CN-122028360-A - Radiating fin capable of inhibiting electromagnetic radiation emission

Abstract

The invention is suitable for the field of network communication, and provides a radiating fin capable of inhibiting electromagnetic radiation emission, which is applied to a Printed Circuit Board (PCB) provided with a heating element and comprises a radiating fin made of a high-conductivity metal material, wherein the radiating fin covers a radiation source area on the PCB, and the radiating fin is electrically connected with a grounding layer of the PCB through a grounding structure, so that the radiating fin can be used as a shielding body for inhibiting electromagnetic radiation while radiating heat.

Inventors

• LI YU
• XIONG XIANGQIAN

Assignees

• 上海通康创信技术有限公司

Dates

Publication Date

20260512

Application Date

20251230

Claims (10)

1. 1. The radiating fin is applied to a Printed Circuit Board (PCB) provided with a heating element, and is characterized by comprising a radiating fin (1) made of a high-conductivity metal material, wherein the radiating fin (1) covers a radiation source area on the PCB, and the radiating fin is electrically connected with a grounding layer of the PCB through a grounding structure, so that the radiating fin can be used as a shielding body for inhibiting electromagnetic radiation while radiating heat.
2. 2. The heat sink of claim 1 wherein said highly conductive metallic material is highly conductive metallic aluminum.
3. 3. A heat sink capable of suppressing electromagnetic radiation emission according to claim 1, characterized in that the surface of the heat sink (1) is provided with a conductive surface treatment layer (3).
4. 4. A heat sink capable of suppressing electromagnetic radiation emissions according to claim 3, characterized in that the conductive surface treatment layer (3) is a conductive anodized coating.
5. 5. The heat sink capable of suppressing electromagnetic radiation emission according to claim 1, wherein the grounding structure comprises a plurality of fixing screws, a plurality of fixing holes (2) for installing the fixing screws are formed in the heat sink (1), and the heat sink (1) is fixedly connected with the PCB through the fixing screws and is electrically connected with the PCB grounding layer through the fixing screws.
6. 6. The heat sink for suppressing electromagnetic radiation emission according to claim 5, characterized in that the area of the heat sink (1) in contact with the PCB by means of the fixing screw is provided with a ground pad with exposed copper and tin.
7. 7. The heat sink capable of suppressing electromagnetic radiation emissions according to claim 6, wherein the grounding structure further comprises an electrically and thermally conductive pad disposed between the heat sink (1) and other shields on the PCB.
8. 8. The heat sink of claim 7 wherein said electrically and thermally conductive liner is a graphite filled silica gel pad.
9. 9. The heat sink capable of suppressing electromagnetic radiation emission according to claim 1, characterized in that the heat sink (1) is provided with heat dissipating teeth, the edges and tips of which are chamfered or rounded.
10. 10. The heat sink capable of suppressing electromagnetic radiation emissions according to claim 1, characterized in that the physical length of any cantilever structure on the heat sink (1) is less than a quarter of the wavelength in air of a predetermined interference frequency.

Description

Radiating fin capable of inhibiting electromagnetic radiation emission Technical Field The invention relates to the field of network communication, in particular to a radiating fin capable of inhibiting electromagnetic radiation emission. Background In the common electronic equipment adopting the radiating fins, the traditional design thought has obvious defects that on one hand, the radiating fins can only solve the radiating problem of the electronic equipment, the radiating fins which are not helpful for electromagnetic radiation inhibition can also introduce extra electromagnetic radiation, and on the other hand, when extra inhibiting devices such as shielding covers are added for solving the electromagnetic radiation problem, the cost is increased, and the radiating effect of products is also generated. In the prior art, the requirements of efficient heat dissipation and radiation emission in electromagnetic compatibility are contradictory, and the synergistic optimization of the two requirements is difficult to realize on the premise of not remarkably increasing the hardware cost. Therefore, in view of the above situation, it is highly desirable to provide a heat sink capable of suppressing electromagnetic radiation emission, so as to overcome the drawbacks of the current practical application. Disclosure of Invention The present invention is directed to a heat sink capable of suppressing electromagnetic radiation emission, and aims to solve the above-mentioned problems in the prior art. The invention is realized in such a way that a heat sink capable of suppressing electromagnetic radiation emission is applied to a Printed Circuit Board (PCB) on which a heating element is mounted, and comprises a heat sink made of a highly conductive metal material, wherein the heat sink covers a radiation source region on the PCB, and the heat sink is electrically connected with a grounding layer of the PCB through a grounding structure, so that the heat sink can serve as a shielding body for suppressing electromagnetic radiation while radiating heat. In a further aspect of the present invention, the highly conductive metal material is highly conductive metal aluminum. In a further aspect of the present invention, the surface of the heat sink has a conductive surface treatment layer. As a further proposal of the invention, the conductive surface treatment layer is a conductive anodic oxidation coating. As a further proposal of the invention, the grounding structure comprises a plurality of fixing screws, the radiating fin is provided with a plurality of fixing holes for installing the fixing screws, the radiating fin is fixedly connected with the PCB through the fixing screws, and the electrical connection with the PCB grounding layer is realized through the fixing screws As a further scheme of the invention, the area where the radiating fin is contacted with the PCB through the fixing screw is provided with a grounding pad with exposed copper and tin. As a further aspect of the present invention, the grounding structure further includes an electrically and thermally conductive pad disposed between the heat sink and other shielding cases on the PCB. As a further scheme of the invention, the electric and heat conducting gasket is a silica gel pad filled with graphite. As a further scheme of the invention, the radiating fins are provided with radiating teeth, and the edges and the tips of the radiating teeth are subjected to chamfering or rounding treatment. As a further proposal of the invention, the physical length of any cantilever structure on the radiating fin is smaller than one quarter of the wavelength of the preset interference frequency in the air. Compared with the prior art, the invention has the beneficial effects that: According to the invention, by combining the design of the radiating fin with the electromagnetic shielding function, the large-area metal radiating fin with good grounding is utilized as a local shielding body, so that the radiating requirement is met, electromagnetic radiation is effectively inhibited, the cost and the negative radiating effect caused by additionally adding a shielding device are avoided, and the cooperative optimization of radiating and electromagnetic compatibility is realized. Drawings In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art. Fig. 1 is a schematic perspective view of the present invention. Fig. 2 is a schematic side view of the present invention. Fig. 3 is a graph of measured data of electromagnetic radiation emission. In the drawing, 1-radiating fin, 2-fix