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CN-122028358-A - Liquid cooling heat abstractor and liquid cooling heat abstractor for high-power electronic equipment

CN122028358ACN 122028358 ACN122028358 ACN 122028358ACN-122028358-A

Abstract

The present disclosure provides a liquid cooling heat sink for high power electronic equipment and a liquid cooling heat sink. The liquid cooling heat dissipation device for the high-power electronic equipment comprises a liquid cooling heat dissipation box and a liquid cooling heat dissipation assembly, wherein the liquid cooling heat dissipation box is provided with a liquid inlet cavity, a backflow cavity and a liquid outlet cavity which are sequentially communicated, the liquid cooling heat dissipation box is provided with a liquid inlet and a liquid outlet, the liquid cooling heat dissipation assembly comprises a steering flow distribution piece and a double-fractal flow distribution piece, the steering flow distribution piece and the double-fractal flow distribution piece are both positioned in the liquid inlet cavity, and the steering flow distribution piece is arranged opposite to the liquid inlet. After the cooling liquid enters the liquid cooling heat dissipation box, the diversion part is used for carrying out flow direction conversion on the cooling liquid, so that a liquid flow passage at a liquid inlet is stable, the phenomenon of vortex is avoided, and a stable cooling liquid flow rate is provided. And then, the cooling liquid is subjected to secondary accurate distribution of the double-fractal flow equalization piece, so that the flow velocity of the cooling liquid after rotation is further stable, and the heat dissipation uniformity of high-power electronic equipment is effectively improved.

Inventors

  • WANG WEI
  • MA ZHAO
  • QIAN YONG

Assignees

  • 苏州硕贝德通讯技术有限公司

Dates

Publication Date
20260512
Application Date
20251226

Claims (10)

  1. 1. A liquid-cooled heat sink for high power electronics, comprising: The liquid cooling heat dissipation box is used for being connected with a heating area of the high-power electronic equipment and is provided with a liquid inlet cavity, a backflow cavity and a liquid outlet cavity which are sequentially communicated, the liquid cooling heat dissipation box is provided with a liquid inlet and a liquid outlet, the liquid inlet is communicated with the liquid inlet cavity, the liquid inlet is used for injecting cooling liquid, the liquid outlet is communicated with the liquid outlet cavity, and the liquid outlet is used for guiding out the cooling liquid; The liquid cooling heat dissipation assembly comprises a steering flow dividing piece and a double-fractal flow dividing piece, wherein the steering flow dividing piece and the double-fractal flow dividing piece are both positioned in the liquid inlet cavity, the steering flow dividing piece is opposite to the liquid inlet, the steering flow dividing piece is used for steering an injected cooling liquid flowing path, the double-fractal flow dividing piece is adjacent to the steering flow dividing piece, and the double-fractal flow dividing piece is used for balancing the flow velocity of the cooling liquid after steering.
  2. 2. The liquid cooling heat dissipating device for high power electronic equipment according to claim 1, wherein the diverting member comprises a conical diverting column and a fixed connecting column, the fixed connecting column is respectively connected with the conical bottom of the conical diverting column and the bottom of the liquid inlet cavity, and the conical top of the conical diverting column faces the liquid inlet.
  3. 3. The liquid cooling heat sink for high power electronic equipment according to claim 2, wherein the diameter of the conical bottom of the conical split column is larger than the diameter of the liquid inlet.
  4. 4. The liquid cooling heat sink for high power electronic equipment according to claim 2, wherein the cone apex angle of the conical split column is 30 ° to 60 °.
  5. 5. The liquid-cooled heat sink for high power electronics according to claim 2, wherein the ratio of the height of the conical split column to the diameter of the liquid inlet is 1.2 to 1.5.
  6. 6. The liquid cooling heat dissipating device for high power electronic equipment according to claim 2, wherein the double-fractal flow equalizing member comprises at least two first flow dividing strips, at least two first flow dividing strips are symmetrically arranged, and one end of each first flow dividing strip is arranged close to the cone bottom of the cone flow dividing column.
  7. 7. The liquid cooling heat dissipating device for a high power electronic apparatus of claim 6 wherein the dual fractal flow equalization member further comprises at least two second shunt strips, at least two of the second shunt strips are symmetrically disposed, one end of each of the second shunt strips is disposed near the conical bottom of the conical shunt column, and the symmetry center line of the second shunt strips coincides with the symmetry center line of the first shunt strips.
  8. 8. The liquid-cooled heat sink for a high power electronic device of claim 7, wherein the second shunt bar has a length that is less than a length of the first shunt bar.
  9. 9. The liquid cooling heat sink for high power electronic equipment according to claim 7, wherein the first and second split strips each have a curved structure, and the first and second split strips each curve toward a communication position between the liquid inlet chamber and the reflow chamber.
  10. 10. A liquid-cooled heat sink device comprising the liquid-cooled heat sink for high-power electronic equipment according to any one of claims 1 to 9.

Description

Liquid cooling heat abstractor and liquid cooling heat abstractor for high-power electronic equipment Technical Field The disclosure relates to the technical field of heat dissipation, in particular to a liquid cooling heat dissipation device for high-power electronic equipment and liquid cooling heat dissipation equipment. Background With the development of data center servers (such as AI (advanced technology) and GPU (graphic processing unit) clusters), new energy automobile electric control systems (such as SiC modules) and power electronic devices (such as IGBT (insulated gate bipolar transistor) inverters) to high power density, the heat consumption density of chips and power devices breaks through 500W/cm 2, and traditional air cooling heat dissipation is gradually replaced by liquid cooling heat dissipation technology due to insufficient heat exchange efficiency. The relieved tooth-shaped liquid cooling plate greatly improves the specific surface area of the runner by milling and extruding the shaped relieved tooth-shaped bulge, so that the relieved tooth-shaped liquid cooling plate becomes a main stream heat dissipation scheme of high-power equipment. The prior art for 'forming relieved tooth cold plate split flow' in the industry mainly comprises the following three types: 1. The vertical water inlet is directly communicated with the horizontal relieved tooth runner, and the water flow is guided to turn only through the rounded corner transition at the inlet of the runner, so that no additional flow dividing component is arranged, for example, the patent application with the patent publication number of CN118763322A is directly connected with the flow dividing runner, no flow guiding or flow dividing structure is arranged, the natural transition of the runner is only relied on to realize the turning and distribution of the fluid, the kinetic energy is concentrated when the vertical water flow turns to the level, the side wall of the runner is easy to impact to form a vortex area, the flow distribution in the horizontal runner is uneven, namely, the flow of the relieved tooth runner close to the water inlet is excessive, and the flow of the runner far away from the water inlet is insufficient. 2. A solid and hollow cone (with the tip upwards) is arranged below the vertical water inlet, vertical water flow is converted into radial horizontal flow by utilizing the conical surface, and the vertical water flow is directly communicated with the multi-stage sub-flow channel without a subsequent secondary flow dividing structure. The cone diversion only realizes the flow state conversion of 'vertical-to-horizontal', the problem of 'multi-branch flow passage even distribution' is not solved, radial water flows are distributed in a manner of 'center sparse and edge dense', namely, the water flows at the edge of the bottom surface of the cone are fast in flow speed due to centrifugal force, and preferentially enter into the relieved tooth flow passages at the edge of the cold plate, and the water flow speed in the center area is slow, so that the heat exchange of the center relieved tooth is insufficient. 3. The chain type split vertical water flow is not diverted to directly impact the chain type guide strips, so that the gap flow of a first group of guide strips is saturated, the gap flow of a subsequent guide strip is decreased, and the guide strips are easy to generate fatigue deformation due to impact vibration. Disclosure of Invention The purpose of the present disclosure is to overcome the shortcomings in the prior art, and provide a liquid cooling heat dissipation device and a liquid cooling heat dissipation device for high-power electronic equipment, which effectively improve heat dissipation uniformity. The aim of the disclosure is achieved by the following technical scheme: The liquid cooling heat dissipation device for the high-power electronic equipment comprises a liquid cooling heat dissipation box and a liquid cooling heat dissipation assembly, wherein the liquid cooling heat dissipation box is used for being connected with a heating area of the high-power electronic equipment and is provided with a liquid inlet cavity, a backflow cavity and a liquid outlet cavity which are sequentially communicated, the liquid cooling heat dissipation box is provided with a liquid inlet and a liquid outlet, the liquid inlet is communicated with the liquid inlet cavity and is used for injecting cooling liquid, the liquid outlet is communicated with the liquid outlet cavity and is used for guiding out cooling liquid, the liquid cooling heat dissipation assembly comprises a steering split piece and a double-fractal flow equalization piece, the steering split piece and the double-fractal flow equalization piece are both positioned in the liquid inlet cavity, the steering split piece and the liquid inlet are oppositely arranged, the steering split piece is used for steering a flow path of the injected cooling liqu