CN-122028357-A - Control structure, motor and electric equipment

CN122028357ACN 122028357 ACN122028357 ACN 122028357ACN-122028357-A

Abstract

The application discloses a control structure, a motor and electric equipment, wherein the control structure comprises a cover body, a control assembly, a first heat conducting piece and a second heat conducting piece, the cover body is provided with a storage bin, the control assembly is arranged in the storage bin and comprises a circuit board and an electronic component, the electronic component is connected to the circuit board, the circuit board is provided with an avoidance groove, the electronic component comprises a first surface and a second surface which are opposite, the first surface contacts the cover body, the second surface corresponds to at least part of the avoidance groove, the first heat conducting piece is embedded in the avoidance groove and is overlapped on the second surface, the second heat conducting piece is arranged in the storage bin, the second heat conducting piece is at least partially overlapped on the first heat conducting piece and at least partially abuts against the cover body, the first heat conducting piece is configured to conduct heat of the electronic component to the second heat conducting piece, and the second heat conducting piece is configured to conduct heat to the cover body. The heat conduction paths are established by utilizing the opposite sides of the electronic element, so that the heat dissipation area of the electronic element is increased, the electronic element can be efficiently dissipated, and the service life of the control assembly is prolonged.

Inventors

WU JINGXIAN
LIN YINGZHU
LIU JIAXU
SU YICHENG
HONG CHONGJIE

Assignees

鸿海精密工业股份有限公司

Dates

Publication Date: 20260512
Application Date: 20251226
Priority Date: 20251121

Claims (12)

1. A control structure for an electric motor, comprising: the cover body is provided with a storage bin; The control assembly is arranged in the storage bin and comprises a circuit board and an electronic element, the electronic element is mechanically and electrically connected to the circuit board, the circuit board is provided with an avoidance groove, the electronic element comprises a first surface and a second surface which are opposite, the first surface is contacted with the cover body, and the second surface corresponds to at least part of the avoidance groove; The first heat conduction piece is embedded in the avoidance groove and is overlapped on the second surface; the second heat conduction piece is arranged in the storage bin, is at least partially overlapped with the first heat conduction piece and is at least partially abutted against the cover body; The first heat conductive member is configured to conduct heat of the electronic component to the second heat conductive member, and the second heat conductive member is configured to conduct the heat to the cover.
2. The control structure of claim 1, wherein said cover includes a bottom wall and side walls, said side walls being connected to said bottom wall and collectively enclosing said storage compartment; The bottom wall contacts the first surface, and the side wall abuts against part of the second heat conduction piece.
3. The control structure of claim 1 or 2, wherein said second heat-conducting member comprises a heat-absorbing section and a heat-releasing section connected to each other, said heat-absorbing section being at least partially overlapped with said first heat-conducting member, said heat-releasing section being at least partially abutted against said cover, said heat-absorbing section being configured to absorb heat and conduct to said heat-releasing section, said heat-releasing section being configured to release heat.
4. The control structure of claim 3, wherein said heat sink is stacked on a side of said circuit board facing away from said electronic component and partially corresponds to said recess.
5. The control structure of claim 3, wherein the heat release section is disposed around the outer side of the circuit board and abuts against the cover, and a space is provided between the heat release section and the outer side of the circuit board.
6. The control structure of claim 5, wherein a groove is formed in the storage bin, the shape of the inner wall of the groove is matched with the shape of the outer wall of the heat release section, and the heat release section is fixed in the groove.
7. The control structure of claim 3, wherein said first heat conducting member is configured as a copper block and said second heat conducting member is configured as a heat pipe.
8. The control structure of claim 2, wherein a plurality of first fins are provided on a side of the bottom wall located outside the storage compartment, a plurality of second fins are provided on a side of the side wall located outside the storage compartment, the first fins extend in a radial direction of the cover body, and the second fins extend in a circumferential direction of the cover body.
9. The control structure of claim 2, wherein a filler piece is disposed between said first surface and said bottom wall, said filler piece being configured to fill a void between said first surface and said bottom wall and conduct said heat to said bottom wall.
10. An electric machine, comprising: a housing having a cavity; The power structure is arranged in the cavity; The control structure of any one of claims 1 to 9; The shell is mechanically connected with the control structure, so that the cavity is communicated with the storage bin and forms a sealed cavity, and the power structure is electrically connected with the control structure.
11. The motor of claim 10, further comprising a gasket disposed between the housing and the control structure and configured to block heat transfer from the housing to the control structure.
12. An electrically powered device comprising a fan assembly and the motor of claim 10 or 11, the fan assembly forming an airflow through the motor.

Description

Control structure, motor and electric equipment Technical Field The application belongs to the technical field of motors, and particularly relates to a control structure, a motor and electric equipment. Background The control assembly of the motor comprises a circuit board and electronic elements (such as a capacitor, a power element, an executive element and the like) arranged on the circuit board, wherein the electronic elements are poor in heat resistance and easy to be damaged by heating. Disclosure of Invention The application provides a control structure, a motor and electric equipment, and aims to solve the problem that electronic elements are easy to overheat and damage. The application provides a control structure which comprises a cover body, a control assembly, a first heat conducting piece and a second heat conducting piece, wherein the cover body is provided with a storage bin, the control assembly is arranged in the storage bin and comprises a circuit board and an electronic component, the electronic component is mechanically and electrically connected to the circuit board, the circuit board is provided with an avoidance groove, the electronic component comprises a first surface and a second surface which are opposite, the first surface contacts the cover body, the second surface corresponds to at least part of the avoidance groove, the first heat conducting piece is embedded in the avoidance groove and is overlapped on the second surface, the second heat conducting piece is arranged in the storage bin, the second heat conducting piece is at least partially overlapped on the first heat conducting piece and at least partially abuts against the cover body, the first heat conducting piece is configured to conduct heat of the electronic component to the second heat conducting piece, and the second heat conducting piece is configured to conduct heat to the cover body. In the control structure, the first surface of the electronic element contacts the cover body and can conduct heat to the cover body, the second surface of the electronic element is sequentially overlapped with the first heat conducting piece and the second heat conducting piece, so that heat can be conducted to the second heat conducting piece through the first heat conducting piece and conducted to the cover body, compared with the heat conduction to one surface of the electronic element, the heat conduction path is established by utilizing the opposite surfaces of the electronic element, the heat dissipation area of the electronic element is increased, the heat of the opposite surfaces of the electronic element is conducted to the outside through the cover body, the electronic element can be efficiently dissipated, the electronic element is prevented from being overheated and damaged, and the service life of the control assembly is prolonged. In some embodiments, the cover includes a bottom wall and a side wall connected to the bottom wall and collectively enclosing the storage compartment, the bottom wall contacting the first face, the side wall abutting the portion of the second thermally conductive member. The bottom wall and the side wall simultaneously dissipate heat of opposite sides of the electronic element, so that heat flow is dispersed, heat exchange area between the cover body and the external environment is increased, heat dissipation efficiency of the cover body and the electronic element can be improved, uniform heat dissipation of the electronic element is facilitated, and damage risk of the electronic element due to local overheating is reduced. In some embodiments, the second heat conducting member comprises a heat absorbing section and a heat releasing section which are connected with each other, the heat absorbing section is at least partially overlapped with the first heat conducting member, the heat releasing section is at least partially abutted against the cover body, the heat absorbing section is configured to absorb heat and conduct the heat to the heat releasing section, and the heat releasing section is configured to release the heat. The heat absorption section absorbs heat of the electronic component, which is conducted from the first surface to the first heat conduction member, and conducts the heat to the heat release section, and the heat release section releases and conducts the heat absorbed by the heat absorption section to the cover body, so that the second heat conduction member can dissipate heat of the electronic component. In some embodiments, the heat absorbing section is stacked on a surface of the circuit board facing away from the electronic component, and partially corresponds to the avoidance groove. The heat absorption section absorbs the heat of the first heat conduction piece with dodging the corresponding part of groove, and the heat absorption section absorbs the heat of circuit board with the region of circuit board contact, and the heat absorption section can absorb the heat of