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CN-122028370-A - Manifold micro-jet cold plate radiator and heat radiation method

CN122028370ACN 122028370 ACN122028370 ACN 122028370ACN-122028370-A

Abstract

The invention belongs to the field of heat exchange of electronic devices, and discloses a manifold micro-jet cold plate radiator and a heat radiation method, wherein the manifold micro-jet cold plate radiator comprises a radiator shell; the radiator comprises a radiator shell, wherein an assembling cavity is arranged in the middle of the radiator shell, a manifold splitter plate, a jet plate and a heat dissipation heat sink are sequentially overlapped in the assembling cavity, a cold side manifold channel and a hot side manifold channel are arranged on the manifold splitter plate at intervals, a cold side jet region and a hot side reflux region are arranged on the jet plate at intervals, the cold side jet region and the cold side manifold channel are arranged in an up-down opposite mode, a plurality of jet nozzle channels are arranged on the cold side jet region, the jet nozzle channels are of a tapered structure, the hot side reflux region and the hot side manifold channel are in up-down opposite mode and are communicated, a plurality of jet cavities are arranged on the surface of the heat dissipation heat sink, the geometric centers of the jet cavities correspond to the centers of the jet nozzle channels one by one, and the top of the side ends of the jet cavities are communicated with the hot side reflux region.

Inventors

  • TAO WENQUAN
  • SUN CHENGHUI
  • ZHU HAOTIAN
  • LI YUTING
  • LI ZHENGDAO
  • LI ZHIYANG

Assignees

  • 西安交通大学

Dates

Publication Date
20260512
Application Date
20260309

Claims (10)

  1. 1. A manifold micro-jet cold plate radiator is characterized by comprising a radiator shell (1), a manifold splitter plate (2), a jet plate (3) and a heat dissipation heat sink (4); One end of the radiator shell (1) is provided with a cooling liquid inlet (11), the other end of the radiator shell is provided with a cooling liquid outlet (12), the middle part of the radiator shell (1) is provided with an assembly cavity (13), and the manifold splitter plate (2), the jet plate (3) and the heat dissipation heat sink (4) are sequentially stacked in the assembly cavity (13); A cold side manifold channel (21) and a hot side manifold channel (22) are arranged on the manifold splitter plate (2) at intervals, the cold side manifold channel (21) is communicated with the cooling liquid inlet (11), and the hot side manifold channel (22) is communicated with the cooling liquid outlet (12); The jet flow plate (3) is provided with a cold side jet flow area (31) and a hot side reflux area (32) at intervals, the cold side jet flow area (31) and the cold side manifold channel (21) are arranged in an up-down opposite mode, the cold side jet flow area (31) is provided with a plurality of jet flow nozzle channels (33), the jet flow nozzle channels (33) are of a tapered structure, and the hot side reflux area (32) and the hot side manifold channel (22) are arranged in an up-down opposite mode and are communicated; The surface of the heat dissipation heat sink (4) is provided with a plurality of jet flow chambers (43), the geometric centers of the jet flow chambers (43) are in one-to-one correspondence with the centers of the jet flow nozzle channels (33), and the top of the side end of each jet flow chamber (43) is communicated with the hot side backflow area (32).
  2. 2. A manifold microfluidic cold plate radiator according to claim 1, wherein the cold side manifold channels (21) are of a variable cross-section channel structure tapering in the direction of coolant flow and the hot side manifold channels (22) are of a variable cross-section channel structure tapering in the direction of coolant flow.
  3. 3. A manifold microfluidic cold plate radiator according to claim 2, wherein the channel width shrinkage ratio of the cold side manifold channels (21) is 2:1-3:1 and the channel width expansion ratio of the hot side manifold channels (22) is 2:1-3:1.
  4. 4. The manifold micro-jet cold plate radiator according to claim 1, wherein the cold side jet flow area (31) adopts a variable cross-section plate structure which is gradually reduced along the long axis direction of the cold side manifold channel (21), the hot side reflux area (32) is a variable cross-section channel structure which is gradually expanded along the long axis direction of the hot side manifold channel (22), and the jet flow nozzle channels (33) are uniformly distributed on the cold side jet flow area (31) and are arranged at intervals along the long axis direction of the cold side manifold channel (21).
  5. 5. A manifold micro-jet cold plate radiator according to claim 1, characterized in that the diameter of the jet nozzle channel (33) decreases linearly in the direction of flow of the cooling liquid.
  6. 6. The manifold micro-jet cold plate radiator according to claim 1, wherein the jet nozzle channel (33) adopts an inverted truncated cone-shaped channel structure, and wherein the inclination angle between the channel wall surface of the jet nozzle channel (33) and the vertical direction is in the range of 5-10 °.
  7. 7. A manifold micro-jet cold plate radiator according to claim 1, characterized in that the heat dissipating heat sink (4) comprises a heat sink base plate (41) and several fin structures (42); the heat sink bottom plate (41) is fixed at the bottom of the assembly cavity (13), and a plurality of fin structures (42) are distributed on the surface of the heat sink bottom plate (41) in an orthogonal array mode, wherein the fin structures (42) are mutually and vertically distributed in a crossing mode, and a plurality of independent jet cavities (43) are formed in an encircling mode.
  8. 8. A manifold micro-fluidic cold plate heat sink according to claim 7, wherein the cross-sectional width of the fluidic chamber (43) matches the maximum channel width of the cold side manifold channel (21).
  9. 9. The manifold microfluidic cold plate radiator according to claim 1, wherein the manifold flow dividing plate (2) and the fluidic plate (3) are made of a polymer material or a composite material with fluid compatibility, and the heat dissipation heat sink (4) is made of a heat conduction material.
  10. 10. A method of heat dissipation comprising mounting the manifold microfluidic cold plate heat sink of any one of claims 1-9 on a device to be cooled; The low-temperature cooling liquid flows in through the cooling liquid inlet (11), uniformly flows into the corresponding jet nozzle channel (33) after passing through the cold side manifold channel (21), vertically impacts into the jet cavity (43) of the heat dissipation heat sink (4) after passing through the jet nozzle channel (33), and forms high-temperature cooling liquid after heat exchange in the heat dissipation heat sink (4); The high-temperature cooling liquid enters the hot-side backflow zone (32) along the side end wall surface of the jet cavity (43) and through the side end top of the jet cavity (43), and then flows out through the cooling liquid outlet (12) after flowing through the hot-side manifold channel (2).

Description

Manifold micro-jet cold plate radiator and heat radiation method Technical Field The invention belongs to the technical field of heat exchange of electronic devices, and particularly relates to a manifold micro-jet cold plate radiator and a heat radiation method. Background With the rapid development of the front-end fields of artificial intelligence (ARTIFICIAL INTELLIGENCE, AI), laser technology, photoetching machines and the like, the heat dissipation power of core equipment such as high-power lasers, high-heat-flux-density electronic devices and the like is continuously increased, wherein the temperature control of the electronic components under the high-heat-flux density is directly related to the operation stability, service life and upper performance limit of the devices, the electronic components become key bottlenecks for restricting the development of the high-power devices to higher power levels and higher performances, if the heat dissipation is not timely, the local temperature of the chips is too high, the electronic migration is aggravated, the signal transmission delay and the devices are even permanently damaged, the reliability of the data center and high-end equipment is seriously affected, however, as the integration level of the chips is continuously improved, the heating value in a unit area is drastically increased, the limitation is gradually exposed by the traditional heat dissipation means when the extreme heat flux density is dealt with, and especially when the Ultra-high power chips such as Rubin the future architecture are faced, the heat dissipation cost is expected to be five times that of the traditional liquid cooling scheme, the economic burden of hardware deployment is increased, the energy efficiency of the heat dissipation system is more urgent requirements are provided, the research and development are more urgent, the research and development is more stringent, the heat dissipation cost is more contradiction between the high-efficiency and the heat dissipation scheme. At present, the cooling scheme for the high-power laser and the high-heat-flux electronic device mainly comprises manifold microchannel heat dissipation and jet impact cooling, wherein the heat dissipation of the manifold microchannel increases the heat exchange area through a tiny flow channel, the heat dissipation capacity is improved to a certain extent, the jet impact cooling is a more efficient convection heat exchange mode, the core principle is that high-speed fluid is directly impacted to the surface to be cooled through one or more jet nozzles, the direct impact can effectively destroy the formation of a boundary layer, extremely high convection heat exchange coefficient is generated in a local area, and therefore efficient heat dissipation is achieved, typical jet impact flow can be divided into three areas, namely a stagnation point area, a wall jet area and a jet core area, specifically, the area of the jet fluid impact wall is called as the stagnation point area, the fluid is radially diffused to form the wall jet area after impact, the jet speed is kept unchanged basically in front of the wall, the flow speed of the jet is rapidly reduced to zero due to the limitation of the impact surface, the fluid flow direction of the stagnation point area is rapidly changed from the axial direction to the radial direction, and extremely high convection heat exchange coefficient is formed in the local area, and extremely high heat flux density can be achieved in theory. However, the existing cooling scheme generally has the problem of limited heat dissipation efficiency in practical application, wherein the processing cost is higher for micro-channel heat dissipation, the problems of blockage and the like are easy to occur due to the fact that the channel size is very small, the heat dissipation efficiency of the heat dissipation device is greatly affected, if the size of the micro-channel is further reduced to meet higher heat dissipation requirements, the processing difficulty and the pressure drop of fluid are increased, the heat dissipation cost is further increased, the difficulty of the cost and the heat dissipation performance is trapped in a game, in the traditional jet impact cooling heat dissipation device, the outflow generated after the jet impact of adjacent nozzles is mutually interfered in the multi-nozzle array jet cooling process to form a fountain effect, the interaction of the cross flow weakens the local convection heat exchange effect, as shown in the attached figure 2, in addition, the fluid is easy to accumulate in the edge area of a cavity in the process of flowing to the outlet, the main flow path is interfered, the local hot spot is possibly caused on the surface to be cooled, and the problem of uneven temperature distribution is caused, meanwhile, the flow resistance is increased with the increase of the travelling path of the fluid on the impact surface, the pressure drop is