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CN-122028373-A - Heat dissipating device, electronic device and temperature control pad control device

CN122028373ACN 122028373 ACN122028373 ACN 122028373ACN-122028373-A

Abstract

The heat dissipation device and the temperature control pad control device or the electronic device adopting the heat dissipation device comprise an A box body, an A heat dissipation sheet and an A1 temperature sensor, wherein the inside of the A box body comprises an A liquid accommodating cavity, the A liquid accommodating cavity is used for accommodating liquid, the A box body comprises a heat dissipation installation part, the heat dissipation installation part is used for being in contact with an external surface to be dissipated, the area of the heat dissipation installation part is S1, the A1 temperature sensor is arranged on the A box body and is used for acquiring the temperature of the A box body, the A heat dissipation sheet is arranged or fixedly arranged on the outer surface of the A box body, the area of a contact part of the A heat dissipation sheet and the A box body is S2, S2 is more than 2 times S1, the volume of the A liquid accommodating cavity is more than S1 multiplied by 10 mm, and in a use state, the volume ratio of the liquid accommodated in the A liquid accommodating cavity is more than 50%, and the liquid accommodated in the A liquid accommodating cavity is not subjected to gas-liquid mutual conversion.

Inventors

  • LIANG JIAYI
  • Liang Deyun
  • LI DAJUN

Assignees

  • 深圳市品学优技术有限公司

Dates

Publication Date
20260512
Application Date
20260318

Claims (10)

  1. 1. A heat dissipating double-fuselage, is used for the electronic equipment to dispel the heat, characterized by that, include A box, A fin, A1 temperature sensor; The inner part of the box A comprises a liquid containing cavity A, and the liquid containing cavity A is used for containing liquid; The heat radiation installation part is used for contacting with an external surface to be radiated, the area of the heat radiation installation part is S1, and an A1 temperature sensor is arranged on the A box and used for acquiring the temperature of the A box; The radiating fins A are arranged or fixedly arranged on the outer surface of the box A, and the area of the contact part of the radiating fins A and the box A is S2, and S2 is more than 2 times S1; The volume of the liquid containing cavity A is larger than S1×10mm; In a use state, the volume ratio of liquid filled in the liquid containing cavity A is more than 50%, and the liquid contained in the liquid containing cavity A does not undergo gas-liquid interconversion.
  2. 2. The heat sink of claim 1, wherein, Also includes any one or more of the following features, The heat radiation installation part comprises a hole, wherein the outer surface to be radiated covers the hole, and the outer surface to be radiated is connected with the heat radiation installation part through a sealing gasket or sealant; the heat dissipation device is characterized by further comprising a temperature equalization plate, wherein the temperature equalization plate covers the heat dissipation installation part, and the surface to be dissipated outside is contacted with the temperature equalization plate, the area of the temperature equalization plate is S3, and the area S3 is larger than S1; The heat radiation installation part is positioned at the lower part of the box A, and the heat radiation fin A is arranged at the upper part of the box A; The device is characterized by comprising a TA31, an A2 temperature sensor, an A1 temperature sensor, an A2 temperature sensor, a temperature sensor and a temperature sensor, wherein the A1 temperature sensor is arranged at the lower part of an A box body; The characteristic TA40 is that the radiating fin A and the box A are integrally formed, and the area of the connecting part of the radiating fin A and the box A is S1; The characteristic TA50 is that the box A is wholly or partially made of metal materials; The characteristic TA60 is that the liquid is water; The characteristic TA61 is that the liquid is water, and antifreezing solution is added into the water; The liquid is heat conduction oil, ‌ hydrogenated terphenyl, silicone oil, ‌ liquid paraffin or glycerol; The characteristic TA70 is that the box A comprises at least one liquid inlet which is connected with a water inlet pipe of the flexible pipeline; The volume ratio of liquid filled in the liquid containing cavity A is less than 95%.
  3. 3. The heat dissipating device of claim 1 or 2, further comprising an a air duct, wherein part or all of the a heat sink is located in the a air duct, wherein the a air duct comprises an A1 air duct opening, an A2 air duct opening; also includes any one or more of the following features, The characteristic TB10 is that the setting position of the A2 air duct opening is higher than the A1 air duct opening, the internal air is heated in a use state and is discharged from the A2 air duct opening, and the external air enters the A air duct from the A1 air duct opening; The characteristic TB20 also comprises an A2 fan, wherein the A2 fan is arranged at the A1 air duct opening or the A2 air duct opening; The characteristic TB21 also comprises an A2 fan, wherein the A2 fan is arranged at the A1 air duct opening or the A2 air duct opening, the temperature of the A box body is obtained through an A1 temperature sensor or the A2 temperature sensor, and the rotating speed of the A2 fan is controlled according to the temperature; and the characteristic TB30 is that part or all of the box A is positioned in the air duct A.
  4. 4. The heat sink according to claim 1 or 2, wherein; The cooling device further comprises an A1 fan, wherein the A1 fan is used for guiding air to the A cooling fins, the temperature of the A box body is obtained through an A1 temperature sensor or an A2 temperature sensor, and the rotating speed of the A1 fan is controlled according to the temperature.
  5. 5. The heat dissipating device of claim 1 or 2, further comprising an a liquid pump, an a water pipe, wherein the a liquid pump is disposed in the a liquid containing cavity; the characteristic TC10 is that the A liquid pump is arranged at the bottom of the A liquid accommodating cavity, and the other end of the A water pipe is positioned at the upper part of the A liquid accommodating cavity; the characteristic TC20 is that an A liquid accommodating cavity in the A box body is not rectangular, the A water pipe is bent for one or more times, and the other end of the A water pipe is positioned at the far end of the A liquid accommodating cavity; and the characteristic TC30 is that the temperature of the box A is obtained through an A1 temperature sensor or the A2 temperature sensor, and the starting or/and the rotating speed of the liquid pump A are controlled according to the temperature.
  6. 6. An electronic device is characterized by comprising a radiating surface and the radiating device of any one of claims 1 to 5, wherein the radiating surface is correspondingly arranged with a radiating installation part of an A box body; Including any one or more of the following features, The characteristic TE10 is that the radiating surface is the upper surface of the CPU; The characteristic TE20 is that the radiating surface is a radio frequency component shielding shell of the communication base station; the electronic device is part or all of a communication base station; the characteristic TE40 is that the A box body is a shell of the electronic device; and the characteristic TE50 is that the box A is a display screen shell of a notebook computer.
  7. 7. A temperature control pad control device is characterized by comprising a semiconductor refrigeration sheet, a B liquid pump, a temperature control box and a B1 temperature sensor, wherein the B1 temperature sensor is arranged on the outer surface of the temperature control box or in the box body, the B liquid pump and the temperature control box are communicated with an external water blanket through pipelines, the refrigeration end face of the semiconductor refrigeration sheet is arranged on the temperature control box, the temperature of liquid in the temperature control box is obtained through the B1 temperature sensor, the other end face of the semiconductor refrigeration sheet is provided with a heat dissipation device, the B1 temperature is obtained through the B1 temperature sensor, and the opening or the output power of the semiconductor refrigeration sheet is controlled through the B1 temperature.
  8. 8. The temperature control pad control device according to claim 7, further comprising a B2 temperature sensor, wherein the B2 temperature sensor is mounted on the outer surface of the temperature control box or inside the box body, the B2 temperature sensor obtains a B2 temperature, and the opening or the output power of the semiconductor refrigerating sheet is controlled according to the B2 temperature and/or the B1 temperature, or whether the equipment operates normally is judged according to the difference between the B2 temperature and the B1 temperature; the heat dissipation device is the heat dissipation device according to any one of claims 1 to 6, and the end face of the semiconductor refrigeration piece is arranged on the box A; or the system also comprises an environment temperature sensor, wherein the environment temperature sensor is used for acquiring an environment temperature value and controlling the working strength of the liquid B pump according to the absolute temperature difference between the environment temperature value and the target temperature.
  9. 9. A temperature control pad control device is characterized by comprising a semiconductor refrigerating sheet, a liquid pump B, a temperature control box and a heat dissipation device, wherein the liquid pump B and the temperature control box are communicated with an external water blanket through pipelines, the refrigerating end face of the semiconductor refrigerating sheet is arranged on the temperature control box, the heat dissipation device is the heat dissipation device according to any one of claims 1 to 6, and one end face of the semiconductor refrigerating sheet is arranged on an A box body.
  10. 10. The temperature control pad control device according to claim 9, wherein a temperature of an a box is obtained by an A1 temperature sensor or the A2 temperature sensor, and the opening of the A1 fan or the rotational speed of the fan is controlled according to the temperature; or obtaining the temperature of the box A through the temperature sensor A1 or the temperature sensor A2, and controlling the opening of the fan A2 or the rotating speed of the fan according to the temperature.

Description

Heat dissipating device, electronic device and temperature control pad control device Technical Field The invention relates to a heat dissipating device, an electronic device using the heat dissipating device and a temperature control pad control device. Background In the prior art, in the normal operation process of the electronic equipment, a heat dissipation device or a heat dissipation system is required to maintain the operation temperature of the electronic equipment. In a large computer room, a complex liquid cooling system is adopted, the liquid cooling system has a complex structure and numerous components, and huge cost expenditure and operation cost are required for production, deployment and maintenance. In desktop computers or notebook computers for home use or office use, liquid cooling systems based on a heat pipe technology and a fan have been widely adopted, and in the heat pipe technology, liquid in a copper pipe is vaporized to take away heat, and then is liquefied, that is, gas-liquid conversion is adopted to conduct heat and dissipate heat. However, in the heat pipe radiating device, the contact area between the heat pipe and the part to be radiated is small, the radiating power of a single radiating pipe is small, a radiating part is formed by combining a plurality of heat pipes, the workload in the design verification process is large, the requirements on design personnel are high, and meanwhile, the manufacturing of the heat pipes requires a vacuum environment, is difficult to manufacture and has high use cost. In the application scenario of a desktop computer or a notebook computer, the development of a heat dissipation technology is fast, a liquid cooling system of a heat pipe technology and a fan is basically adopted, a user is dissatisfied with noise, and no better solution exists at present. The heat pipe technology adopted on the current common computer is difficult to control the noise below 30dB under the heat dissipation power of about 200 watts. However, in many application scenarios, the temperature of the object to be cooled needs to be controlled below 60 ℃, and it is difficult to achieve heat dissipation of about 200 watts under a 30dB noise condition under 60 ℃ under a reasonable cost condition by adopting a heat pipe technology. Example 1 Heat pipe technology plus fan cooling, a 285W power dissipation processor can be supported, the full load temperature is controlled within 92 ℃, and in the performance mode, the full load noise is 63.3dB. This example may support heat dissipation for 285W power consuming processors. However, the full load noise is too high, and the temperature can be controlled to 92 ℃ or so. Example 2 four heat pipe direct contact technology, 46 mm pure copper heat pipes are adopted, and the heat pipes are in direct contact with a CPU, so that heat can be conducted rapidly. The fan with the maximum rotating speed of 1800RPM is equipped with a fan with the maximum rotating speed of 120mm multiplied by 25mm, the maximum air quantity reaches 62CFM, the noise value is only 27dBA, and compared with the noise, the fan with the maximum rotating speed is low in air quantity. 150W power consumption test the CPU temperature can be controlled at about 80 ℃ under 150W power consumption. At 180W power consumption, the CPU temperature reached 92 ℃. The noise can be controlled to 27dBA, the temperature reaches about 92 ℃, and the requirements cannot be met. In a scenario where a liquid medium is used for temperature control of a mat, the user uses the apparatus while sleeping, and the user wants to have no noise, and the operating noise requirements for the heat sink are very high, and such apparatus is placed at the head of a bed, and the volume of the apparatus is also required. Both the above two heat dissipation modes cannot meet the requirements. The amount of noise that a person can accept while sleeping varies from person to person, and overall, less than ‌ db is an ideal sleeping environment, exceeding 40 db may begin to affect sleep quality, and more than 50 db may cause interference ‌ to most people. However, different people have obvious differences in noise tolerance due to differences in physiological characteristics, living habits and psychological states. And analyzing the noise tolerance degree of crowd layering, wherein the noise tolerance degree is different for different crowds. 1.‌ Infant and children ‌ tolerance threshold ‌ is less than or equal to 30 dB, infant is in the environment of about 40-50 dB (such as mother heartbeat and blood flow sound) in the mother, but is extremely sensitive to sudden sound after birth. Studies have shown that continuous noise above ‌ db can affect 10% of adolescents' sleep ‌, while sudden noise of ‌ db can wake 70% of children ‌. 2.‌ Adults, ordinary healthy people and ‌ comfort range ‌:30-40 dB, most adults sleep most stably in an environment with ‌ lower than 30 dB ‌, which is equivalent to library page turni