected to the at least one opening of the jet module along the first direction to form a stepped structure.
14. 14. The cold plate heat sink of claim 12, wherein the inlet is connected to the at least one port with a tapered pipe diameter along the first direction.
15. 15. The cold plate heat sink of claim 12, wherein the inlet is included in the projection of the heat source in the first direction.
16. 16. The cold plate heat sink of claim 1, wherein the heat source comprises at least one pair of heat sources arranged along a second direction and thermally coupled to the bottom of the cold plate, wherein the second direction is perpendicular to the first direction.
17. 17. The cold plate heat sink of claim 1, wherein the inflow port comprises a plurality of inflow ports, the outflow port comprises a plurality of outflow ports, and the number of the plurality of outflow ports is greater than or equal to the number of the plurality of inflow ports.
18. 18. The cold plate heat sink of claim 1, wherein the inflow port comprises a plurality of inflow ports, the outflow port comprises a plurality of outflow ports, and a total area of openings of the plurality of outflow ports is greater than or equal to a total area of the openings of the plurality of inflow ports.
19. 19. The cold plate heat sink of claim 1, wherein the cooling liquid passes through the inlet and the outlet parallel to the first direction.
20. 20. The cold plate heat sink of claim 1, wherein the heat source comprises a plurality of heat generating chips packaged as one body and directly thermally coupled to the bottom of the temperature equalization plate.

Description

Cooling plate heat dissipation device Technical Field The present application relates to a heat dissipating device, and more particularly to a heat dissipating device for a cold plate, which dissipates heat from a lower cold plate by forming a plurality of impact flows through a jet module, so as to enhance the heat dissipation efficiency of a temperature equalization plate. Background For the current multi-chip package design, a plurality of heat sources generating different heating powers are included in a single package structure. However, on the heating sources corresponding to a plurality of different heating powers, the single heat dissipation module often causes poor heat dissipation effect of local hot spots, thereby causing chip failure or reducing efficiency, and possibly even causing loss of device performance. In view of the foregoing, it is desirable to provide a cold plate heat dissipating device having a temperature equalizing plate. Through the contact of the temperature equalizing plate and the chip package, the phase change of the temperature equalizing plate can quickly absorb and diffuse heat generated by different heating sources. And moreover, a cooling plate structure is arranged above the temperature equalizing plate, and a jet flow module is introduced between a plurality of inflow openings and a plurality of outflow openings to form impact flow so as to strengthen the heat transfer effect of the cooling fins in the cooling cavity, so that heat generated by different heating sources is uniformly taken away by cooling liquid strengthened by the jet flow module. Disclosure of Invention The application aims to provide a cold plate heat dissipation device with a temperature equalization plate. Through the contact of the temperature equalizing plate and the chip package, the phase change of the temperature equalizing plate can quickly absorb and diffuse heat generated by different heating sources. And moreover, a cooling plate structure is arranged above the temperature equalizing plate, and a jet flow module is introduced between a plurality of inflow openings and a plurality of outflow openings to form impact flow so as to strengthen the heat transfer effect of the cooling fins in the cooling cavity, so that heat generated by different heating sources is uniformly taken away by cooling liquid strengthened by the jet flow module. Another object of the present application is to provide a cold plate heat dissipating device. The jet flow module is arranged between the inflow port and the cooling cavity to form a plurality of impact flows to radiate the lower layer of the cold plate so as to strengthen the radiating efficiency of the temperature equalization plate. The cooling cavity of the cold plate and the temperature equalizing plate are arranged in a vertically stacked mode, the temperature equalizing plate is thermally coupled with the chip package, and heat generated by the chip package can be quickly absorbed and diffused to the radiating fins of the upper cold plate through the phase change latent heat temperature equalizing plate. The cooling liquid flows in the cooling cavity from the inflow port to the outflow port, so that heat absorbed by the chip package can be taken away. Wherein the jet module comprises at least one through opening, such as a partition plate, arranged between the inlet opening and the cooling chamber. The cooling cavity is further divided into an upper layer structure and a lower layer structure by the partition plate, the arrangement position of the through opening can correspond to the heating source, and the cooling liquid passing through the inflow opening can move from the buffer cavity to the lower cooling cavity through the opening in the partition plate. The total area of all the openings of the upper opening of the partition plate is smaller than the total area of the openings of the cooling liquid inlet, the jet effect can be manufactured through the difference of the area ratio of the total area of the openings of the inlet and the total area of the openings, the cooling liquid can be uniformly distributed through the openings, a plurality of impact flows are formed for radiating the radiating fins of the lower cooling cavity, and the radiating efficiency of the temperature equalizing plate on the chip package is further enhanced. The number of the inflow port, the outflow port and the outflow port can be adjusted and changed according to actual application requirements, and the method is not limited to one place. The position of the through hole on the baffle plate can be adjusted corresponding to the position of the heating source and is staggered with the inlet, the shape of the through hole can be a round hole or a long hole, the pressure drop of cooling liquid flowing through the cooling cavity can be reduced through the arrangement of a plurality of outlet, and the heat dissipation efficiency of the jet flow module to the heat dissipation f