CN-122028371-A - Heat radiation structure and power adapter

CN122028371ACN 122028371 ACN122028371 ACN 122028371ACN-122028371-A

Abstract

The invention relates to the technical field of power adapters, in particular to a heat dissipation structure and a power adapter. A heat dissipation structure comprises a shell, wherein the shell is provided with an inner cavity, heat dissipation holes and a radiator, the heat dissipation holes and the radiator are respectively communicated with the inner cavity and the outside, the heat dissipation holes comprise a first heat dissipation hole, a second heat dissipation hole and a heat dissipation channel, the radiator comprises a heat dissipation layer and a heat dissipation end, the heat dissipation end stretches into the direction of the second heat dissipation hole from the first heat dissipation hole so that the radiator is connected to the shell, the radiator is integrally formed, the heat dissipation layer is connected to the inner side of the heat dissipation hole along the first direction, the heat conductivity coefficient of the radiator is larger than that of the shell, at least part of the radiator is made of metal materials, and at least part of the shell is made of plastic materials. According to the invention, the radiating end of the radiator extends into the radiating channel between the first radiating hole and the second radiating hole, so that the path of external foreign matters directly contacting with the internal electrified component can be blocked, the short circuit and electric shock risks are reduced, the heat retention is reduced, and the radiating efficiency is improved.

Inventors

YANG XIAOBING
YANG WEIMING

Assignees

佛山市顺德区冠宇达电源有限公司

Dates

Publication Date: 20260512
Application Date: 20260313

Claims (10)

1. A heat dissipation structure comprises a shell (1) and is characterized in that the shell (1) is provided with an inner cavity (2), heat dissipation holes (3) which are respectively communicated with the inner cavity (2) and the outside, and a heat dissipation device (4) which is arranged in the inner cavity (2), wherein the heat dissipation holes (3) comprise a first heat dissipation hole (31) which is close to the inner cavity (2), a second heat dissipation hole (32) which is far away from the inner cavity (2), and a heat dissipation channel (33) which is arranged between the first heat dissipation hole (31) and the second heat dissipation hole (32), the heat dissipation device (4) comprises a heat dissipation layer (41) which is arranged in the inner cavity (2), and a heat dissipation end (42) which is connected with the heat dissipation layer (41) and extends towards the direction of the heat dissipation channel (33), and the heat dissipation end (42) extends from the first heat dissipation hole (31) towards the direction of the second heat dissipation hole (32), so that the heat dissipation device (4) is connected with the shell (1); The radiator (42) is integrally formed, the radiating layer (41) is connected to the inner side of the radiating hole (3) along the first direction, the heat conductivity of the radiator (4) is larger than that of the shell (1), at least part of the radiator (4) is made of metal materials, and at least part of the shell (1) is made of plastic materials.
2. A heat dissipating structure according to claim 1, wherein said heat dissipating end (42) is not provided with an end portion which is located at the highest position of the outer surface of said housing (1).
3. A heat dissipating structure according to claim 2, wherein the end face of the second heat dissipating hole (32) is flush with the outer surface of the housing (1) or is located inside the outer surface of the housing (1), and the heat dissipating end (42) extends in the first direction by a distance smaller than or equal to the distance between the first heat dissipating hole (31) and the end face of the housing (1) in the first direction.
4. A heat dissipating structure according to claim 1, wherein said heat dissipating end (42) extends a distance less than or equal to the length of said heat dissipating channel (33), and wherein the height of the end of said heat dissipating end (42) is less than or equal to the height of said second heat dissipating hole (32).
5. The heat radiation structure as set forth in claim 1, wherein the projection of the heat radiation hole (3) is arc-shaped or polygonal, the housing (1) is integrally formed, the heat radiator (42) is integrally formed, the side section of the heat radiation end (42) is quadrangular, the heat radiation end (42) is arranged in a strip shape or in a column shape, the heat radiation end (42) is provided with a plurality of heat radiation holes (3) in a strip shape or in an arc shape, and the heat radiation holes (3) are provided with a plurality of heat radiation holes and are arranged at intervals.
6. A heat dissipating structure according to claim 1, wherein the heat dissipating end (42) has an axial direction parallel to the axial direction of the heat dissipating layer (41), and the heat dissipating hole (3) has an axial direction parallel to the axial direction of the heat dissipating layer (41); or an included angle alpha is formed between the axial direction of the heat dissipation channel (33) and the central axis of the shell (1), and the axial direction of the heat dissipation end (42) is parallel to the axial direction of the heat dissipation channel (33).
7. The heat dissipating structure of claim 1, wherein said heat dissipating holes (3) have elasticity, and the width of said heat dissipating holes (3) is smaller than the width or the radial width of the heat dissipating ends (42); the heat dissipation layer (41) is attached to the inner wall of the shell (1), or a gap beta is arranged between the heat dissipation layer (41) and the shell (1).
8. The heat dissipation structure as set forth in claim 1, wherein the heat dissipation layer (41) is provided with a first connection portion (411), the housing (1) is provided with a second connection portion (11), the first connection portion (411) is mated with the second connection portion (11) so that the heat sink (4) is fixed with the housing (1), and the mating manner of the first connection portion (411) and the second connection portion (11) at least includes one of a fastener connection, a snap connection, a magnetic connection, a screw connection, a post groove connection, a mortise and tenon connection, a turnbuckle connection, an ultrasonic connection, and an adhesive connection.
9. A heat dissipating structure according to claim 1, wherein the housing (1) is provided with an extension (5) extending in the axial direction of the heat dissipating hole (3) and away from the inner cavity (2), the cross section of the extension (5) is parallelogram, rectangular or trapezoid, the heat dissipating channel (33) is at least partially disposed in the extension (5), and the second heat dissipating hole (32) is located at the end of the extension (5).
10. A power adapter comprising a heat dissipating structure according to any one of claims 1-9.

Description

Heat radiation structure and power adapter Technical Field The invention relates to the technical field of power adapters, in particular to a heat dissipation structure and a power adapter. Background A power supply is a device that provides electrical energy to an electronic device, also referred to as a power supply. The core is typically composed of power conversion circuitry and control circuitry, which are integrated on a Printed Circuit Board (PCB). According to different energy conversion requirements, the power supply can realize multiple functions, such as a switching power supply (AC-DC), an inverter power supply (DC-AC), an alternating current stabilized power supply, a direct current stabilized power supply, a DC/DC converter and the like, and the functional differences mainly depend on a circuit topology structure and component configuration. To protect the internal circuitry from mechanical damage, dust or moisture, the power supply typically encapsulates the PCB within a metal or plastic housing. However, the power supply generates heat during operation, which can affect its performance and life if not effectively dissipated. The common heat dissipation mode is to provide heat dissipation holes at the upper part of the power supply shell, install heat dissipation fins below the PCB or at the heating element, and transfer heat to the external environment by natural convection. However, the existing structure has two problems, namely, if the layout of the radiating holes is unreasonable or the internal airflow channel is not smooth, hot air can be remained near the radiating holes, so that local temperature rise is too high, and the radiating holes are directly communicated with the external and internal electrified components, so that the risk of invasion of foreign matters exists, short circuit or electric shock accidents can be caused, and potential safety hazards are formed for children in particular. Therefore, it is necessary to optimize the heat dissipation and protection structure of the existing power adapter, and enhance the foreign matter invasion prevention and electrical safety performance while guaranteeing the heat dissipation efficiency, thereby improving the reliability and user safety of the product. Disclosure of Invention Aiming at the prior heat dissipation structure, the upper part of the power supply shell is provided with a heat dissipation hole, and a heat dissipation sheet is arranged below the PCB or at the heating element, the heat is transferred to the external environment by utilizing natural convection, the technical problems that the heat dissipation efficiency is poor and potential safety hazards are easy to cause exist are solved, and the technical scheme adopted by the invention is as follows: The heat dissipation structure comprises a shell, wherein the shell is provided with an inner cavity, heat dissipation holes respectively communicated with the inner cavity and the outside, and a radiator positioned in the inner cavity, the heat dissipation holes comprise a first heat dissipation hole close to the inner cavity, a second heat dissipation hole far away from the inner cavity, and a heat dissipation channel positioned between the first heat dissipation hole and the second heat dissipation hole, the radiator comprises a heat dissipation layer positioned in the inner cavity, and a heat dissipation end connected with the heat dissipation layer and extending towards the direction of the heat dissipation channel, and the heat dissipation end extends into the direction of the second heat dissipation hole from the first heat dissipation hole so that the radiator is connected with the shell; The radiator is integrally formed, the radiating layer is connected to the inner side of the radiating hole along the first direction, the heat conductivity of the radiator is larger than that of the shell, at least part of the radiator is made of metal materials, and at least part of the shell is made of plastic materials. Further, in some embodiments of the invention, the end of the heat dissipating end does not protrude beyond the highest position of the outer surface of the housing. Further, in some embodiments of the present invention, an end surface of the second heat dissipation hole is flush with or is located inside an outer surface of the housing, and an extension distance of the heat dissipation end along the first direction is less than or equal to a distance between the first heat dissipation hole and the housing end surface along the first direction. Further, in some embodiments of the present invention, the extension distance of the heat dissipation end is less than or equal to the extension length of the heat dissipation channel, and the end height of the heat dissipation end is less than or equal to the height of the second heat dissipation hole. Further, in some embodiments of the present invention, the projection of the heat dissipation hole is in an arc or po